Effect of TiB2 addition on the microstructural, electrical, and mechanical behavior of Cu–TiB2 composites processed via spark plasma sintering

In this investigation, copper–TiB2 metal matrix composites were fabricated by spark plasma sintering. The effect of TiB2 (2.5, 5, 7.5, and 10 wt.%) additions on the microstructural, electrical, and mechanical properties of the composites was investigated. There was a remarkable reduction in processing time and temperature by this process as compared to conventional sintering. Scanning electron microscopy with energy dispersive X-ray spectroscopy elemental maps revealed a homogeneous distribution of TiB2 in the copper matrix. The hardness of the composites exhibited no consistent trend with the addition of TiB2. An improvement in tensile strength was observed at the expense of ductility. Electrical conductivity showed a decreasing trend. Morphology of the fracture surfaces was analyzed to predict the nature of failure under tensile load.