Principle and structure of a printed circuit board process–based piezoelectric microfluidic pump integrated into printed circuit board

2019 ◽  
Vol 30 (17) ◽  
pp. 2595-2604 ◽  
Author(s):  
Dai-Hua Wang ◽  
Lian-Kai Tang ◽  
Yun-Hao Peng ◽  
Huai-Qiang Yu
Keyword(s):  
Flow Rate ◽  
Printed Circuit Board ◽  
Flow Characteristics ◽  
Circuit Board ◽  
Microfluidic Systems ◽  
Printed Circuit ◽  
Board Processes ◽  
Voltage Frequency ◽  
Instantaneous Flow Rate ◽  
Board Process

Considering mature printed circuit board processes, researches on microfluidic pumps that can be integrated into printed circuit board will provide a solution for further miniaturization and integration of microfluidic systems with low costs. The principle and structure of a printed circuit board process–based piezoelectric microfluidic pump integrated into printed circuit board are proposed and realized in this article. The printed circuit board process–based design and manufacturing technology of a piezoelectric microfluidic pump integrated into printed circuit board is researched utilizing printed circuit board as a platform. The flow characteristics of the fabricated microfluidic pump are experimentally tested. The research results show that the proposed principle and structure of the piezoelectric microfluidic pump can be fabricated utilizing mature printed circuit board process with advantages of simple structure and convenient processing. The fabricated printed circuit board process–based microfluidic pump can linearly pump in and pump out fluid with self-injection. Moreover, the flow rate and back pressure can be controlled by changing the peak-to-peak value, frequency, and phase difference of the driving voltages. The instantaneous flow rate has the pulsation property consistent with the drive voltage frequency. The proposed principle and structure are beneficial to integrate the fabricated printed circuit board process–based microfluidic pump with other microfluidic components to realize complicated microfluidic systems on printed circuit board.

Compact SIW directional filter using substrate integrated circular cavities

2020 ◽  
Vol 12 (5) ◽  
pp. 352-355
Author(s):  
Mohammad Sajjad Bayati ◽  
Tahsin Khorand
Keyword(s):  
Printed Circuit Board ◽  
Simple Structure ◽  
Circuit Board ◽  
Circular Cavity ◽  
Printed Circuit ◽  
Directional Filter ◽  
Compact Size ◽  
Degenerate Modes ◽  
Board Process ◽  
Better Than

AbstractIn this paper, a novel directional filter (DF) is proposed and implemented using substrate integrated waveguide (SIW) technology which exhibits the advantages of compact size and simple structure. The proposed DF is realized by two half mode substrate integrated waveguides (HMSIWs) and two substrate integrated circular cavity (SICC) resonators operating in the TM110 degenerate modes in which an aperture is utilized to realize the coupling between HMSIWs and SICCs. Two slotlines with appropriate dimensions, etched on the top and bottom planes, are utilized in order to control coupling strength between two cascaded SICC resonators. The proposed two-circular cavity SIW DF at 12.3 GHz is designed and fabricated with a normal printed circuit board process. Measured and simulated results indicate that the DF has a 3.25% bandwidth, and the return loss as well as isolation are better than 10.5 and 15 dB, respectively.

scholarly journals Using Multilayered Substrate Integrated Waveguide to Design Microwave Gain Equalizer

2014 ◽  
Vol 2014 ◽  
pp. 1-6 ◽  
Author(s):  
Yongfei Wang ◽  
Dongfang Zhou ◽  
Yi Zhang ◽  
Chaowen Chang
Keyword(s):  
Equivalent Circuit ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Substrate Integrated Waveguide ◽  
Equivalent Circuit Analysis ◽  
Compact Structure ◽  
Printed Circuit ◽  
Board Process ◽  
Insight Into ◽  
Ku Band

This paper presents the design and experiment of a novel microwave gain equalizer based on the substrate integrated waveguide (SIW) technique. The proposed equalizer is formed by an SIW loaded by SIW resonators, which has very compact structure and can compensate for gain slope of microwave systems. Equivalent circuit analysis is given about the proposed structure for a better insight into the structure’s response. A Ku-Band equalizer with four SIW resonators is simulated and fabricated with a multilayer printed circuit board process. The measured results show good performance and agreement with the simulated results; an attenuation slope of −4.5 dB over 12.5–13.5 GHz is reached with a size reduction of 76%.

