232 A New Measuring Method of Young's Modulus using Circular Ring Method

2001 ◽  
Vol 2001.50 (0) ◽  
pp. 111-112
Author(s):  
Atsumi OHTSUKI ◽  
Hitoshi TAKADA
Keyword(s):  
Young’S Modulus ◽  
Young's Modulus ◽  
Measuring Method ◽  
Circular Ring ◽  
Ring Method

scholarly journals An Innovative Circular Ring Method for Measuring Young’s Modulus of Thin Flexible Multi-Layered Materials

Proceedings ◽  
2018 ◽  
Vol 2 (8) ◽  
pp. 553
Author(s):  
Atsumi Ohtsuki
Keyword(s):  
Young’S Modulus ◽  
Young's Modulus ◽  
Horizontal Displacement ◽  
Vertical Displacement ◽  
Layered Materials ◽  
Circular Ring ◽  
Thin Layers ◽  
New Method ◽  
Thin Wires ◽  
Ring Method

An innovative mechanical testing method (Compressive Circular Ring Method) is provided for measuring Young’s modulus of each layer in a flexible multi-layered material. The method is based on a nonlinear large deformation theory. By just measuring the vertical displacement or the horizontal displacement of the ring, Young’s modulus of each layer can be easily obtained for various thin multi-layered materials. Measurements were carried out on an electrodeposited twolayered wire. The results confirm that the new method is suitable for flexible multi-layered thin wires. In the meantime, the new method can be applied widely to measure Young’s modulus of thin layers formed by PVD, CVD, Coating, Paint, Cladding, Lamination, and others.

An In Situ Measuring Method for Young's Modulus of a MEMS Film Base on Resonance Frequency

2012 ◽  
Vol 503 ◽  
pp. 308-311
Author(s):  
Han Chen ◽  
Hua Rong
Keyword(s):  
Thin Film ◽  
Resonance Frequency ◽  
Young’S Modulus ◽  
Circular Plate ◽  
Material Property ◽  
Young's Modulus ◽  
Measuring Method ◽  
Test Structure ◽  
Film Research

Large-scale measurement of material property is not suit for the MEMS thin-film. Research the in-situ measuring method for material property of the MEMS thin-film is urgently. A center-anchored circular plate is adopted as the test structure here. The resonance frequency of the circular plate is measured to extract the Young’s modulus of a MEMS thin-film. The accuracy of this non-contact in-situ measuring method has been verified by CoventorWare. The inferences of the stress gradient have been analyzed. The advantages of the test structure and the measuring method present here also have been discussed.

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