Low voltage CMOS active pixel image sensor design and implementation

2001 ◽  
Author(s):  
Chen Xu
2006 ◽  
Vol 20 (25n27) ◽  
pp. 4207-4212
Author(s):  
YONG-SOO CHO ◽  
SIE YOUNG CHOI ◽  
H. TAKAO ◽  
K. SAWADA ◽  
M. ISHIDA

We have fabricated 32 × 32 SOI CMOS active pixel image sensor with pinned photodiode on handle wafer in order to reduce dark current, transfer charge completely, and improve spectral response. The four transistor type active pixel image sensor is comprised of reset and source follower transistors on SOI seed wafer, while the pinned photodiode, transfer gate, and floating diffusion are fabricated on SOI handle wafer. The pinned photodiode could be optimized because the process of the photodiode on SOI handle wafer is independent of the transistor process on SOI seed wafer. The optimized pinned photodiode is simulated in order to understand complete charge transfer at 3.3 V and 2.5 V of transfer gate voltage, respectively. We also investigated the optical response of fabricated active pixel image sensor under different illumination density conditions from He - Ne laser source at 3.3 V and 2.5 V of transfer gate voltage.


2001 ◽  
Vol 22 (5) ◽  
pp. 248-250 ◽  
Author(s):  
Chen Xu ◽  
Weiquan Zhang ◽  
M. Chan

2002 ◽  
Vol 38 (7) ◽  
pp. 317 ◽  
Author(s):  
T. Kwok ◽  
J.J. Zhong ◽  
T. Wilkinson ◽  
W.A. Crossland

2015 ◽  
Vol 36 (2) ◽  
pp. 242-248 ◽  
Author(s):  
汪波 WANG Bo ◽  
李豫东 LI Yu-dong ◽  
郭旗 GUO Qi ◽  
刘昌举 LIU Chang-ju ◽  
文林 WEN Lin ◽  
...  

1995 ◽  
Vol 42 (9) ◽  
pp. 1693-1694 ◽  
Author(s):  
J. Nakamura ◽  
S.E. Kemeny ◽  
E.R. Fossum

1999 ◽  
Vol 5 (S2) ◽  
pp. 370-371
Author(s):  
H. Yurimoto ◽  
K. Nagashima ◽  
T. Kunihiro ◽  
I. Takayanagi ◽  
J. Nakamura ◽  
...  

A stacked CMOS active pixel image-sensor (APS) has been developed for detecting various kinds of charged particles and its noise performance has been measured and analyzed. The sensitivity for ions and electrons with keV energy level utilizes for ion microscopy such-as SIMS and electron microscopy, respectively.Charge particles such as ions and electrons with kinetic energy of keV order are useful probes for surface analysis of material. A measurement system which yields two-dimensional image of charge particles is highly demanded. The conventional two-dimensional detection system is composed of a micro channel plate, a florescent plate which receives multiplied secondary electrons and generates a visible image, and a visible image sensor. However, its limited dynamic range and non-linearity in the ion-electron-to-photon conversion process make a quantitative measurement difficult. The proposed system using a stacked CMOS APS has several advantages over the conventional system such as high spatial resolution, no insensitive time, high S/N, wide dynamic range, nondestructive readout capability, high robustness, and low power consumption.


1996 ◽  
Author(s):  
Zhimin Zhou ◽  
Bedabrata Pain ◽  
Jason C. Woo ◽  
Eric R. Fossum

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