Effect of Microstructures on Low-Cycle Fatigue Properties and Surface Crack Propagation Behavior in Ductile Cast Irons.

1994 ◽  
Vol 60 (571) ◽  
pp. 619-625
Author(s):  
Yasuo Ochi ◽  
Akira Ishii ◽  
Shigemi Sasaki ◽  
Yoshiyuki Sakaguchi ◽  
Masanobu Kubota
2000 ◽  
Vol 183-187 ◽  
pp. 1017-1022
Author(s):  
Kazuhiro Morino ◽  
Fumihito Nishimura ◽  
Kunimasa Takahashi ◽  
Yun Hae Kim ◽  
Hironobu Nisitani

2007 ◽  
Vol 353-358 ◽  
pp. 2962-2965
Author(s):  
Masao Sakane ◽  
Kazuhiro Itoh ◽  
Yutaka Tsukada ◽  
Kenji Terada

This paper studies the crack propagation at Sn37Pb-copper interface in push-pull low cycle fatigue. Bonded specimens of Sn37Pb and copper having notch holes with different distances from the interface were fatigued at 313K and the crack propagation paths were observed. Cracks propagated at the interface when the notch hole was near the interface but propagated in the solder when the notch hole was away from the interface. The propagation rate of the interfacial crack was faster than that of non-interface crack. The crack path and crack propagation rate of the two types of cracks were discussed in relation to J integral range calculated by finite element method.


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