ABSTRACTGrazing-Emission X-Ray Fluorescence Spectrometry (GEXRF) is a new analytical
X-ray fluorescence technique, which like TXRF takes advantage of the
total-reflection phenomenon. The main advantage of GEXRF over TXRF is its
sensitivity towards light elements. This paper presents straight GEXRF and
VPD-DC-GEXRF analysis results for Na, Mg, Al, K and Ca surface contamination
on silicon wafers.