scholarly journals Power Distribution Synthesis for VLSI

VLSI Design ◽  
1998 ◽  
Vol 7 (1) ◽  
pp. 59-72 ◽  
Author(s):  
Ashok Vittal ◽  
Malgorzata Marek-Sadowska
Keyword(s):  
Power Distribution ◽  
Voltage Drop ◽  
Layout Design ◽  
The Other ◽  
Greedy Heuristics ◽  
Top Down ◽  
Power Distribution Network ◽  
Tree Construction ◽  
Benchmark Instances ◽  
Minimal Area

The synthesis of the power distribution network is an important problem in the layout design of VLSI systems. In this paper we propose novel methods to solve the problem of designing minimal area power distribution nets, while satisfying voltage drop and electromigration constraints. We will see that our methods significantly improve upon current techniques. We propose two novel greedy heuristics for power net design-one based on bottom-up tree construction using greedy merging and the other based on top-down linearly separable partitioning. We test the efficacy of our techniques on benchmark instances. The areas required by our methods on typical instances are significantly smaller than those obtained using previous methods.

scholarly journals The maximum voltage drop in an on-chip power distribution network: analysis of square, triangular and hexagonal power pad arrangements

2014 ◽  
Vol 25 (5) ◽  
pp. 531-551
Author(s):  
TOM CARROLL ◽  
JOAQUIM ORTEGA-CERDÀ
Keyword(s):  
Power Distribution ◽  
Complex Analysis ◽  
Voltage Drop ◽  
Elliptic Functions ◽  
Distribution Networks ◽  
Power Distribution Networks ◽  
Power Distribution Network ◽  
On Chip ◽  
Geometric Arrangements ◽  
Maximum Voltage

A mathematical model of the voltage drop which arises in on-chip power distribution networks is used to compare the maximum voltage drop in the case of different geometric arrangements of the pads supplying power to the chip. These include the square or Manhattan power pad arrangement, which currently predominates, as well as equilateral triangular and hexagonal arrangements. In agreement with the findings in the literature and with physical and SPICE models, the equilateral triangular power pad arrangement is found to minimize the maximum voltage drop. This headline finding is a consequence of relatively simple formulas for the voltage drop, with explicit error bounds, which are established using complex analysis techniques, and elliptic functions in particular.

scholarly journals On an asymptotic formula for the maximum voltage drop in a on-chip power distribution network

2011 ◽  
Vol 23 (2) ◽  
pp. 245-265 ◽  
Author(s):  
MARIA AGUARELES ◽  
JAUME HARO ◽  
JOSEP RIUS ◽  
J. SOLÀ-MORALES
Keyword(s):  
Integrated Circuits ◽  
Asymptotic Formula ◽  
Power Distribution ◽  
Voltage Drop ◽  
Special Functions ◽  
Distribution Networks ◽  
Power Distribution Networks ◽  
Power Distribution Network ◽  
On Chip ◽  
Solutions Of Equations

We present a new asymptotic formula for the maximum static voltage in a simplified model for on-chip power distribution networks of array bonded integrated circuits. In this model the voltage is the solution of the Poisson's equation in an infinite planar domain whose boundary is an array of circular pads of radius ϵ, and we deal with the singular limit ϵ → 0 case. In comparison with approximations that appear in the electronics engineering literature, our formula is more complete, since we have obtained terms up to order ϵ15. A procedure will be presented to compute all the successive terms, which can be interpreted by using multipole solutions of equations involving spatial derivatives of δ-functions. To deduce the formula, we use the method of matched asymptotic expansions. Our results are completely analytical and we make an extensive use of special functions and the Gauss constant G.

Power and Thermal Constraints-Driven Modeling and Optimization for Through Silicon Via-Based Power Distribution Network

2018 ◽  
Vol 140 (4) ◽  
Author(s):  
Weijun Zhu ◽  
Gang Dong ◽  
Yintang Yang
Keyword(s):  
Power Distribution ◽  
Rational Design ◽  
Voltage Drop ◽  
Three Dimensional ◽  
Power Delivery ◽  
Power Distribution Network ◽  
Through Silicon Via ◽  
Power Delivery Network ◽  
Thermal Constraints ◽  
Global Power

The design of three-dimensional (3D) power delivery network (PDN) is constrained by both power and thermal integrity. Through-silicon via (TSV) as an important part of transmission power and heat in stack, the rational design of TSV layout is particularly important. Using minimal TSV area to achieve the required 3D PDN is significant to reduce manufacturing costs and increase integration. In this paper, we propose electrical and thermal models of 3D PDN, respectively, and we use them to solve the 3D voltage drop and temperature distribution problems. The accuracy and efficiency of our proposed methods are demonstrated by simulation measurement. Combining these two methods, a layer-based optimization solution is developed and allows us to adjust the TSV density for different layers while satisfying the global power and thermal constraints. This optimization is scalable and has the same guiding value for multichip stacks with different functions and constraints. A setup of four-chip stack is used to demonstrate the feasibility of this optimization and a large TSV area saving is achieved by this method.

scholarly journals Language Family Engineering with Product Lines of Multi-level Models

2021 ◽  
Author(s):  
Juan de Lara ◽  
Esther Guerra
Keyword(s):  
Software Engineering ◽  
Arbitrary Number ◽  
Formal Theory ◽  
The Other ◽  
Language Family ◽  
Top Down ◽  
Product Lines ◽  
Modelling Languages ◽  
Multi Level ◽  
Definition Of

AbstractModelling is an essential activity in software engineering. It typically involves two meta-levels: one includes meta-models that describe modelling languages, and the other contains models built by instantiating those meta-models. Multi-level modelling generalizes this approach by allowing models to span an arbitrary number of meta-levels. A scenario that profits from multi-level modelling is the definition of language families that can be specialized (e.g., for different domains) by successive refinements at subsequent meta-levels, hence promoting language reuse. This enables an open set of variability options given by all possible specializations of the language family. However, multi-level modelling lacks the ability to express closed variability regarding the availability of language primitives or the possibility to opt between alternative primitive realizations. This limits the reuse opportunities of a language family. To improve this situation, we propose a novel combination of product lines with multi-level modelling to cover both open and closed variability. Our proposal is backed by a formal theory that guarantees correctness, enables top-down and bottom-up language variability design, and is implemented atop the MetaDepth multi-level modelling tool.

Research on transformer vibration monitoring and diagnosis based on Internet of things

2021 ◽  
Vol 30 (1) ◽  
pp. 677-688
Author(s):  
Zhenzhuo Wang ◽  
Amit Sharma
Keyword(s):  
Internet Of Things ◽  
Power Distribution ◽  
Vibration Analysis ◽  
Vibration Monitoring ◽  
Power Transformers ◽  
Normal Operation ◽  
Analysis Method ◽  
Power Distribution Network ◽  
Monitoring And Diagnosis ◽  
Distribution Transformers

Abstract A recent advent has been seen in the usage of Internet of things (IoT) for autonomous devices for exchange of data. A large number of transformers are required to distribute the power over a wide area. To ensure the normal operation of transformer, live detection and fault diagnosis methods of power transformers are studied. This article presents an IoT-based approach for condition monitoring and controlling a large number of distribution transformers utilized in a power distribution network. In this article, the vibration analysis method is used to carry out the research. The results show that the accuracy of the improved diagnosis algorithm is 99.01, 100, and 100% for normal, aging, and fault transformers. The system designed in this article can effectively monitor the healthy operation of power transformers in remote and real-time. The safety, stability, and reliability of transformer operation are improved.

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