1017 The Proposal for Removal Method of Loading Chips on Wheel Surface in Dry Grinding of Carbon

In dry grinding of hard carbon parts, the grinding performance of wheel is remarkably lost by carbon chips loading on wheel surface. The deterioration in grinding performance of wheel affects the grinding accuracy and efficiency. Generally, the grinding performance of loading wheel recovers by dressing. However, the dressing is not suitable from a viewpoint of the wheel life and the production cost because many abrasive grains having sharp edges under loading carbon chips on wheel surfaces are lost by dressing. In this study, we propose the application of dry ice blasting as a removal method of loading carbon chips. The dry ice is little influence on the working environment because of the quick sublimation of dry ice particles to carbon dioxide. In addition, the dry ice blasting might be suitable for the chip removal method because the dry ice doesn’t remain on wheel surfaces after blasting without the damage of wheel surfaces. The dry ice blasting tests of resinoid bond diamond wheel surface with no grinding performance by loading carbon chips are carried out, and the effects of dry ice blasting on removal of loading carbon chips are investigated, analyzing the protrusion height of abrasive grains, the impact pressure in the dry ice blasting and so on.

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The Possibility of Dressless Restoration of Grindactivity in Dry Grinding of Carbon

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.389-390.356 ◽

2008 ◽

Vol 389-390 ◽

pp. 356-361 ◽

Cited By ~ 3

Author(s):

Kazuhito Ohashi ◽

Y. Sumimoto ◽

Y. Fujita ◽

Hiroyuki Hasegawa ◽

Shinya Tsukamoto

Keyword(s):

Adhesive Tape ◽

Hard Carbon ◽

Wheel Surface ◽

Removal Method ◽

Abrasive Grains ◽

Abrasive Grain ◽

Grinding Performance ◽

Dry Grinding

The grinding performance of wheel remarkably decreases by the loading of wheel surface in dry grinding of hard carbon parts. In this report, we propose the removal method of loaded carbon chips in which an adhesive tape is removed with carbon chips after putting on a loaded wheel surface by an elastic roller with the setting load . The removal characteristics are experimentally investigated by analyzing the projecting height of abrasive grains, removal force of adhesive tape and so on. The removal method results in the enough projecting height of abrasive grain.

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Efficiency Investigation of Removal of Loading Carbon Chips on Wheel Surface Using Dry Ice Blasting

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.749.124 ◽

2017 ◽

Vol 749 ◽

pp. 124-129

Author(s):

Yuki Ohta ◽

Soziro Murakawa ◽

Kazuhito Ohashi

Keyword(s):

High Efficiency ◽

Diamond Wheel ◽

Working Environment ◽

Wheel Surface ◽

Dry Ice ◽

Abrasive Grains ◽

Grinding Performance ◽

Dry Grinding ◽

Sharp Edges ◽

Dry Ice Blasting

In dry grinding of hard carbon parts, the loading by carbon chips on wheel surface occurs in early grinding process, and the grinding performance of wheel is extremely declined. The deterioration affects the grinding accuracy and efficiency. Therefore, loading is one of the problems that must be resolved for high efficiency and high quality grinding of carbon. Generally, the grinding performance of wheel is recovered by the dressing. However, it’s not suitable from a viewpoint of the wheel life and the production cost because available abrasive grains possessing sharp edges under loading carbon chips on wheel surface are lost by dressing. In this study, we propose the dry ice blasting for removing loading carbon chips on wheel surface. The dry ice particles impact on pressed carbon chips with high pressure and sublimate to carbon dioxide quickly. Therefore, it is little influence on working environment because the dry ice doesn’t remain on wheel surfaces after blasting without the damage. In this report, we carry out the blasting tests of resinoid bond diamond wheel surface without grinding performance by loading carbon chips, and analyzed the effect of nozzle processing speed and nozzle feed pitch on recovering abrasive protrusion. The effective dry ice blasting conditions are investigated for high efficiency removal of loading carbon chips, analyzing the protrusion height of abrasive grains.

