659 Electron Beam Welding Characteristics of Copper Alloy Casting/Mild Steel

2005 ◽  
Vol 2005 (0) ◽  
pp. 187-188
Author(s):  
Fumio SHIBATA
Keyword(s):  
Electron Beam ◽  
Mild Steel ◽  
Copper Alloy ◽  
Electron Beam Welding ◽  
Alloy Casting

scholarly journals Electron Beam Welding Characteristics of Cast Iron and Bonding of Mild Steel to Cast Iron by using Iron-base Alloy of High Nickel Content

2007 ◽  
Vol 33 (6) ◽  
pp. 313-318 ◽  
Author(s):  
Minoru HATATE ◽  
Toshio SHIOTA ◽  
Yoichi NAGASAKI ◽  
Nobuyuki ABE ◽  
Masaharu AMANO ◽  
...  
Keyword(s):  
Electron Beam ◽  
Cast Iron ◽  
Mild Steel ◽  
Electron Beam Welding ◽  
Base Alloy ◽  
Nickel Content ◽  
Iron Base ◽  
High Nickel Content ◽  
Iron Base Alloy ◽  
High Nickel

Electron beam welding of aluminum alloy casting and wrought aluminum alloy

2017 ◽  
Vol 2017 (0) ◽  
pp. 105
Author(s):  
Koyo AOKI ◽  
Satoshi MINE ◽  
Masaki IWASHITA ◽  
Mitsuhiro WATANABE ◽  
Fumio SHIBATA
Keyword(s):  
Aluminum Alloy ◽  
Electron Beam ◽  
Electron Beam Welding ◽  
Aluminum Alloy Casting ◽  
Alloy Casting ◽  
Wrought Aluminum

Welding Phenomena of Aluminum-Copper Alloy in Electron Beam Welding

2000 ◽  
Vol 331-337 ◽  
pp. 1763-1768 ◽  
Author(s):  
Kiyoshi Nogi ◽  
Y. Sumi ◽  
Y. Aoki ◽  
T. Yamamoto ◽  
Hidetoshi Fujii
Keyword(s):  
Electron Beam ◽  
Copper Alloy ◽  
Electron Beam Welding ◽  
Aluminum Copper Alloy

Mechanical Characterization of Dissimilar Alloys Joined using Electron Beam Welding: Technical Note

2018 ◽  
Vol 10 (2) ◽  
Author(s):  
V.K. Bupesh Raja ◽  
C. Krishnaraj ◽  
K. Logesh
Keyword(s):  
Electron Beam ◽  
Copper Alloy ◽  
Mechanical Characterization ◽  
Electron Beam Welding ◽  
Industrial Applications ◽  
Technical Note ◽  
Dissimilar Metal ◽  
Dissimilar Alloys ◽  
Experimental Fusion

Electron Beam Welding (EBW) is used in various industrial applications for joining dissimilar metals due to its accuracy and good quality joints. International Thermonuclear Experimental Reactor (ITER) is the first experimental fusion power generating reactor in India. It uses a host of metals and alloys like Ti-6Al-4V, Ni-Al bronze and a special copper alloy (CRZ). This investigation aims to study the metallurgical and mechanical aspects of CRZ alloy and its EBW joint with a dissimilar metal like Nickel and stainless steel. Characterization includes material composition and effect of heat-treatment. The CRZ alloys were solution annealed at the temperature of 980 degrees C for 15 minutes and then aged at 460-480 degrees C for 4.5 hrs. The EBW welded joints were fabricated with CRZ-CRZ, CRZ-Ni and Ni-SS combination. The microstructure and mechanical properties were analyzed.

Bonding characteristics of spheroidal graphite cast iron and mild steel using electron beam welding process

Vacuum ◽  
2004 ◽  
Vol 73 (3-4) ◽  
pp. 667-671 ◽  
Author(s):  
Minoru Hatate ◽  
Toshio Shiota ◽  
Nobuyuki Abe ◽  
Masaharu Amano ◽  
Toshio Tanaka
Keyword(s):  
Electron Beam ◽  
Cast Iron ◽  
Mild Steel ◽  
Electron Beam Welding ◽  
Welding Process ◽  
Spheroidal Graphite ◽  
Spheroidal Graphite Cast Iron ◽  
Graphite Cast Iron ◽  
Bonding Characteristics

Diffusion Bonding Performance of Copper Target for 300mm Integrated Circuit

2021 ◽  
Vol 1035 ◽  
pp. 692-697
Author(s):  
Shan Shan Guo ◽  
Yuan Yuan Jiang ◽  
Hao Zeng ◽  
Xiao Yong Wan ◽  
Yong Jun Li
Keyword(s):  
Electron Beam ◽  
Integrated Circuit ◽  
Diffusion Bonding ◽  
Bonding Strength ◽  
Copper Alloy ◽  
Large Scale ◽  
Electron Beam Welding ◽  
Pure Copper ◽  
Copper Target ◽  
Bonding Ratio

Ultra-pure copper sputtering target is a key material widely used in large-scale integrated circuits with 90-28 nm feature size. The copper target for 300 mm integrated circuit requires a reliable diffusion bonding between the ultra-pure copper target and the copper alloy backplate. The bonding ratio and bonding strength of diffusion bonding should reach over 99% and 80 MPa respectively. In this paper, the ascendant structure of electron beam welding united diffusion bonding with high quality was designed. The ultra-pure copper target and the C18000 copper alloy backplate were machined to coordinating size, meanwhile the backplate underwent surface treatment of toothed/smooth, ion cleaning, magnetron sputtering coating, then the combination of target and the backplate was proceeded electron beam welding and diffusion bonding. Metallographic microscope, scanning electron microscope (SEM), mechanical tensile machine, C-scan flaw detector were used to analyze the bonding properties including interface microstructure, bonding strength and bonding ratio. The results show that the bonding ratio of copper target was above 99%, and the bonding strength was up to 80-160 MPa.

Sign in / Sign up

Export Citation Format

Share Document