Site Specific and High Spatial Resolution Scanning Spreading Resistance Microscopy and Its Applications in Si Technology

1998 ◽  
Vol 41 (2) ◽  
pp. 489-495 ◽  
Author(s):  
G. B. Senay ◽  
A. D. Ward ◽  
J. G. Lyon ◽  
N. R. Fausey ◽  
S. E. Nokes

2002 ◽  
Vol 717 ◽  
Author(s):  
P. Eyben ◽  
M. Fouchier ◽  
P. Albart ◽  
J. Charon-Verstappen ◽  
W. Vandervorsta

AbstractScanning Spreading Resistance Microscopy (SSRM) is now widely used for two-dimensional doping profiling with high spatial resolution. The need for a high force between the tip and the sample in order to obtain a good electrical contact, leads to a fast degradation of the tip (and the sample) while scanning. Tip damage is mainly due to the shear force occurring while scanning in contact mode at high forces leading to breakage (cleavage) of sharp tips or a rapid increase of tip radius (wear). The latter adversely affects the accuracy of the electrical measurements, as the contact radius is a determining parameter for quantification. The strong abrasive force also necessitates the use of tips composed of very hard material such as doped diamond, which has however a limited resistivity, and so far prevented the use of metallic probes. In addition the high force also prevents the simultaneous acquisition of high quality topography data. The solution to these problems is obtained by implementing the Modulated Force Principle (MFP). The latter consists of applying a variable (for instance pulsed) force while scanning, reducing the force during the lateral movement of the tip and synchronizing the electrical measurements with the high force periods. The latter results in lower lateral forces and introduces a quasi multi point contact mode. MFP also allows to obtain a better topography image by synchronizing the topography measurement with the low force part of the force cycle. The MFP leads to a drastic reduction of the surface and probe damage while maintaining high quality electrical data. The implementation of multiplexed detectors within the force cycle further enables the simultaneous acquisition of spreading resistance and topography during one scan, and/or the combination with multiple linear current detectors, capacitance sensors or tunneling current measurements.


1994 ◽  
Vol 2 (4) ◽  
pp. 9-10
Author(s):  
Farhad Shaapur

Cross-sectioning of microelectronic devices for the purpose of construction or failure analysis by SEM and/or TEM has always been considered a major challenge. The ever increasing complexity and shrinking dimensions of these devices have pushed the art and science of the related specimen preparation beyond their conventional limits. The need for SEM failure analysis of sub-micron elements of a failed device requires the capability of cross-sectioning the sample with a high spatial-resolution within a specific transverse piane. An image of the device structure obtained at sufficiently high magnification from the above specimen generally reveals the defect(s) responsible for the failure. If the imaging resolution and contrast offered by an SEM prove to be inadequate for the above purpose, device structure will be inspected via TEM. Analysis of such device by TEM imposes the additional requirement of back-thinning the above specimen to electron transparency at the site of failure.


Author(s):  
K. Przybylski ◽  
A. J. Garratt-Reed ◽  
G. J. Yurek

The addition of so-called “reactive” elements such as yttrium to alloys is known to enhance the protective nature of Cr2O3 or Al2O3 scales. However, the mechanism by which this enhancement is achieved remains unclear. An A.E.M. study has been performed of scales grown at 1000°C for 25 hr. in pure O2 on Co-45%Cr implanted at 70 keV with 2x1016 atoms/cm2 of yttrium. In the unoxidized alloys it was calculated that the maximum concentration of Y was 13.9 wt% at a depth of about 17 nm. SIMS results showed that in the scale the yttrium remained near the outer surface.


Author(s):  
E. G. Rightor

Core edge spectroscopy methods are versatile tools for investigating a wide variety of materials. They can be used to probe the electronic states of materials in bulk solids, on surfaces, or in the gas phase. This family of methods involves promoting an inner shell (core) electron to an excited state and recording either the primary excitation or secondary decay of the excited state. The techniques are complimentary and have different strengths and limitations for studying challenging aspects of materials. The need to identify components in polymers or polymer blends at high spatial resolution has driven development, application, and integration of results from several of these methods.


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