Three-Dimensional Ballistic-Diffusive Heat Transport in Silicon: Transient Response and Thermal Conductivity

2020 ◽  
Vol 45 (4) ◽  
pp. 431-441
Author(s):  
Saad Bin Mansoor ◽  
Bekir S. Yilbas
Keyword(s):  
Thermal Conductivity ◽  
Thermal Energy ◽  
Size Dependence ◽  
Energy Transport ◽  
Dielectric Material ◽  
Three Dimensional ◽  
Phonon Transport ◽  
Three Dimensions ◽  
The One ◽  
Thermal Energy Transport

AbstractPhonons are the main contributors to thermal energy transfer in thin films. The size dependence of the thermal transport characteristics alters the film properties such as thermal conductivity. Hence, in the present study, three-dimensional, transient phonon transport in dielectric material is studied through the Equation of Phonon Radiative Transport (EPRT) to assess the size dependence of thermal conductivity. The numerical scheme is introduced solving the EPRT in three dimensions and the governing algorithm is described in detail. A parametric study is carried out examining the effect of the \mathrm{Kn} number on the thermal energy transport characteristics in three-dimensional thermally excited film. The formulation and estimation of the effective thermal conductivity tensor is presented and discussed, thereby extending, to some extent, the one-dimensional results obtained earlier. We demonstrate that thermal conductivity changes in all directions, depending on the size effect. In addition, the directions of the temperature gradient and heat flux vectors differ as the \mathrm{Kn} number approaches unity.

scholarly journals Equilibrium Molecular Dynamics Study of Lattice Thermal Conductivity/Conductance of Au-SAM-Au Junctions

2009 ◽  
Vol 132 (3) ◽  
Author(s):  
Tengfei Luo ◽  
John R. Lloyd
Keyword(s):  
Thermal Conductivity ◽  
Molecular Dynamics ◽  
Thermal Energy ◽  
Energy Transport ◽  
Thermal Conductance ◽  
Finite Size ◽  
Thickness Effect ◽  
Finite Size Effect ◽  
Substrate Thickness ◽  
Thermal Energy Transport

In this paper, equilibrium molecular dynamics simulations were performed on Au-SAM (self-assembly monolayer)-Au junctions. The SAM consisted of alkanedithiol (–S–(CH2)n–S–) molecules. The out-of-plane (z-direction) thermal conductance and in-plane (x- and y-direction) thermal conductivities were calculated. The simulation finite size effect, gold substrate thickness effect, temperature effect, normal pressure effect, molecule chain length effect, and molecule coverage effect on thermal conductivity/conductance were studied. Vibration power spectra of gold atoms in the substrate and sulfur atoms in the SAM were calculated, and vibration coupling of these two parts was analyzed. The calculated thermal conductance values of Au-SAM-Au junctions are in the range of experimental data on metal-nonmetal junctions. The temperature dependence of thermal conductance has a similar trend to experimental observations. It is concluded that the Au-SAM interface resistance dominates thermal energy transport across the junction, while the substrate is the dominant media in which in-plane thermal energy transport happens.

Physical Mechanisms of Thermal Transport in Nanofluids

2011 ◽  
Author(s):  
John Shelton ◽  
Frank Pyrtle
Keyword(s):  
Thermal Conductivity ◽  
Thermal Energy ◽  
Energy Exchange ◽  
System Analysis ◽  
Energy Transport ◽  
Physical Mechanism ◽  
Conductivity Enhancement ◽  
Physical Mechanisms ◽  
Dynamics Simulations ◽  
Thermal Energy Transport

Using molecular dynamics simulations, an analysis of the thermal conductivity enhancement of a copper/argon nanofluid is performed. First, verification of an increase of as much as ∼30% in the thermal conductivity of the theoretical nanofluid over the corresponding base fluid, due to increasing nanoparticle concentration, is presented. Thermal energy transport is then decomposed into potential, kinetic, and virial components, based on the Green-Kubo autocorrelation function used to calculate thermal conductivity from the microscopic properties of the system. Analysis of these components showed that as the concentration of the nanoparticle increases, the energy transported through the system, due to collisions within the fluid, decreases by as much as 80%. Additionally, the nanofluid system increasingly displays characteristics of an amorphous-like material with increasing concentration. The decrease in energy exchange, due to collisions, suggests another physical mechanism is present for thermal energy transport. Therefore, it is proposed that thermal diffusion is the physical mechanism that more significantly affects thermal energy transport within a nanofluid than had been previously suggested.

Thin Film Phonon Heat Conduction by the Dispersion Lattice Boltzmann Method

2007 ◽  
Author(s):  
Rodrigo A. Escobar ◽  
Cristina H. Amon ◽  
Amador M. Guzma´n
Keyword(s):  
Thin Films ◽  
Thermal Conductivity ◽  
Heat Conduction ◽  
Lattice Boltzmann Method ◽  
Thermal Energy ◽  
Lattice Boltzmann ◽  
Energy Transport ◽  
Time Dependent ◽  
Boltzmann Method ◽  
Thermal Energy Transport

Numerical simulations of time-dependent thermal energy transport in semiconductor thin films are performed using the Lattice Boltzmann Method applied to phonon transport. The discrete Lattice Boltzmann Method is derived from the continuous Boltzmann transport equation assuming nonlinear, frequency-dependent phonon dispersion for acoustic and optical phonons. Results indicate that the heat conduction in silicon thin films displays a transition from diffusive to ballistic energy transport as the characteristic length of the system becomes comparable to the phonon mean free path, and that the thermal energy transport process is characterized by the propagation of multiple, superimposed phonon waves. The methodology is used to characterize the time-dependent temperature profiles inside films of decreasing thickness. Thickness-dependent thermal conductivity values are computed based on steady-state temperature distributions obtained from the numerical models. It is found that reducing feature size into the subcontinuum regime decreases the thermal conductivity when compared to bulk values, at a higher rate than what was displayed by the Debye-based gray Lattice Boltzmann Method.

