Influence of Image Force Effect on Tunneling Current Density for High-k Material ZrO2 Ultra Thin Films Based MOS Devices

2017 ◽  
Vol 12 (1) ◽  
pp. 67-71 ◽  
Author(s):  
N. P. Maity ◽  
Reshmi Maity ◽  
S. Baishya
Keyword(s):  
Thin Films ◽  
Current Density ◽  
Tunneling Current ◽  
Image Force ◽  
Force Effect ◽  
Mos Devices

A tunneling current density model for ultra thin HfO2 high-k dielectric material based MOS devices

2016 ◽  
Vol 95 ◽  
pp. 24-32 ◽  
Author(s):  
Niladri Pratap Maity ◽  
Reshmi Maity ◽  
R.K. Thapa ◽  
Srimanta Baishya
Keyword(s):  
Current Density ◽  
Dielectric Material ◽  
Tunneling Current ◽  
Density Model ◽  
Mos Devices ◽  
High K ◽  
High K Dielectric

Modeling and Simulation of Tunneling Current Density for Ultra Thin MOS Devices

2016 ◽  
Vol 860 ◽  
pp. 30-34 ◽  
Author(s):  
Niladri Pratap Maity ◽  
Reshmi Maity ◽  
R.K. Thapa ◽  
S. Baishya
Keyword(s):  
Current Density ◽  
Current Flow ◽  
Tunneling Current ◽  
Oxide Thickness ◽  
Oxide Semiconductor ◽  
Tunneling Model ◽  
Mos Devices ◽  
Theoretical Predictions ◽  
Numerical Device ◽  
Mos Gate

In this paper, an analytical model for evaluation of tunneling current density of ultra-thin Metal Oxide Semiconductor (MOS) devices is presented. Results have been obtained for a wide variation of oxide thickness and biasing condition having doping concentration of 1 x 1017 cm-3. The investigation for the tunneling current density is limited to low temperatures, so that any thermal involvement to current flow can be neglected. The self-consistent oxide tunneling model has been used for device simulation, which is simple to implement and assist in the study of deep sub-micron MOS gate current effects, therefore correctly calculate the terminal current. Tunnel resistivity is also evaluated utilizing this tunneling current density model. Theoretical predictions are compared with the results obtained by the 2-D numerical device simulator ATLAS, good agreements between the two are observed.

Microstructural characterization of YBa2Cu3O7-x thin films formed by metalorganic CVD

1991 ◽  
Vol 49 ◽  
pp. 1080-1081
Author(s):  
P. Lu ◽  
W. Huang ◽  
C.S. Chern ◽  
Y.Q. Li ◽  
J. Zhao ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Critical Current Density ◽  
Critical Current ◽  
Current Density ◽  
Film Growth ◽  
Chemical Vapor ◽  
Microstructural Characterization ◽  
Ion Milling ◽  
Conventional Grinding

The YBa2Cu3O7-x thin films formed by metalorganic chemical vapor deposition(MOCVD) have been reported to have excellent superconducting properties including a sharp zero resistance transition temperature (Tc) of 89 K and a high critical current density of 2.3x106 A/cm2 or higher. The origin of the high critical current in the thin film compared to bulk materials is attributed to its structural properties such as orientation, grain boundaries and defects on the scale of the coherent length. In this report, we present microstructural aspects of the thin films deposited on the (100) LaAlO3 substrate, which process the highest critical current density.Details of the thin film growth process have been reported elsewhere. The thin films were examined in both planar and cross-section view by electron microscopy. TEM sample preparation was carried out using conventional grinding, dimpling and ion milling techniques. Special care was taken to avoid exposure of the thin films to water during the preparation processes.

Effects of surface damage on critical current density in MgB2 thin films

2021 ◽  
Vol 22 ◽  
pp. 14-19
Author(s):  
Soon-Gil Jung ◽  
Duong Pham ◽  
Jung Min Lee ◽  
Yoonseok Han ◽  
Won Nam Kang ◽  
...  
Keyword(s):  
Thin Films ◽  
Critical Current Density ◽  
Critical Current ◽  
Current Density ◽  
Surface Damage ◽  
Mgb2 Thin Films
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