A Three-Dimensional Two-Fluid Modeling of Stratified Flow with Condensation for Pressurized Thermal Shock Investigations

2005 ◽  
Vol 152 (1) ◽  
pp. 129-142 ◽  
Author(s):  
W. Yao ◽  
D. Bestion ◽  
P. Coste ◽  
M. Boucker
Keyword(s):  
Thermal Shock ◽  
Three Dimensional ◽  
Stratified Flow ◽  
Fluid Modeling ◽  
Pressurized Thermal Shock ◽  
Two Fluid

Stable and Unstable Crack Growth of A508 Class 3 Plates Subjected to Combined Force of Thermal Shock and Tension

1989 ◽  
Vol 111 (3) ◽  
pp. 234-240 ◽  
Author(s):  
G. Yagawa ◽  
Y. Ando ◽  
K. Ishihara ◽  
T. Iwadate ◽  
Y. Tanaka
Keyword(s):  
Thermal Shock ◽  
Nuclear Power ◽  
Power Plants ◽  
Fracture Behavior ◽  
Structural Integrity ◽  
Three Dimensional ◽  
Test Results ◽  
Unstable Crack ◽  
Pressurized Thermal Shock ◽  
Series Of Experiments

An urgent problem for nuclear power plants is to assess the structural integrity of the reactor pressure vessel under pressurized thermal shock. In order to estimate crack behavior under combined force of thermal shock and tension simulating pressurized thermal shock, two series of experiments are demonstrated: one to study the effect of material deterioration due to neutron irradiation on the fracture behavior, and the other to study the effect of system compliance on fracture behavior. The test results are discussed with the three-dimensional elastic-plastic fracture parameters, J and Jˆ integrals.

Cleavage and Ductile Thermal Shock Fractures of Corner-Cracked Nozzles

1989 ◽  
Vol 111 (3) ◽  
pp. 241-246 ◽  
Author(s):  
G. Yagawa ◽  
K. Ishihara
Keyword(s):  
Thermal Shock ◽  
Pressure Vessel ◽  
Structural Integrity ◽  
Three Dimensional ◽  
Pressure Vessel Steel ◽  
Fracture Parameter ◽  
The Finite Element Method ◽  
Vessel Steel ◽  
Pressurized Thermal Shock ◽  
Reactor Pressure

In order to study the structural integrity of the reactor pressure vessel under pressurized thermal shock, both the cleavage and the ductile thermal shock fracture experiments using initially corner-cracked nozzle specimens made of Type A508 class 3 pressure vessel steel were performed. In both experiments, unstable fractures were realized, although the test conditions were very conservative compared to those of real plants. Finally, the three-dimensional and time-dependent fracture parameter obtained with the finite element method was successfully employed to discuss the fracture phenomenon.

Elastic-Plastic Fracture Analysis of a Reactor Pressure Vessel Subjected to Pressurized Thermal Shock

2017 ◽  
Author(s):  
Huajing Guo ◽  
Zhongxian Wang ◽  
Poh-Sang Lam
Keyword(s):  
Thermal Shock ◽  
Pressure Vessel ◽  
Three Dimensional ◽  
Reactor Pressure Vessel ◽  
Pressurized Thermal Shock ◽  
Dimensional Finite Element ◽  
Fracture Theory ◽  
Crack Tip Constraint ◽  
Three Dimensional Finite Element ◽  
Reactor Pressure

Three-dimensional finite element models are used to analyze a reactor pressure vessel with an axial semi-elliptical surface crack subjected to pressurized thermal shock. During the thermal shock event, the J-A2 two-parameter fracture theory is used to investigate the temperature-dependent constraint effect at the deepest point and the surface point of the crack. Using the R6 methodology, a series of constraint-based crack failure assessment curves during the thermal shock can be obtained. It was found that the crack tip constraint should be considered for developing a more realistic failure criterion.

Dependence of the Deformation of 128×128 InSb Focal-plane Arrays on the Silicon Readout Integrated Circuit Thickness

2015 ◽  
Vol 9 (1) ◽  
pp. 170-174 ◽  
Author(s):  
Xiaoling Zhang ◽  
Qingduan Meng ◽  
Liwen Zhang
Keyword(s):  
Thermal Shock ◽  
Indium Antimonide ◽  
Integrated Circuit ◽  
Focal Plane ◽  
Three Dimensional ◽  
Fracture Probability ◽  
Focal Plane Arrays ◽  
Thermal Shock Test ◽  
Readout Integrated Circuit ◽  
Three Dimensional Modeling

The square checkerboard buckling deformation appearing in indium antimonide infrared focal-plane arrays (InSb IRFPAs) subjected to the thermal shock tests, results in the fracturing of the InSb chip, which restricts its final yield. In light of the proposed three-dimensional modeling, we proposed the method of thinning a silicon readout integrated circuit (ROIC) to level the uneven top surface of InSb IRFPAs. Simulation results show that when the silicon ROIC is thinned from 300 μm to 20 μm, the maximal displacement in the InSb IRFPAs linearly decreases from 7.115 μm to 0.670 μm in the upward direction, and also decreases linearly from 14.013 μm to 1.612 μm in the downward direction. Once the thickness of the silicon ROIC is less than 50 μm, the square checkerboard buckling deformation distribution presenting in the thicker InSb IRFPAs disappears, and the top surface of the InSb IRFPAs becomes flat. All these findings imply that the thickness of the silicon ROIC determines the degree of deformation in the InSb IRFPAs under a thermal shock test, that the method of thinning a silicon ROIC is suitable for decreasing the fracture probability of the InSb chip, and that this approach improves the reliability of InSb IRFPAs.

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