Thermal Analysis in a Channel Between Vertical Electronic Circuit Boards Cooled by Forced Convection.

JOURNAL OF CHEMICAL ENGINEERING OF JAPAN ◽

10.1252/jcej.29.967 ◽

1996 ◽

Vol 29 (6) ◽

pp. 967-972

Author(s):

Xu Jiayu ◽

Nobuyoshi Nakagawa ◽

Kunio Kato

Keyword(s):

Thermal Analysis ◽

Forced Convection ◽

Electronic Circuit ◽

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Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process

Soldering & Surface Mount Technology ◽

10.1108/09540911211214659 ◽

2012 ◽

Vol 24 (2) ◽

pp. 77-91 ◽

Author(s):

Chun‐Sean Lau ◽

M.Z. Abdullah ◽

F. Che Ani

Keyword(s):

Thermal Analysis ◽

Forced Convection ◽

Computational Fluid Dynamic ◽

Fluid Dynamic ◽

Reflow Soldering ◽

Soldering Process

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Forced Convection from IC Chips on Printed Circuit Boards Generating High Heat Fluxes

Journal of The Institution of Engineers (India) Series C ◽

10.1007/s40032-021-00704-9 ◽

2021 ◽

Author(s):

Shankar Durgam

Keyword(s):

Forced Convection ◽

Printed Circuit Boards ◽

High Heat ◽

Heat Fluxes ◽

Circuit Boards ◽

Printed Circuit

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Finite-Element Methodology for Transient Conduction/Forced Convection Thermal Analysis

Heat Transfer, Thermal Control, and Heat Pipes ◽

10.2514/5.9781600865442.0077.0103 ◽

1980 ◽

pp. 77-103

Keyword(s):

Thermal Analysis ◽

Finite Element ◽

Forced Convection ◽

Transient Conduction ◽

Finite Element Methodology

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ALD Coatings to Mitigate Against Tin Whiskers and Upgrade the Environmental Durability of Electronic Circuit Boards

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ◽

10.23919/empc44848.2019.8951757 ◽

2019 ◽

Author(s):

Terho Kutilainen ◽

Marko Pudas ◽

Mark A. Ashworth ◽

Geoffrey D. Wilcox ◽

Jussi Hokka

Keyword(s):

Electronic Circuit ◽

Tin Whiskers ◽

Circuit Boards ◽

Environmental Durability

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Improving Thermal Analysis Accuracy of LPTN for Vehicle Claw-Pole Alternator by Calibrating Forced Convection Coefficients Based on Experimental Results

IEEE Access ◽

10.1109/access.2019.2940508 ◽

2019 ◽

Vol 7 ◽

pp. 129327-129334 ◽

Author(s):

Ming Li ◽

Yuejun An ◽

Zhiheng Zhang

Keyword(s):

Thermal Analysis ◽

Forced Convection ◽

Experimental Results

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Forced Convective Heat Transfer from a Channel Between Vertical Electronic Circuit Boards.

JOURNAL OF CHEMICAL ENGINEERING OF JAPAN ◽

10.1252/jcej.29.960 ◽

1996 ◽

Vol 29 (6) ◽

pp. 960-966 ◽

Author(s):

Nobuyoshi Nakagawa ◽

Xu Jiayu ◽

Kumi Shibui ◽

Kunio Kato

Keyword(s):

Heat Transfer ◽

Convective Heat Transfer ◽

Convective Heat ◽

Electronic Circuit ◽

Circuit Boards ◽

Forced Convective Heat Transfer

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Multi-fault diagnosis of electronic circuit boards using neural networks

10.1109/ijcnn.1990.137716 ◽

1990 ◽

Author(s):

B.J. Kagle ◽

J.H. Murphy ◽

L.J. Koos ◽

J.R. Reeder

Keyword(s):

Neural Networks ◽

Fault Diagnosis ◽

Electronic Circuit ◽

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Study on the impact of distance and emissivity measurement for condition monitoring of electronic circuit boards

2017 International Conference on Communication and Signal Processing (ICCSP) ◽

10.1109/iccsp.2017.8286599 ◽

2017 ◽

Author(s):

M. S. Sangeetha ◽

N. M. Nandhitha

Keyword(s):

Condition Monitoring ◽

Electronic Circuit ◽

Circuit Boards ◽

Emissivity Measurement ◽

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Thermal Analysis of Multilayer Printed Circuit Boards with Embedded Carbon Black-Polymer Resistors

2007 30th International Spring Seminar on Electronics Technology (ISSE) ◽

10.1109/isse.2007.4432819 ◽

2007 ◽

Author(s):

J. Nicolics ◽

M. Mundlein ◽

G. Hanreich ◽

A. Zluc ◽

H. Stahr ◽

...

Keyword(s):

Thermal Analysis ◽

Carbon Black ◽

Printed Circuit Boards ◽

Circuit Boards ◽

Printed Circuit

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1114 Development of thermal analysis model of printed circuit boards for power electronics

The proceedings of the JSME annual meeting ◽

10.1299/jsmemecjo.2008.6.0_243 ◽

2008 ◽

Vol 2008.6 (0) ◽

pp. 243-244

Author(s):

Kazumitsu WATANABE ◽

Masaru ISHIZUKA ◽

Shinji NAKAGAWA

Keyword(s):

Thermal Analysis ◽

Power Electronics ◽

Printed Circuit Boards ◽

Circuit Boards ◽

Analysis Model ◽

Printed Circuit

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