Integration of microelectronic chips in microfluidic systems on printed circuit board

2012 ◽  
Vol 22 (10) ◽  
pp. 105022 ◽  
Author(s):  
I Burdallo ◽  
C Jimenez-Jorquera ◽  
C Fernández-Sánchez ◽  
A Baldi
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Microfluidic Systems ◽  
Printed Circuit

SCB and SMI: two stretchable circuit technologies, based on standard printed circuit board processes

Circuit World ◽  
2012 ◽  
Vol 38 (4) ◽  
pp. 232-242 ◽  
Author(s):  
Jan Vanfleteren ◽  
Thomas Loeher ◽  
Mario Gonzalez ◽  
Frederick Bossuyt ◽  
Thomas Vervust ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Board Processes

Valve-Less Diaphragm Micropump with Electromagnetic Actuation

2013 ◽  
Vol 647 ◽  
pp. 929-934 ◽  
Author(s):  
Yaw Jen Chang ◽  
Yun Wei Chung ◽  
Ting An Chou ◽  
Min Fen Huang
Keyword(s):  
Flow Rate ◽  
Printed Circuit Board ◽  
Lab On A Chip ◽  
Control Circuit ◽  
Fabrication Process ◽  
Circuit Board ◽  
Pdms Layer ◽  
Electromagnetic Actuation ◽  
Casting Technique ◽  
Printed Circuit

In this paper, a micropump with electromagnetic actuation is presented. The micropump mainly consists of coil actuators and a PDMS micropump layer. The microcoil was fabricated using the printed circuit board (PCB) with the conventional PCB treatment and the PDMS layer was formed by casting technique. A control circuit was designed using microcontroller to produce square waves to control coil actuator. Due to the simple fabrication process, the micropump can be incorporated in a disposable PDMS lab-on-a-chip device as a fluid actuation component. However, the coil actuator is reusable. In addition, the control circuit makes the micropump portable. The experiment results show that this proposed micropump is capable of delivering a flow rate of 470 μL/min using one coil actuator.

Radio-frequency microfluidic interferometer in printed circuit board process

2013 ◽  
Vol 55 (7) ◽  
pp. 1616-1618
Author(s):  
Bryan S. Blankenagel ◽  
Shiul Khadka ◽  
Aaron R. Hawkins ◽  
Karl F. Warnick ◽  
Brian A. Mazzeo
Keyword(s):  
Radio Frequency ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Board Process

A Research on Drying Performance of Vertical Type Equipment for PCB Wet Process

2012 ◽  
Author(s):  
Jun Young Kim ◽  
Kyung-Min Jang ◽  
Jong-Kuk Yoon ◽  
Kwang-Sun Kim
Keyword(s):  
Flow Rate ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Wet Process ◽  
Washing Process ◽  
Horizontal Type ◽  
Drying Rates ◽  
Two Parameters ◽  
Two Stages

An etching equipment for a printed circuit board (PCB) sprays chemical and DI water through nozzles on the surface of a substrate. The horizontal type equipment moves the substrate between the upper and lower rollers and they cause the damage on the patterns and sagging of the substrate. The flow rate difference between the upper and lower air knives also causes the damage on the substrates when drying them after the end of etching and washing process. To prevent this problem, the forces of the upper and lower air knives should be compensated. The drying rates of the upper and lower sides of the substrate could still be different for the horizontal type because of difficult control of drying flow rates. The vertical type equipment that the rollers don’t contact to the circuits has recently been developed as an alternative to solve the problems. This equipment has advantages that the DI water flows on the both sides of the substrate in the direction of the gravity and the flow rate of the air from the knives can be balanced because of its structural distinction. They lead to the better drying performance without damage on the substrate. The drying process of the substrate consists of two stages which are removing the extra water by wind from the air knives and evaporating the remained moisture by the high temperature of the chamber. In this research, we selected two parameters to optimize the drying capability to the angles of air knives and the temperature in the chamber. We also investigated about the removal capability of the extra drop of water and the remained moisture by using CFD. The design conditions for the process the refore have been founded by analyzing the velocity vector of wind and the time to get the target temperature.

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