Transmission Electron Micrographs of Aluminum Alloys

Author(s):  
S.V.S. Narayana Murty ◽  
Sushant K. Manwatkar ◽  
P. Ramesh Narayanan
2018 ◽  
Vol 24 (S1) ◽  
pp. 512-513 ◽  
Author(s):  
Jakob Schiøtz ◽  
Jacob Madsen ◽  
Pei Liu ◽  
Ole Winther ◽  
Jens Kling ◽  
...  

Author(s):  
S.V.S. Narayana Murty ◽  
Sushant K. Manwatkar ◽  
P. Ramesh Narayanan

Microstructure plays an important role in obtaining the desired properties in metallic materials in general and aluminum alloys in particular. Mechanical properties of aluminum alloys can be significantly altered by changing the microstructure. No other alloy system can boast of as many temper conditions as aluminum alloys. With the progress in the understanding of microstructure–mechanical property relationships in these materials, “tailor made” alloys to meet specific demands are being industrially developed. The broad spectrum of aluminum alloys in wide range of temper conditions offer materials with widely varying mechanical properties for structural designers. In order to select aluminum alloys with the desired properties for the intended application, it is essential to understand the role of microstructure under actual service conditions. It is in this context “Metallography of aluminum alloys” becomes very important. This chapter provides an insight in to the microstructural evolution of aluminum alloys from the as-cast condition to the final product. Typical examples of microstructural evolution in different aluminum alloys under various thermomechanical conditions are presented here. An atlas of microstructures of commercial and experimental wrought and cast aluminum alloys is presented in an appendix to this book. This appendix includes optical photomicrographs of both cast and wrought alloys and scanning electron micrographs of polished surfaces as well as fracture surfaces of various aluminum alloys as well as transmission electron micrographs as separate annexure. Readers are encouraged to go through the optical microstructures and fractographs along with this chapter for better understanding of the evolution of microstructure as a function of alloying additions, thermomechanical processing conditions, and fracture behavior under tension.


1996 ◽  
Vol 74 (S1) ◽  
pp. 248-251 ◽  
Author(s):  
K. C. Hall ◽  
R. D. Goldberg ◽  
T. D. Lowes ◽  
P. J. Simpson ◽  
I. V. Mitchell ◽  
...  

Gettering sites comprising dislocations and voids have been formed in silicon at a depth of 0.8 μm by room-temperature implantation with 80 keV energy protons to a fluence of 3 × 1016 cm−2, followed by annealing at a temperature of 800 °C for 20 min. Copper was evaporated onto the Si surface then diffused by heating at 600 °C for times between 5 and 60 min. Subsequently, positron annihilation measurements were used to profile the samples for void and (or) vacancy content. Rutherford backscattering quantified metal trapping out of the diffusion profile to the gettering sites. Transmission electron micrographs identified Cu trapping at both dislocations and voids. Cavities exhibit different morphologies between the empty (void) and filled condition; the latter are strongly faceted and found to contain bulk silicide.


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