The Effect of Mode Mix on Interfacial Toughness: A Ductile Mechanism

2009 ◽  
pp. 106-106-19 ◽  
Author(s):  
K Bose ◽  
PP Castañeda
Keyword(s):  
Interfacial Toughness

Quasicrystalline Coatings Exhibit Durable Low Interfacial Toughness with Ice

2021 ◽  
Author(s):  
Majid Mohseni ◽  
Letícia Recla ◽  
Julio Mora ◽  
Paloma García Gallego ◽  
Alina Agüero ◽  
...  
Keyword(s):  
Interfacial Toughness

scholarly journals Super Bulk and Interfacial Toughness of Physically Crosslinked Double-Network Hydrogels

2017 ◽  
Vol 27 (44) ◽  
pp. 1703086 ◽  
Author(s):  
Hong Chen ◽  
Yonglan Liu ◽  
Baiping Ren ◽  
Yanxian Zhang ◽  
Jie Ma ◽  
...  
Keyword(s):  
Double Network ◽  
Interfacial Toughness ◽  
Physically Crosslinked

A New Specimen for Measuring the Interfacial Toughness of Al-0.5%Cu Thin Film on Si Substrate

2005 ◽  
Vol 297-300 ◽  
pp. 521-526
Author(s):  
Insu Jeon ◽  
Masaki Omiya ◽  
Hirotsugu Inoue ◽  
Kikuo Kishimoto ◽  
Tadashi Asahina
Keyword(s):  
Thin Film ◽  
The Finite Element Method ◽  
Si Substrate ◽  
Detailed Structure ◽  
Micro Fabrication ◽  
Interfacial Toughness ◽  
Linear Elastic ◽  
Elastic Fracture ◽  
Cu Thin Film ◽  
Research Show

A new specimen is proposed to measure the interfacial toughness between the Al-0.5%Cu thin film and the Si substrate. The plain and general micro-fabrication processes are sufficient to fabricate the specimen. With the help of the finite element method and the concepts of the linear elastic fracture mechanics, the detailed structure for this specimen is modeled and evaluated. The results obtained from this research show that the proposed specimen provides efficient and convenient method to measure the interfacial toughness between the Al-Cu thin film and the Si substrate.

The measurement of cohesive and interfacial toughness for bonded metal joints with epoxy adhesives

2005 ◽  
Vol 12 (8-9) ◽  
pp. 837-852 ◽  
Author(s):  
L. F. Kawashita ◽  
D. R. Moore ◽  
J. G. Williams
Keyword(s):  
Interfacial Toughness ◽  
Epoxy Adhesives

A New Specimen for Measuring the Interfacial Toughness of Al-0.5%Cu Thin Film on Si Substrate

2005 ◽  
pp. 521-526
Author(s):  
Insu Jeon ◽  
Masaki Omiya ◽  
Hirotsugu Inoue ◽  
Kikuo Kishimoto ◽  
Tadashi Asahina
Keyword(s):  
Thin Film ◽  
Si Substrate ◽  
Interfacial Toughness ◽  
Cu Thin Film
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