Thin Film Phonon Heat Conduction by the Dispersion Lattice Boltzmann Method

2008 ◽  
Vol 130 (9) ◽  
Author(s):  
Rodrigo A. Escobar ◽  
Cristina H. Amon
Keyword(s):  
Thin Films ◽  
Thermal Conductivity ◽  
Heat Conduction ◽  
Lattice Boltzmann Method ◽  
Thermal Energy ◽  
Lattice Boltzmann ◽  
Energy Transport ◽  
Time Dependent ◽  
Boltzmann Method ◽  
Thermal Energy Transport

Numerical simulations of time-dependent thermal energy transport in semiconductor thin films are performed using the lattice Boltzmann method applied to phonon transport. The discrete lattice Boltzmann Method is derived from the continuous Boltzmann transport equation assuming nonlinear, frequency-dependent phonon dispersion for acoustic and optical phonons. Results indicate that the heat conduction in silicon thin films displays a transition from diffusive to ballistic energy transport as the characteristic length of the system becomes comparable to the phonon mean free path and that the thermal energy transport process is characterized by the propagation of multiple superimposed phonon waves. The methodology is used to characterize the time-dependent temperature profiles inside films of decreasing thickness. Thickness-dependent thermal conductivity values are computed based on steady-state temperature distributions obtained from the numerical models. It is found that reducing feature size into the subcontinuum regime decreases thermal conductivity when compared to bulk values, at a higher rate than what was displayed by the Debye-based gray lattice Boltzmann method.

Thermal Energy Transport across Hard–Soft Interfaces

2017 ◽  
Vol 2 (10) ◽  
pp. 2283-2292 ◽  
Author(s):  
Xingfei Wei ◽  
Teng Zhang ◽  
Tengfei Luo
Keyword(s):  
Thermal Energy ◽  
Energy Transport ◽  
Soft Interfaces ◽  
Thermal Energy Transport

scholarly journals A General Expression for the Stagnant Thermal Conductivity of Stochastic and Periodic Structures

2018 ◽  
Vol 140 (5) ◽  
Author(s):  
X. Bai ◽  
C. Hasan ◽  
M. Mobedi ◽  
A. Nakayama
Keyword(s):  
Thermal Conductivity ◽  
General Expression ◽  
Metal Foam ◽  
Solid Angle ◽  
Periodic Structures ◽  
Three Dimensional ◽  
High Thermal Conductivity ◽  
Numerical Calculations ◽  
The One ◽  
Good Agreement

A general expression has been obtained to estimate thermal conductivities of both stochastic and periodic structures with high-solid thermal conductivity. An air layer partially occupied by slanted circular rods of high-thermal conductivity was considered to derive the general expression. The thermal conductivity based on this general expression was compared against that obtained from detailed three-dimensional numerical calculations. A good agreement between two sets of results substantiates the validity of the general expression for evaluating the stagnant thermal conductivity of the periodic structures. Subsequently, this expression was averaged over a hemispherical solid angle to estimate the stagnant thermal conductivity for stochastic structures such as a metal foam. The resulting expression was found identical to the one obtained by Hsu et al., Krishnan et al., and Yang and Nakayama. Thus, the general expression can be used for both stochastic and periodic structures.

Applications of nanofluids in thermal energy transport

2021 ◽  
pp. 345-368
Author(s):  
Saman Rashidi ◽  
Faramarz Hormozi ◽  
Nader Karimi ◽  
Waqar Ahmed
Keyword(s):  
Thermal Energy ◽  
Energy Transport ◽  
Thermal Energy Transport

On the Recovery of 3D Spatial Statistics of Particles from 1D Measurements: Implications for Airborne Instruments

2014 ◽  
Vol 31 (10) ◽  
pp. 2078-2087 ◽  
Author(s):  
Michael L. Larsen ◽  
Clarissa A. Briner ◽  
Philip Boehner
Keyword(s):  
Point Processes ◽  
Pair Correlation ◽  
Three Dimensional ◽  
Three Dimensions ◽  
Dimensional System ◽  
Cloud Droplets ◽  
Sampling Variability ◽  
One Dimensional ◽  
Natural Sampling ◽  
The One

Abstract The spatial positions of individual aerosol particles, cloud droplets, or raindrops can be modeled as a point processes in three dimensions. Characterization of three-dimensional point processes often involves the calculation or estimation of the radial distribution function (RDF) and/or the pair-correlation function (PCF) for the system. Sampling these three-dimensional systems is often impractical, however, and, consequently, these three-dimensional systems are directly measured by probing the system along a one-dimensional transect through the volume (e.g., an aircraft-mounted cloud probe measuring a thin horizontal “skewer” through a cloud). The measured RDF and PCF of these one-dimensional transects are related to (but not, in general, equal to) the RDF/PCF of the intrinsic three-dimensional systems from which the sample was taken. Previous work examined the formal mathematical relationship between the statistics of the intrinsic three-dimensional system and the one-dimensional transect; this study extends the previous work within the context of realistic sampling variability. Natural sampling variability is found to constrain substantially the usefulness of applying previous theoretical relationships. Implications for future sampling strategies are discussed.

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