Contact Probe Card with Large Overdrive

2019 ◽  
Vol 33 (21) ◽  
pp. 57-67
Author(s):  
Gunsei Kimoto ◽  
Takehiro Watanabe ◽  
Souta Matsusaka ◽  
Takaharu Kuroda ◽  
Mikiko Saito
Keyword(s):  
Contact Probe ◽  
Probe Card

New Development of Contact Probe and Methodology

2010 ◽  
Vol 126-128 ◽  
pp. 726-731 ◽  
Author(s):  
Gunsei Kimoto ◽  
Takehiro Watanabe ◽  
Souta Matsusaka ◽  
Akio Inoue ◽  
Takaharu Kuroda
Keyword(s):  
Mechanical Characteristics ◽  
Electrical Contact ◽  
Theoretical Studies ◽  
Electrical Contact Resistance ◽  
Contact Probe ◽  
High Durability ◽  
New Development ◽  
New Type ◽  
Probe Card ◽  
Resin Film

We present a new type of wafer probe card with resin film consisting of two beams. Resin film is embedded on both sides of the probe beam, having a thickness of 4 [μm] and made from polyimide. This proposed probe enables compliant structures with large overdrive to ensure high durability of the structure and controllable scrub motion to assure cleaning process. In this study, Matrix method is introduced for theoretical studies of the probe structure and commercial finite element code is used. Electrical contact resistance is determined by theoretical studies based on Holm's theory and experimentally by　our measurement instrumentation respectively. The structure is proven theoretically to get appropriate scrub motion when it undergoes a large overdrive with preferable exhibited contact force. Moreover, all of these mechanical characteristics can be varied to know the values of the character of probes. The methodology having one of the most preferable characters of the contact-probe had been achieved.

Design and fabrication of a highly manufacturable MEMS probe card for high speed testing

2008 ◽  
Vol 18 (7) ◽  
pp. 075031 ◽  
Author(s):  
Bong-Hwan Kim ◽  
Jong-Bok Kim
Keyword(s):  
High Speed ◽  
Probe Card

Multi-layer probe card design with signal/power integrity for wafer-level AP test in LPDDR4 channel

2016 ◽  
Author(s):  
Jinwook Song ◽  
Jonghoon Kim ◽  
Shinyoung Park ◽  
Eunjung Lee ◽  
Joungho Kim ◽  
...  
Keyword(s):  
Signal Power ◽  
Power Integrity ◽  
Wafer Level ◽  
Probe Card

Systematic Signal Integrity Analysis on Fine Pitch Probe Card for HBM Interposer Testing

2021 ◽  
Author(s):  
Li Kangrong ◽  
Ratan Bhimrao Umralkar
Keyword(s):  
Signal Integrity ◽  
Fine Pitch ◽  
Probe Card ◽  
Integrity Analysis

A Novel Dynamic Compensation Method for a Contact Probe Based on Bayesian Inversion

Measurement ◽  
2021 ◽  
pp. 110143
Author(s):  
Wen-Shu Jiang ◽  
Zhen-Ying Cheng ◽  
Wen-Chao Gong ◽  
Li Yu ◽  
Rui-Jun Li ◽  
...  
Keyword(s):  
Compensation Method ◽  
Bayesian Inversion ◽  
Dynamic Compensation ◽  
Contact Probe
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