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Improvement of Grindactivity by Dressless Wheel Treatment in Dry Grinding of Carbon

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.76-78.94 ◽

2009 ◽

Vol 76-78 ◽

pp. 94-100 ◽

Cited By ~ 2

Author(s):

Kazuhito Ohashi ◽

Y. Sumimoto ◽

Y. Fujita ◽

Shinya Tsukamoto

Keyword(s):

Surface Roughness ◽

Adhesive Tape ◽

Hard Carbon ◽

Wheel Surface ◽

Dry Grinding ◽

Stock Removal

The grindactivity of wheel is remarkably lost by the loading of wheel surface in dry grinding of hard carbon parts. In this report, we propose the dressless wheel treatment, in which loading chips are removed with adhesive tape, and experimentally investigate its effect on recovery of grindactivity, analyzing the stock removal, the grinding current and the surface roughness in repeat of grinding cycle with treated and non-treated wheels. The removal and finishing performances of loaded wheel are recovered by the dressless wheel treatment.

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AN INNOVATIVE CONCEPT AND ITS EFFECTS ON WHEEL SURFACE TOPOGRAPHY IN DRY GRINDING BY RESIN AND VITRIFIED BOND CBN WHEEL

Machining Science and Technology ◽

10.1080/10910340802515989 ◽

2008 ◽

Vol 12 (4) ◽

pp. 514-528 ◽

Cited By ~ 22

Author(s):

Taghi Tawakoli ◽

Mohammad Rabiey

Keyword(s):

Surface Topography ◽

Wheel Surface ◽

Cbn Wheel ◽

Dry Grinding ◽

Vitrified Bond ◽

Innovative Concept

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Effect of Graphene nanoplatelets (GNP) reinforcement on grindability of zirconium diboride ceramics

Journal of Manufacturing Science and Engineering ◽

10.1115/1.4053009 ◽

2021 ◽

pp. 1-20

Author(s):

Nagaraj Shanbhog ◽

Arunachalam N ◽

Srinivasa Rao Bakshi

Keyword(s):

Graphene Nanoplatelets ◽

Grinding Wheel ◽

Grinding Forces ◽

Wheel Surface ◽

Sem Images ◽

Wet Grinding ◽

Dry Grinding ◽

Tangential Forces ◽

Wheel Loading ◽

Cutting Model

Abstract The grindability of graphene nanoplatelets (GNP) reinforced ZrB2 was studied using resin bonded diamond grinding wheel under dry and wet conditions. A comparative study of grinding forces was performed at selected wheel surface speeds and depth of cuts for surface grinding. ZrB2-GNP showed lower normal grinding forces due to the reduced hardness. The presence of GNP reinforcement in ZrB2 resulted in lower tangential forces and reduced specific grinding energy due to the role of GNP as solid lubricant. The measured forces showed good correlation with the micro cutting model for ZrB2 and ZrB2-GNP under dry condition. The tangential forces showed same trend as normal forces at different depth of cuts and wheel surface speeds for both ZrB2 and ZrB2-GNP with average force ratios of 0.3 and 0.35 respectively. The presence of porosity in ZrB2 increased the normal grinding forces during wet grinding. Scanning Electron Microscope (SEM) images of the grinding chips indicated a mixture of both the ductile mode and the brittle mode of material removal with predominantly brittle fractured chips. Energy Dispersive Spectroscopy (EDS) confirmed the presence of GNPs in ZrB2-GNP grinding chips. The topography of the grinding wheel showed higher wheel loading after the dry grinding than that of wet grinding. The wet grinding resulted in relatively lower surface roughness (Ra values) compared to that of dry grinding.

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An Alternative to High-Temperature and Acid/Solvent-Based Methods for Removing Integrated Circuits from Ceramic or Other Problem Substrates

ISTFA 2005: Conference Proceedings from the 31st International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2005p0489 ◽

2005 ◽

Author(s):

Carl M. Nail

Keyword(s):

High Temperature ◽

Integrated Circuits ◽

Success Rate ◽

Mechanical Damage ◽

Test Equipment ◽

High Success Rate ◽

Automated Test Equipment ◽

Removal Method ◽

Automated Test ◽

Conventional Methods

Abstract Dice must often be removed from their packages and reassembled into more suitable packages for them to be tested in automated test equipment (ATE). Removing bare dice from their substrates using conventional methods poses risks for chemical, thermal, and/or mechanical damage. A new removal method is offered using metallography-based and parallel polishing-based techniques to remove the substrate while exposing the die to minimized risk for damage. This method has been tested and found to have a high success rate once the techniques are learned.

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