Tailoring Copper Island Density for Copper Plating on a RuTa Substrate

2019 ◽  
Vol 28 (29) ◽  
pp. 9-16 ◽  
Author(s):  
Magi Nagar ◽  
Philippe M. Vereecken ◽  
Aleksandar Radisic ◽  
Katrien Strubbe
Keyword(s):  
Copper Plating ◽  
Island Density

Electroless Copper Plating of Titanium Condenser Tubes for Biofouling Control

2016 ◽  
Vol 6 (1) ◽  
pp. 65-73
Author(s):  
Balakrishnan Anandkumar ◽  
Rani P. George ◽  
Alagarsamy Karthik ◽  
Dasnamoorthy Ramachandran ◽  
Uthandi Kamachi Mudali
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper ◽  
Biofouling Control

Novel fabrication of low-cost Ti–Cu alloy by electroless copper plating and vacuum sintering

Vacuum ◽  
2021 ◽  
pp. 110330
Author(s):  
Chunming Wang ◽  
Luming Zeng ◽  
Wucheng Ding ◽  
Tongxiang Liang
Keyword(s):  
Low Cost ◽  
Copper Plating ◽  
Vacuum Sintering ◽  
Electroless Copper Plating ◽  
Cu Alloy ◽  
Electroless Copper

Initial propagation stage of direct copper plating on non-conducting substrates

1999 ◽  
Vol 44 (21-22) ◽  
pp. 3697-3705 ◽  
Author(s):  
Sachiko Ono ◽  
Kazuhisa Naitoh ◽  
Tetsuya Osaka
Keyword(s):  
Copper Plating ◽  
Propagation Stage

New and clean strategy for the determination of Cu2+ in electroless copper plating baths

2007 ◽  
Vol 68 (1) ◽  
pp. 150-155 ◽  
Author(s):  
Rutao Liu ◽  
Wansong Zong ◽  
Canzhu Gao ◽  
Zhenxing Chi ◽  
Lijun Zhang
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper
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