Tensile Properties of Sn-10Sb-5Cu High Temperature Lead Free Solder

2011 ◽  
pp. 158-158-10
Author(s):  
Qiulian Zeng ◽  
Jianjun Guo ◽  
Xiaolong Gu ◽  
Qingsheng Zhu ◽  
Xiaogang Liu
Keyword(s):  
High Temperature ◽  
Tensile Properties ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Tensile Properties of Sn-10Sb-5Cu High Temperature Lead Free Solder

2010 ◽  
Vol 7 (5) ◽  
pp. 103041
Author(s):  
Qiulian Zeng ◽  
Jianjun Guo ◽  
Xiaolong Gu ◽  
Qingsheng Zhu ◽  
Xiaogang Liu ◽  
...  
Keyword(s):  
High Temperature ◽  
Tensile Properties ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Effect of Strain Rate on Tensile Properties of Miniature Size Specimens of Several Lead-Free Alloys

2014 ◽  
Vol 783-786 ◽  
pp. 2810-2815 ◽  
Author(s):  
Ikuo Shohji ◽  
Yuichiro Toyama
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
Strain Rate ◽  
Tensile Properties ◽  
High Strain ◽  
Lead Free ◽  
Lead Free Solder ◽  
Proof Stress ◽  
Free Solder ◽  
High Temperature Solder

The effect of strain rate on tensile properties of several lead-free solder was investigated using miniature size specimens. High-temperature lead-free solder which are Sn-Cu and Sn-Sb alloys were prepared. Moreover, low-Ag lead-free solder which are Sn-1Ag-0.7Cu (SAC107, mass%) based alloys were prepared. Sn-3Ag-0.5Cu (SAC305) was also prepared for comparison. Tensile strength is proportion to the logarithm of strain rate in all solder investigated. Although 0.1% proof stress decreases at high strain rate in high-temperature solder, it scarcely changes in low-Ag solder. Elongation somewhat increases with increasing strain rate in high-temperature solder. It increases with increasing strain rate in low-Ag solder although it is lower than that of SAC305. Chisel point fracture mainly occurred except Sn-13Sb. In Sn-13Sb, brittle fracture occurred and thus elongation was lower than those of other solder. Sn-8.5Sb and Sn-1Ag-0.7Cu-1Bi-0.2In show mechanical properties similar to SAC305.

Microstructure and tensile properties of Sn–9Zn–xAg lead-free solder alloys

2003 ◽  
Vol 48 (8) ◽  
pp. 1047-1051 ◽  
Author(s):  
J.M. Song ◽  
G.F. Lan ◽  
T.S. Lui ◽  
L.H. Chen
Keyword(s):  
Tensile Properties ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Free Solder

Impact Tensile Properties of Sn-3.0Ag-0.5Cu Lead-free Solder

2002 ◽  
Vol 2002 (0) ◽  
pp. 229-230
Author(s):  
Ken KAMINISI ◽  
Takesi MARUICHI ◽  
Tsutomu SEKINE
Keyword(s):  
Tensile Properties ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

scholarly journals Effect of Trace Ge on Wettability and High-Temperature Oxidation Resistance of Sn-0.7Cu Lead-Free Solder

2016 ◽  
Vol 57 (10) ◽  
pp. 1685-1690
Author(s):  
Qing-meng Wang ◽  
Gui-sheng Gan ◽  
Yunfei Du ◽  
Donghua Yang ◽  
Guoqi Meng ◽  
...  
Keyword(s):  
High Temperature ◽  
Oxidation Resistance ◽  
High Temperature Oxidation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Temperature Oxidation ◽  
Free Solder

High-temperature lead-free solder alternatives

2011 ◽  
Vol 88 (6) ◽  
pp. 981-989 ◽  
Author(s):  
Vivek Chidambaram ◽  
Jesper Hattel ◽  
John Hald
Keyword(s):  
High Temperature ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder
Sign in / Sign up

Export Citation Format

Share Document