Enhanced tribological properties of bismaleimides with a novel hybrid silicon dioxide containing amino groups

2020 ◽  
Vol 32 (10) ◽  
pp. 1150-1159
Author(s):  
Yuan Jia ◽  
Juxiang Yang ◽  
Xue Hu ◽  
Zhen Liu

To improve the tribological properties of bismaleimide (BMI) resin, silicon dioxide nanoparticles with imino and terminal functional amino groups were prepared through a sol–gel process to form a novel SiO2-NH2 hybrid. The as-prepared hybrid was then applied as a modifying agent for the BMI matrix to obtain SiO2-NH2/BMI composites. Compared to those of pure BMI resin, the volume wear rate and friction coefficient of the SiO2-NH2/BMI composites decreased significantly, while the wear mechanism changed from fatigue (BMI) to adhesive (SiO2-NH2/BMI) wear. This improvement in the tribological properties of the SiO2-NH2/BMI composites was attributed to the appropriate SiO2-NH2 added content, which endowed the BMI with excellent mechanical and thermal-resistant properties. Thus, the SiO2-NH2/BMI composites could resist the external load and excessive heat during the friction process.

2012 ◽  
Vol 128 (4) ◽  
pp. 276-282
Author(s):  
Ming-Shien Yen ◽  
Mu-Cheng Kuo ◽  
Chien-Wen Chen

MRS Bulletin ◽  
1997 ◽  
Vol 22 (10) ◽  
pp. 44-48 ◽  
Author(s):  
R.D. Miller ◽  
J.L. Hedrick ◽  
D.Y. Yoon ◽  
R.F. Cook ◽  
J.P. Hummel

As on-chip device densities increase and active device dimensions shrink, signal delays and noise increase due to capacitive coupling and crosstalk between the metal interconnections. Since delays, noise, and power consumption all depend critically on the dielectric constant of the separating insulator, much attention has focused recently on replacing standard silicon dioxide with new intermetal dielectrics (IMDs) having dielectric constants considerably lower than conventional oxide (k = 3.9–4.2). On-chip silicon dioxide insulators are currently deposited by gas-phase techniques such as chemical vapor deposition or plasma-enhanced chemical vapor deposition. Silicate films may also be formed at lower temperatures by sol-gel procedures. In the sol-gel process, typically an orthosilicate ester is hydrolyzed with water. This often occurs in an organic solvent to form a soluble, partially condensed polymer (sol) that can be spun on a substrate to produce a solvent-containing film. Subsequent solvent removal and curing results in the silicate film. The process involves hydrolysis to generate polyfunctional silanols followed by condensation polymerization to eventually yield a gel. Since both processes involve the substantial loss of volatile materials, considerable shrinkage occurs (75–85% is typical). Inhomogeneity of shrinkage or shrinkage on constraining substrates can often lead to cracking unless the films are very thin (often <1 μm). In the sol-gel process, a variety of techniques are employed to avoid capillary-driven cracking forces, including (1) very slow drying, (2) drying with supercritical fluids, or (3) chemically controlled condensation.


RSC Advances ◽  
2016 ◽  
Vol 6 (59) ◽  
pp. 53991-54000 ◽  
Author(s):  
Yunping Li ◽  
Wei Xiong ◽  
Chun Wang ◽  
Bo Song ◽  
Guolin Zhang

Mesoporous silicates functionalized with amino groups in the pore channels have been made by the co-condensation of tetraethoxyl siloxide (TEOS) with precursors of P–Si through a triblock copolymer-templated sol–gel process under acidic conditions.


Wear ◽  
2003 ◽  
Vol 254 (10) ◽  
pp. 994-1000 ◽  
Author(s):  
Wei-min Liu ◽  
Yun-xia Chen ◽  
Guan-Tao Kou ◽  
Tao Xu ◽  
D.C Sun

2007 ◽  
Vol 561-565 ◽  
pp. 709-712 ◽  
Author(s):  
Qing Xin Zhang ◽  
Kimiyoshi Naito ◽  
Yutaka Kagawa

Hybrid inorganic-organic materials based on a polyimide (PI) and silicon dioxide (SiO2) were prepared previously only via sol-gel approach. However, sol-gel processes have some critical limitations. The primary drawback is that the resultant gel is extremely fragile and sol-gel process is complicated and costly. In this study, using SiO2 nanoparticles polyimide/SiO2 nanocomposites were synthesized from 4,4'-diaminodiphenyl ether (ODA) and 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA). A coupling agent, 3-glycidyloxyporpl trimethoxysilane (GTMOS), was used to functionalize the SiO2 nanoparticles which enhanced the compatibility between polyimide and SiO2 nanoparticles. The microstructures of polyimide/SiO2 nanocomposites were characterized by Fourier transform infrared spectroscopy (FT-IR) and wide angle X-ray diffraction (WAXD). All the polyimides show typical noncrystalline X-ray diffraction. The frequent occurrence of particular interatomic distances (R) denoted by the noncrystalline WAXD maxima were determined. All the modulus, strength and fracture strain of polyimide were improved with 5 wt% SiO2 modified with the coupling agent.


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