OS1(4)-15(OS01W0152) Application of Phase-Shifting Moire Interferometry to Thermal Strain Analysis of Electronic Package

2003 ◽  
Vol 2003 (0) ◽  
pp. 145 ◽  
Author(s):  
Yasuyuki Morita ◽  
Kazuo Arakawa ◽  
Mitsugu Todo
Keyword(s):  
Thermal Strain ◽  
Strain Analysis ◽  
Moiré Interferometry ◽  
Phase Shifting ◽  
Moire Interferometry ◽  
Electronic Package

Thermal Strain Measurements in Electronic Packages Through Fractional Fringe Moire´ Interferometry

1990 ◽  
Vol 112 (4) ◽  
pp. 303-308 ◽  
Author(s):  
A. F. Bastawros ◽  
A. S. Voloshin
Keyword(s):  
Mechanical Strain ◽  
Thermal Strain ◽  
Strain Analysis ◽  
Moiré Interferometry ◽  
Experimental Methodology ◽  
Moire Interferometry ◽  
Displacement Fields ◽  
Thermally Induced ◽  
Contour Maps ◽  
Strain Components

Fractional Fringe Moire´ Interferometry (FFMI)—a new experimental methodology to measure accurately deformations and consequently strains—has been successfully implemented to determine thermally induced strains in a specimen made from an AT&T 1MB DRAM device. The specimen was heated uniformly from room temperature to 90° C. Resulting moire´ fringe patterns were recorded, analyzed using digital-image-processing and in plane displacements in the device were determined. Strain components were computed by simple differentiation of the displacement fields. The technique proved to be successful in detecting full displacement fields with submicron resolution. Contour maps showing actual thermo/mechanical strain components in the specimen were constructed. Those maps can provide an excellent tool realistic for strain analysis of microelectronic devices regardless of the structural and material complexity.

Full Field Joule Heating Measurement of Copper Plate Using Phase Shifting Moire´ Interferometry in Microscopic Scale

2009 ◽  
Author(s):  
Bicheng Chen ◽  
Cemal Basaran
Keyword(s):  
Joule Heating ◽  
Current Density ◽  
Moiré Interferometry ◽  
Phase Shifting ◽  
Moire Interferometry ◽  
Heating Effect ◽  
Full Field ◽  
Microscopic Scale ◽  
Joule Heating Effect ◽  
Heating Effects

Heat generated from Joule heating is an important factor in several failure mechanisms in microelectronic packaging (e.g. thermomigration, electromigration and etc) and large amount of the heat causes severe heat dissipation problem. It is further exaggerated by the continuous marching towards miniaturization of microelectronics. The techniques of measuring the Joule heating effects at the microscopic scale are quite limited especially for the full field measurement. Infrared microscopic imaging has been reported to measure the heat radiation by the Joule heating in the microscopic scale. Moire´ interferometry with phase shifting is a highly sensitive and a high resolution method to measure the in-plane full field strain. In this paper, it is demonstrated that the Joule heating effect can be measured by Moire´ interferometry with phase shifting at the microscopic scale. The copper sheet is used for the demonstration because of isotropic material property and well known thermal properties and parameters. The specimen was designed to minimize the out-of-plane strain and the strain caused by the thermal-structural effects. A finite element model was developed to verify the design of the structure of the specimen and the specimen was tested under different current density (input current from 0 to 24 A). Based on the research, a correlation relationship between the current density and the strain in two orthogonal directions (one in the direction of the current flow) was determined. The regression coefficients of the full field were analyzed. The experiment demonstrates the capability of measuring microscopic Joule heating effects by using Moire´ interferometry with phase shifting. The method can be further applied to the measurement of Joule heating effect in the microscopic solid structures in the electronic packaging devices.

Moiré strain analysis: An introduction, review and critique, including related techniques and future potential

1998 ◽  
Vol 33 (2) ◽  
pp. 137-151 ◽  
Author(s):  
J McKelvie
Keyword(s):  
Recent Work ◽  
Strain Analysis ◽  
Moiré Interferometry ◽  
Moire Interferometry ◽  
Future Developments ◽  
Moire Fringe ◽  
Future Potential ◽  
The Common ◽  
Moiré Fringe ◽  
Preparation Techniques

The moire fringe method is described and reviewed with particular reference to its application in strain analysis. The theory is briefly dealt with, followed by a discussion of the common methods used to analyse the information that the fringes contain and then certain non-obvious limitations are discussed. The generic grid-preparation techniques and optical arrangements are described. Moire interferometry is dealt with at some greater length, and questions that are frequently raised concerning moire in comparison to somewhat similar methods are addressed. Specific difficulties are indicated and the work concludes with a consideration of some recent work that may influence future developments of the method. Of necessity, there is much reliance on reference to quoted works.

Sign in / Sign up

Export Citation Format

Share Document