Air-plasma surface modification of epoxy resin substrate to improve electroless copper plating of printed circuit board

Vacuum ◽  
2019 ◽  
Vol 170 ◽  
pp. 108967 ◽  
Author(s):  
Yan Hong ◽  
Xiangqing You ◽  
Yi Zeng ◽  
Yuanming Chen ◽  
Yunzhong Huang ◽  
...  
Keyword(s):  
Surface Modification ◽  
Epoxy Resin ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Copper Plating ◽  
Air Plasma ◽  
Electroless Copper Plating ◽  
Plasma Surface ◽  
Printed Circuit ◽  
Electroless Copper

Direct Electroless Copper Plating on Polyimide for FPCB Applications

2007 ◽  
Vol 544-545 ◽  
pp. 709-712 ◽  
Author(s):  
Jae Ho Lee
Keyword(s):  
Electroless Plating ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Copper Plating ◽  
Optimum Conditions ◽  
Electroless Copper Plating ◽  
Additive Process ◽  
Copper Line ◽  
Electroless Copper ◽  
Copper Seed Layer

As electronic devices are getting smaller and lighter, the density of copper lines on flexible printed circuit board (FPCB) is getting higher. Conventionally, subtractive method was used for copper line on a flexible films, however, as the line pitch is getting smaller, the lateral etching of copper cause serious problem. To replace the subtractive method, semi-additive method was used for fine pitch copper line fabrication. In semi additive process, sputtered layer for the electroplating copper was required. The feasibility of electroless plating to replace high cost sputtered copper seed layer was investigated. Electroless depositions of copper were conducted on different substrate to find optimum conditions of electroless copper plating. To find optimum conditions, the effects and selectivity of activation method on several substrates were also investigated. The adhesion strength between polyimide and copper was improved by treating the polyimide surface with butylamines. Pretreatment prior to electroless plating is very sensitive and surface dependent. Surface morphologies were investigated with FESEM.

Surface modification of ABS by photocatalytic treatment for electroless copper plating

2013 ◽  
Vol 28 (5) ◽  
pp. 499-511 ◽  
Author(s):  
Wenxia Zhao ◽  
Qian Ma ◽  
Lisha Li ◽  
Xirong Li ◽  
Zenglin Wang
Keyword(s):  
Surface Modification ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper

Novel Method for Recycle Epoxy Resin from Waste Printed Circuit Board

2014 ◽  
Vol 931-932 ◽  
pp. 90-94 ◽  
Author(s):  
Rapeephun Dangtungee ◽  
Suchart Siengchin ◽  
Chaisiri Kitpaosong
Keyword(s):  
Epoxy Resin ◽  
Printed Circuit Board ◽  
Functional Group ◽  
Maximum Yield ◽  
Solvent System ◽  
High Viscosity ◽  
Circuit Board ◽  
Printed Circuit ◽  
Waste Printed Circuit Board ◽  
Tank System

This research was aimed to study and develop a method for recycle epoxy resin from waste printed circuit board by hot solvent methods and DMSO/NaOH catalytic extraction method. It was found that the pressure tank system, sub set of hot solvent method, variable as following; pressure of 15 bar, temperature of 80 °C, reaction time for 6 h and ethyl acetate solvent presented maximum yield 50.46 %, while DMSO/NaOH catalytic system at 145 °C for 5 h was found maximum yield of 42.97 %. Recycled epoxy resin, the final product from hot solvent and DMSO/NaOH catalytic were showed similarly clear orange-yellow high viscosity. Comparatively, DMSO/NaOH system showed slightly darker color than that of hot solvent system. Functional group at 3000-2850, 1480-1540 and 1020-1040 cm-1, characterized from Fourier transform infrared spectroscopy (FT-IR), indicated that the both product were alkane, aromatic, and phenyl-O-C group, respectively. It could be confirmed that the beneficial functional group of recycled epoxy resin was appeared as a new epoxy resin.

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