High-Strength Electroplated Au–Cu Alloys as Micro-Components in MEMS Devices

2017 ◽  
Vol 164 (4) ◽  
pp. D244-D247 ◽  
Author(s):  
Haochun Tang ◽  
Chun-Yi Chen ◽  
Masaharu Yoshiba ◽  
Takashi Nagoshi ◽  
Tso-Fu Mark Chang ◽  
...  
Keyword(s):  
High Strength ◽  
Mems Devices ◽  
Cu Alloys

Mechanical Properties of Nanocrystalline Materials Produced by In Situ Consolidation Ball Milling

2008 ◽  
Vol 579 ◽  
pp. 15-28 ◽  
Author(s):  
Carl C. Koch ◽  
Khaled M. Youssef ◽  
Ron O. Scattergood
Keyword(s):  
Mechanical Properties ◽  
Ball Milling ◽  
Nanocrystalline Materials ◽  
Preparation Method ◽  
High Strength ◽  
Al Alloys ◽  
Ductile Metals ◽  
Cu Alloys ◽  
Bulk Nanocrystalline

This paper reviews a method, “in situ consolidation ball milling” that provides artifactfree bulk nanocrystalline samples for several ductile metals such as Zn, Al and Al alloys, and Cu and Cu alloys. The preparation method is described in this paper and examples of the mechanical behavior of nanocrystalline materials made by this technique are given. It is found that in such artifact-free metals, combinations of both high strength and good ductility are possible.

Effect of Alloying Elements on the Strength and Casting Characteristics of High Strength Al-Zn-Mg-Cu Alloys

2005 ◽  
pp. 2539-2542
Author(s):  
Ki Tae Kim ◽  
Jeong Min Kim ◽  
Ki Dug Sung ◽  
Joong Hwan Jun ◽  
Woon Jae Jung
Keyword(s):  
High Strength ◽  
Alloying Elements ◽  
Cu Alloys ◽  
Effect Of Alloying

Key Microstructural Features Responsible for Improved Stress Corrosion Cracking Resistance and Weldability in 7xxx Series Al Alloys Containing Micro / Trace Alloying Additions

2006 ◽  
Vol 519-521 ◽  
pp. 315-320 ◽  
Author(s):  
A.K. Mukhopadhyay ◽  
K. Satya Prasad ◽  
Vikas Kumar ◽  
G. Madhusudhan Reddy ◽  
S.V. Kamat ◽  
...  
Keyword(s):  
Quantitative Data ◽  
Microstructural Analysis ◽  
High Strength ◽  
Al Alloys ◽  
The Other ◽  
Alloying Additions ◽  
Cu Alloys ◽  
Medium Strength ◽  
Retrogression And Reaging ◽  
Peak Aged

The commercial 7xxx series Al alloys are based on medium strength Al-Zn-Mg and high strength Al-Zn-Mg-Cu systems. The medium strength alloys are weldable, whilst the high strength alloys are nonweldable. On the other hand, the Cu-free, weldable alloys suffer from poor SCC resistance. It is the purpose of this article to provide quantitative data and microstructural analysis to demonstrate that small additions of either Ag or Sc to Al-Zn-Mg and Al-Zn-Mg-Cu alloys bring about very significant improvement in SCC resistance and weldability, respectively. The improvement in SCC resistance of the Cu-bearing alloys due to over aging and retrogression and reaging (RRA) is further discussed in light of a similar improvement in the SCC resistance of these alloys, when peak aged, due to Ag and Sc additions.

Investigation of quench sensitivity of high strength Al–Zn–Mg–Cu alloys by time–temperature-properties diagrams

2010 ◽  
Vol 31 (6) ◽  
pp. 3116-3120 ◽  
Author(s):  
Shengdan Liu ◽  
Qimin Zhong ◽  
Yong Zhang ◽  
Wenjun Liu ◽  
Xinming Zhang ◽  
...  
Keyword(s):  
High Strength ◽  
Quench Sensitivity ◽  
Cu Alloys

Mesoscopic Structure of Super-High Strength P/M Al-Zn-Mg-Cu Alloys

1996 ◽  
Vol 217-222 ◽  
pp. 1829-1834 ◽  
Author(s):  
Kozo Osamura ◽  
Kazuhide Kohno ◽  
Hiroshi Okuda ◽  
Shouichi Ochiai ◽  
Jun Kusui ◽  
...  
Keyword(s):  
High Strength ◽  
Cu Alloys ◽  
Mesoscopic Structure

scholarly journals Interpretation of Specific Strength-Over-Resistivity Ratio in Cu Alloys

Materials ◽  
2021 ◽  
Vol 14 (23) ◽  
pp. 7150
Author(s):  
Hongming Li ◽  
Shuang Zhang ◽  
Yajun Zhao ◽  
Xiaona Li ◽  
Fushi Jiang ◽  
...  
Keyword(s):  
Electrical Resistivity ◽  
Lower Limit ◽  
High Strength ◽  
Alloy System ◽  
Resistivity Ratio ◽  
Specific Strength ◽  
Cu Alloys ◽  
The Matrix ◽  
In Series ◽  
Pure Cu

Reaching simultaneously high mechanical strength and low electrical resistivity is difficult as both properties are based on similar microstructural mechanisms. In our previous work, a new parameter, the tensile strength-over-electrical resistivity ratio, is proposed to evaluate the matching of the two properties in Cu alloys. A specific ratio of 310 × 108 MPa·Ω−1·m−1, independent of the alloy system and thermal history, is obtained from Cu-Ni-Mo alloys, which actually points to the lower limit of prevailing Cu alloys possessing high strength and low resistivity. The present paper explores the origin of this specific ratio by introducing the dual-phase mechanical model of composite materials, assuming that the precipitate particles are mechanically mixed in the Cu solid solution matrix. The strength and resistivity of an alloy are respectively in series and parallel connections to those of the matrix and the precipitate. After ideally matching the contributions from the matrix and the precipitate, the alloy should at least reach half of the resistivity of pure Cu, i.e., 50%IACS, which is the lower limit for industrially accepted highly conductive Cu alloys. Under this condition, the specific 310 ratio is related to the precipitate-over-matrix ratios for strength and resistivity, which are both two times those of pure Cu.

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