scholarly journals Material Contact Sensor with 3D Coupled Waveguides

2021 ◽  
Author(s):  
Zhenming Ding ◽  
Zexu Liu ◽  
Lin Wu ◽  
Ziyang Zhang
2015 ◽  
Vol 135 (6) ◽  
pp. 210-213 ◽  
Author(s):  
Tsubasa Susa ◽  
Takeru Watanabe ◽  
Masayuki Sohgawa ◽  
Takashi Abe

2013 ◽  
Author(s):  
Fernando Ramiro-Manzano ◽  
Nikola Prtljaga ◽  
Lorenzo Pavesi ◽  
Georg Pucker ◽  
Mher Ghulinyan

2021 ◽  
Vol 15 (2) ◽  
pp. 137-150
Author(s):  
Susanne Elisabeth Thürer ◽  
Anna Chugreeva ◽  
Norman Heimes ◽  
Johanna Uhe ◽  
Bernd-Arno Behrens ◽  
...  

AbstractThe current study presents a novel Tailored Forming process chain developed for the production of hybrid bearing bushings. In a first step, semi-finished products in the form of locally reinforced hollow profiles were produced using a new co-extrusion process. For this purpose, a modular tool concept was developed in which a steel tube made of a case-hardening steel, either C15 (AISI 1015) or 20MnCr5 (AISI 5120), is fed laterally into the tool. Inside the welding chamber, the steel tube is joined with the extruded aluminum alloy EN AW-6082. In the second step, sections from the compound profiles were formed into hybrid bearing bushings by die forging. In order to set the required forming temperatures for each material—aluminum and steel—simultaneously, a tailored heating strategy was developed, which enabled successful die forging of the hybrid workpiece to the desired bearing bushing geometry. Using either of the case-hardening steels in combination with aluminum, this novel process chain made it possible to produce intact hybrid bearing bushings, which showed both macroscopically and microscopically intimate material contact inside the compound zone.


2004 ◽  
Vol 29 (5) ◽  
pp. 468 ◽  
Author(s):  
Thomas Pertsch ◽  
Ulf Peschel ◽  
Falk Lederer ◽  
Jonas Burghoff ◽  
Matthias Will ◽  
...  

2008 ◽  
Vol 105 (4) ◽  
pp. 585-590 ◽  
Author(s):  
B. A. Usievich ◽  
J. Kh. Nurligareev ◽  
V. V. Svetikov ◽  
V. A. Sychugov

2012 ◽  
Vol 497 ◽  
pp. 137-141 ◽  
Author(s):  
Wen Jian Lu ◽  
Yuki Shimizu ◽  
Wei Gao

A thermal-type contact sensor was proposed to detect small defects, the heights of which are less than 16 nm, on the wafer surface. The feasibility of the contact sensor, which detects frictional heat generated at the contact, was theoretically investigated focusing on the temperature rise of the sensor element. Simulation results with both the simple model of heat transfer and the FEM model showed that the expected temperature rise of the contact sensor is enough to be detected by the conventional electric circuit.


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