Test Method for Measuring Surface Metal Contamination on Silicon Wafers by Total Reflection X-Ray Fluorescence Spectroscopy

1995 ◽  
Author(s):  
1997 ◽  
Vol 477 ◽  
Author(s):  
S. De Gendt ◽  
K. Kenis ◽  
M. Baeyens ◽  
P. W. Mertens ◽  
M. M. Heyns ◽  
...  

ABSTRACTGrazing-Emission X-Ray Fluorescence Spectrometry (GEXRF) is a new analytical X-ray fluorescence technique, which like TXRF takes advantage of the total-reflection phenomenon. The main advantage of GEXRF over TXRF is its sensitivity towards light elements. This paper presents straight GEXRF and VPD-DC-GEXRF analysis results for Na, Mg, Al, K and Ca surface contamination on silicon wafers.


1994 ◽  
Vol 354 ◽  
Author(s):  
R. S. Hockett

AbstractTotal reflection X-Ray Fluorescence (TXRF) is a glancing x-ray analytical technique which is used primarily to measure surface metal contamination on semiconductor substrates. This is a review of Total reflection X-Ray Fluorescence (TXRF) applications for silicon semiconductor processing. In addition, some comments are made about the future of TXRF, and in particular, synchrotron radiation TXRF (SR-TXRF)


1995 ◽  
Vol 11 (3) ◽  
pp. 515-518 ◽  
Author(s):  
Stephen S. LADERMAN ◽  
Alice Fischer-COLBRIE ◽  
Ayako SHIMAZAKI ◽  
Kunihiro MIYAZAKI ◽  
Sean BRENNAN ◽  
...  

1993 ◽  
Vol 37 ◽  
pp. 599-605 ◽  
Author(s):  
T. Utaka ◽  
T. Shoji ◽  
K. Shimizu ◽  
T. Arai ◽  
R. Wilson

Total reflection X-ray Fluorescence (TXRF) has been applied to the detection and quantification of metal contamination on the surface and near-surface regions of silicon wafers in the semiconductor industry The need for improving the sensitivity and detection limit of the TXRF technique is driven by the progress in producing thinner films and finer features in the development of larger Mbit DRAMS.


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