Role of Interface Chemistry in Failure of Materials

2009 ◽  
pp. 275-275-19
Author(s):  
A Joshi
Keyword(s):  

2010 ◽  
Vol 108 (6) ◽  
pp. 064115 ◽  
Author(s):  
D. Tsoutsou ◽  
Y. Panayiotatos ◽  
A. Sotiropoulos ◽  
G. Mavrou ◽  
E. Golias ◽  
...  


1997 ◽  
Vol 26 (2) ◽  
pp. 53-63 ◽  
Author(s):  
L. H. Kuo ◽  
K. Kimura ◽  
S. Miwa ◽  
T. Yasuda ◽  
T. Yao


2019 ◽  
Vol 29 (37) ◽  
pp. 1809111 ◽  
Author(s):  
Allison M. Dennis ◽  
Matthew R. Buck ◽  
Feng Wang ◽  
Nicolai F. Hartmann ◽  
Somak Majumder ◽  
...  


1991 ◽  
Vol 240 ◽  
Author(s):  
P. L. Meissner ◽  
J. C. Bravman ◽  
T. Kendelewicz ◽  
C. J. Spindt ◽  
A. Herrera-Gómez ◽  
...  

ABSTRACTWe present the first direct measurements showing changes in the Schottky barrier height for ohmic Pd-Ge contacts to n-type GaAs. The barrier height and interface chemistry were investigated with high resolution synchrotron ultraviolet photoemission spectroscopy. Interfaces were formed by the deposition of one layer each of Pd and Ge on the GaAs substrate, where the deposition sequence was varied to allow a more quantitative determination of the role of each element. A reduction of 0.35 eV in the barrier height occurred in the case where Pd was deposited first. This reduction can be described by a model in which interface states are compensated by charge from As n-type doping of the Ge layer in the Ge-GaAs heterojunction. The dramatic change in barrier height seen when Pd is deposited first contrasts sharply with the stable barrier height observed for the case where the Ge was deposited first, a constant barrier of 0.75 eV was found after every deposition and annealing step. This stability was correlated with constant Ga and As concentrations in the Ge and a relatively low overall As concentration in the overlayer.



1985 ◽  
Vol 47 ◽  
Author(s):  
J. E. E. Baglin

ABSTRACTEnhanced adhesion of a film of non-reactive metal deposited on a ceramic or glass substrate can be produced by irradiating the interface with an ion beam. The resulting bond can be improved by subsequent heat treatment. The interface remains abrupt. The mechanism of this bonding is discussed, and the effects of interface contaminants are examined for the Cu-Al2O3 and Au-Al2O3 systems. Finally it is noted that strong adhesion is produced when Al2O3 is subjected to preferential sputtering at the time of Cu deposition; the resulting interface chemistry is discussed.



2006 ◽  
Vol 6 (2) ◽  
pp. 337-344 ◽  
Author(s):  
Michaël Mainil ◽  
Michaël Alexandre ◽  
Fabien Monteverde ◽  
Philippe Dubois




1997 ◽  
Vol 3 (S2) ◽  
pp. 553-554
Author(s):  
E.S.K. Menon ◽  
W.T. Reynolds ◽  
A.G.Fox

The role of various alloying elements on the kinetics of austenite decomposition in steels is well documented. One of the least understood aspects is the ability of some elements like Mo to drastically reduce the kinetics of ferrite (α) growth in austenite (γ).Within specific ranges of transformation temperatures and alloy compositions, the transformation of austenite can cease entirely for extended periods of time (transformation stasis). The phenomenon is quite pronounced in Fe-C-Mo alloys and is clearly evidenced by a horizontal region in the plot of the fraction transformed vs. isothermal reaction time. Based on microstructural and kinetic evidence, the occurrence of the transformation stasis phenomenon has been ascribed to a "solute drag like effect" caused by the segregation of Mo atoms to α : γ boundaries. The proposal that interface chemistry alters the growth kinetics of ferrite is quite difficult to verify as the segregation is expected to be confined to a boundary region less than a nanometer in width.



2017 ◽  
Vol 77 ◽  
pp. 14-18 ◽  
Author(s):  
Momath Lo ◽  
Abdou K.D. Diaw ◽  
Diariatou Gningue-Sall ◽  
Jean-Jacques Aaron ◽  
Mehmet A. Oturan ◽  
...  


JAMA ◽  
1966 ◽  
Vol 195 (12) ◽  
pp. 1005-1009 ◽  
Author(s):  
D. J. Fernbach
Keyword(s):  


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