Moiré strain analysis: An introduction, review and critique, including related techniques and future potential

1998 ◽  
Vol 33 (2) ◽  
pp. 137-151 ◽  
Author(s):  
J McKelvie

The moire fringe method is described and reviewed with particular reference to its application in strain analysis. The theory is briefly dealt with, followed by a discussion of the common methods used to analyse the information that the fringes contain and then certain non-obvious limitations are discussed. The generic grid-preparation techniques and optical arrangements are described. Moire interferometry is dealt with at some greater length, and questions that are frequently raised concerning moire in comparison to somewhat similar methods are addressed. Specific difficulties are indicated and the work concludes with a consideration of some recent work that may influence future developments of the method. Of necessity, there is much reliance on reference to quoted works.

1995 ◽  
Author(s):  
Jonathan M. Huntley ◽  
S. J. P. Palmer ◽  
Howell T. Goldrein ◽  
L. Gunnar Melin

1990 ◽  
Vol 112 (4) ◽  
pp. 303-308 ◽  
Author(s):  
A. F. Bastawros ◽  
A. S. Voloshin

Fractional Fringe Moire´ Interferometry (FFMI)—a new experimental methodology to measure accurately deformations and consequently strains—has been successfully implemented to determine thermally induced strains in a specimen made from an AT&T 1MB DRAM device. The specimen was heated uniformly from room temperature to 90° C. Resulting moire´ fringe patterns were recorded, analyzed using digital-image-processing and in plane displacements in the device were determined. Strain components were computed by simple differentiation of the displacement fields. The technique proved to be successful in detecting full displacement fields with submicron resolution. Contour maps showing actual thermo/mechanical strain components in the specimen were constructed. Those maps can provide an excellent tool realistic for strain analysis of microelectronic devices regardless of the structural and material complexity.


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