(Invited) Fabrication of Ge-on-Insulator By Epitaxial Growth and Ion-Implanted Exfoliation for Electronics and Optoelectronics Applications

2021 ◽  
Vol MA2021-02 (30) ◽  
pp. 933-933
Author(s):  
Keisuke Yamamoto ◽  
Dong Wang ◽  
Hiroshi Nakashima
2017 ◽  
Vol 56 (10) ◽  
pp. 105503
Author(s):  
Kiichi Furukawa ◽  
Akinobu Teramoto ◽  
Rihito Kuroda ◽  
Tomoyuki Suwa ◽  
Keiichi Hashimoto ◽  
...  

1982 ◽  
Vol 93 (1-2) ◽  
pp. 179-184 ◽  
Author(s):  
J.S. Williams ◽  
F.M. Adams ◽  
K.G. Rossiter

1981 ◽  
Vol 10 ◽  
Author(s):  
J. S. Williams ◽  
F. M. Adams ◽  
K. G. Rossiter

High resolution ion channelling and reflection electron diffraction techniques have been used to examine details of epitaxial regrowth in Ar+-ion-implanted GaAs(100) at furnace anneal temperatures of 400°C or less. In particular, we have investigated the nature and extent of epitaxial regrowth during both isothermal and isochronal annealing for various implant energies and for implant doses above and below the amorphous threshold. Our results indicate the development of a nonplanar growth interface during annealing which may lead, ultimately, to complex near-surface crystallization processes. Consistently with our observations and recent results from other laboratories, we propose a model for the epitaxial regrowth of amorphous GaAs layers based upon non-uniform growth rates along the amorphous-crystalline interface which could arise from local stoichiometry imbalance.


2009 ◽  
Vol 24 (1) ◽  
pp. 135-139 ◽  
Author(s):  
Q.T. Zhao ◽  
S.B. Mi ◽  
C.L. Jia ◽  
C. Urban ◽  
C. Sandow ◽  
...  

Epitaxial growth of a NiSi2 layer was observed on S+ ion-implanted Si(100) at a low temperature of 550 °C. Depending on the S+ dose and the Ni thickness, we identified different nickel silicide phases. High quality and uniform epitaxial NiSi2 layers formed at temperatures above 700 °C with a 20-nm Ni on high dose S+ implanted Si(100), whereas no epitaxy was observed for a 36-nm Ni layer. We assume that the presence of sulfur at the silicide/Si(100) interface favors the nucleation of the NiSi2 phase. The S atom distributions showed ultrasteep S depth profiles (3 nm/decade) in the silicon, which results from the snow-plow effect during silicidation and the segregation of S to the interface due to the low solubility of S in both Si and the silicide.


2009 ◽  
Vol 38 (9) ◽  
pp. 1926-1930 ◽  
Author(s):  
N.G. Rudawski ◽  
L.R. Whidden ◽  
V. Craciun ◽  
K.S. Jones

1993 ◽  
Vol 95-98 ◽  
pp. 989-994 ◽  
Author(s):  
M. Taniwaki ◽  
M. Yanaba ◽  
Toshimasa Yoshiie ◽  
Yasunori Hayashi

1990 ◽  
Vol 67 (9) ◽  
pp. 4036-4041 ◽  
Author(s):  
Masafumi Taniwaki ◽  
Hideto Koide ◽  
Naoto Yoshimoto ◽  
Toshimasa Yoshiie ◽  
Somei Ohnuki ◽  
...  

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