Formation of Dendrite-Like Defect during PR-Mask Silicon Oxide Wet Etching Process and Its Removal Method

2013 ◽  
Vol 2 (11) ◽  
pp. P97-P100
Author(s):  
M.-G. Song ◽  
B. U. Yoon ◽  
K.-T. Lee ◽  
S.-Y. Choi
Keyword(s):  
Silicon Oxide ◽  
Wet Etching ◽  
Etching Process ◽  
Removal Method

Simple Microcantilever Release Process of Silicon Piezoresistive Microcantilever Sensor Using Wet Etching

2014 ◽  
Vol 660 ◽  
pp. 894-898
Author(s):  
Rosminazuin A. Rahim ◽  
Badariah Bais ◽  
Majlis Burhanuddin Yeop
Keyword(s):  
Final Stage ◽  
Silicon Oxide ◽  
Simple Technique ◽  
Anisotropic Etching ◽  
Wet Etching ◽  
Etching Process ◽  
The Other ◽  
Release Process ◽  
Oxide Etching ◽  
Etch Stop

In this paper, a simple microcantilever release process using anisotropic wet etching is presented. The microcantilever release is conducted at the final stage of the fabrication of piezoresistive microcantilever sensor. Issues related to microcantilever release such as microscopic roughness and macroscopic roughness has been resolved using simple technique. By utilizing silicon oxide (SiO2) as the etch stop for the wet etching process, issues related to microscopic roughness can be eliminated. On the other hand, proper etching procedure with constant stirring of the etchant solution of KOH anisotropic etching significantly reduces the notching effect contributed by the macroscopic roughness. Upon the completion of microcantilever release, suspended microcantilever of 2μm thick is realized with the removal of SiO2layer using Buffered Oxide Etching (BOE).

A Study on the Removal Method of Si Residue during Si Wet Etching

2013 ◽  
Vol 58 (6) ◽  
pp. 57-61
Author(s):  
K. Ko ◽  
H. Jeon ◽  
M. Song ◽  
J. Han ◽  
B. Yoon ◽  
...  
Keyword(s):  
Wet Etching ◽  
Removal Method

Photosensitive terpolymer for all-wet-etching process: Material characterization and device fabrication

2010 ◽  
Vol 518 (8) ◽  
pp. 2147-2151
Author(s):  
Abderrafia Moujoud ◽  
Sungho Kang ◽  
Hyun Jae Kim ◽  
Mark Andrews
Keyword(s):  
Material Characterization ◽  
Device Fabrication ◽  
Wet Etching ◽  
Etching Process ◽  
Process Material

LiTaO3 Recording Media Prepared by Polarization Controlled Wet Etching Process

2004 ◽  
Vol 68 (1) ◽  
pp. 221-228
Author(s):  
YOSHIOMI HIRANAGA ◽  
YASUO WAGATSUMA ◽  
YASUO CHO
Keyword(s):  
Wet Etching ◽  
Etching Process ◽  
Recording Media

Novel method of fabricating Fabry-Perot cavity employing MEMS wet-etching process

2004 ◽  
Author(s):  
Min Xiang ◽  
Yanmin Cai ◽  
Yaming Wu ◽  
Jianyi Yang ◽  
Yuelin Wang
Keyword(s):  
Wet Etching ◽  
Etching Process ◽  
Fabry Perot ◽  
Novel Method

Characteristics on the Gate Insulator of Metal Tip Field Emitter Arrays after Wet Etching Process

1997 ◽  
Vol 36 (Part 1, No. 6A) ◽  
pp. 3576-3579
Author(s):  
Yu Ho Jung ◽  
Byeong Kwon Ju ◽  
Jae Hoon Jung ◽  
Yun Hi Lee ◽  
Myung Hwan Oh ◽  
...  
Keyword(s):  
Wet Etching ◽  
Etching Process ◽  
Gate Insulator ◽  
Field Emitter ◽  
Field Emitter Arrays ◽  
Metal Tip
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