1114 Development of thermal analysis model of printed circuit boards for power electronics

2008 ◽  
Vol 2008.6 (0) ◽  
pp. 243-244
Author(s):  
Kazumitsu WATANABE ◽  
Masaru ISHIZUKA ◽  
Shinji NAKAGAWA
Keyword(s):  
Thermal Analysis ◽  
Power Electronics ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Analysis Model ◽  
Printed Circuit

A System Level Thermal Analysis of Large Telecommunication Racks

2003 ◽  
Author(s):  
L. T. Yeh
Keyword(s):  
Thermal Analysis ◽  
Flow Rate ◽  
Printed Circuit Boards ◽  
System Level ◽  
Circuit Boards ◽  
Air Flow Rate ◽  
Printed Circuit ◽  
Computational Fluid Dynamics Cfd ◽  
Cfd Method ◽  
Level Analysis

A system level thermal analysis is performed by employing the computational fluid dynamics (CFD) method on a large telecommunication rack. Each rack consists of two identical shelves located on the top-to-bottom orientation. Each shelf includes one fan tray with 6 fans, 3 card cages with a total of 50 printed circuit boards (PCBs). Air enters from the front of the shelf, and then makes a 90-degree turn upwards through PCBs, and finally turns another 90-degree to exit the system from the back of the shelf. The system level analysis is performed independently on each shelf. The main purpose of the analysis is to determine the air flow rate to individual printed circuit boards as well as the air temperature distribution in the system. The computed flow rate for individual PCBs is then used for a detailed board analysis to predict the component temperatures of individual boards.

A Simplified Thermal Analysis and Design Methodology for Printed Circuit Boards

1993 ◽  
Vol 115 (3) ◽  
pp. 339-342
Author(s):  
A. Hadim
Keyword(s):  
Thermal Analysis ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Simplex Algorithm ◽  
Circuit Board ◽  
Circuit Boards ◽  
Analysis And Design ◽  
Printed Circuit ◽  
Squared Error ◽  
Downhill Simplex

A simplified methodology is developed for thermal analysis and design of printed circuit boards. It combines the use of computer-aided thermal network modeling and a simplified experimental technique. In order to demonstrate its capabilities, this methodology is implemented to correlate natural convection on a printed circuit board oriented horizontally inside an enclosure. The empirical constants used in the correlation were determined through a numerical algorithm in which the sum of the squared error between calculated temperatures and experimental measurements is minimized using the downhill simplex algorithm.

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