Crack Propagation Behavior at Sn37Pb-Copper Interface in Low Cycle Fatigue
2007 ◽
Vol 353-358
◽
pp. 2962-2965
Keyword(s):
This paper studies the crack propagation at Sn37Pb-copper interface in push-pull low cycle fatigue. Bonded specimens of Sn37Pb and copper having notch holes with different distances from the interface were fatigued at 313K and the crack propagation paths were observed. Cracks propagated at the interface when the notch hole was near the interface but propagated in the solder when the notch hole was away from the interface. The propagation rate of the interfacial crack was faster than that of non-interface crack. The crack path and crack propagation rate of the two types of cracks were discussed in relation to J integral range calculated by finite element method.
2000 ◽
Vol 183-187
◽
pp. 1017-1022
2012 ◽
Vol 2012.49
(0)
◽
pp. 060601-060602
Keyword(s):
2014 ◽
Vol 618
◽
pp. 406-415
◽
Keyword(s):
2019 ◽
Vol 20
(2)
◽
pp. 538-547
2008 ◽
Vol 30
(10-11)
◽
pp. 1729-1736
◽
Keyword(s):
2000 ◽
Vol 183-187
◽
pp. 981-986
◽
Keyword(s):
1994 ◽
Vol 60
(571)
◽
pp. 619-625