Influence of Subharmonics on Megasonic Cleaning

2019 ◽  
Vol 25 (5) ◽  
pp. 319-325 ◽  
Author(s):  
Ayumi Higuchi
Keyword(s):  
Megasonic Cleaning

Particle removal from semiconductor wafers by megasonic cleaning

1996 ◽  
Vol 27 ◽  
pp. S427-S428 ◽  
Author(s):  
T.H. Kuehn ◽  
D.B. Kittelson ◽  
Y. Wu ◽  
R. Gouk
Keyword(s):  
Particle Removal ◽  
Megasonic Cleaning

High Efficiency Single Wafer Cleaning for Wafer Bonding-Based 3D Integration Applications

2012 ◽  
Vol 187 ◽  
pp. 269-272 ◽  
Author(s):  
Don Dussault ◽  
F. Fournel ◽  
V. Dragoi
Keyword(s):  
Removal Efficiency ◽  
Wafer Bonding ◽  
High Efficiency ◽  
Current Work ◽  
Particle Removal ◽  
3D Integration ◽  
Production Scale ◽  
Megasonic Cleaning ◽  
Wafer Cleaning ◽  
Transducer Design

Current work describes development, testing and verification of a single wafer megasonic cleaning method utilizing a transducer design that meets the extreme particle neutrality, Particle Removal Efficiency (PRE), and repeatability requirements of production scale wafer bonding and other applications requiring extremely low particle levels.

Effect of Acoustic Cavitation on Dissolved Gases and their Characterization during Megasonic Cleaning

2019 ◽  
Vol 41 (5) ◽  
pp. 101-107 ◽  
Author(s):  
Bong-Kyun Kang ◽  
Min-Su Kim ◽  
Seung-Ho Lee ◽  
Hongseong Sohn ◽  
Jin-Goo Park
Keyword(s):  
Acoustic Cavitation ◽  
Dissolved Gases ◽  
Megasonic Cleaning

Slurry Residue Removal in Post Chemical Mechanical Polishing

1999 ◽  
Author(s):  
Ahmed A. Busnaina ◽  
Naim Moumen
Keyword(s):  
Chemical Mechanical Polishing ◽  
Silicon Wafers ◽  
Mechanical Polishing ◽  
Operating Conditions ◽  
Cleaning Process ◽  
Megasonic Cleaning ◽  
Residue Removal ◽  
Particulate Contamination

Abstract The megasonic cleaning process proved to be an essential process in cleaning silicon wafers after processes such as pre-oxidation, pre-CVD, pre-EPI, post-ASH and lately post-CMP. Current post-CMP cleans are contact cleaning techniques. These contact techniques have a low throughput and may cause wafer scratching. In addition, in contact cleaning, brush shedding which occurs under many operating conditions causes additional particulate contamination. There is a need for an effective post-CMP cleaning process. Megasonic cleaning provides the best alternative or compliment to brush clean.

The importance of control over bubble size distribution in pulsed megasonic cleaning

2012 ◽  
Author(s):  
Marc Hauptmann ◽  
Herbert Struyf ◽  
Paul Mertens ◽  
Marc Heyns ◽  
Stefan De Gendt ◽  
...  
Keyword(s):  
Size Distribution ◽  
Bubble Size ◽  
Bubble Size Distribution ◽  
Megasonic Cleaning

Damage Clustering and Damage-Size Distributions After Megasonic Cleaning

2019 ◽  
Vol 11 (2) ◽  
pp. 87-93 ◽  
Author(s):  
Cinzia De Marco ◽  
Kurt L. Wostyn ◽  
Twan Bearda ◽  
Ken-Ichi Sano ◽  
Karine Kenis ◽  
...  
Keyword(s):  
Size Distributions ◽  
Megasonic Cleaning
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