Erosion-Resistant Electrode Coatings of Vacuum and Gas-Discharge Switching Devices

MRS Advances ◽  
2015 ◽  
Vol 1 (17) ◽  
pp. 1177-1182
Author(s):  
Sergey Karabanov ◽  
Dmitry Suvorov ◽  
Gennady Gololobov ◽  
Victor Gurov ◽  
Evgeny Slivkin ◽  
...  
Keyword(s):  
Numerical Modeling ◽  
Electric Current ◽  
Gas Discharge ◽  
Mechanical Stresses ◽  
Local Temperature ◽  
Interlayer Thickness ◽  
Thermal Fields ◽  
Efficiency Assessment ◽  
Intermediate Layers ◽  
Switching Devices

ABSTRACTThe paper presents the results of numerical modeling of thermomechanical stresses and thermal fields for conditions of erosion-resistant electrode coatings of vacuum and gas discharge switching devices with W-Ti-Cu and W-Mo-Cu structures at local temperature and electric current influence in axially symmetrical approximation. The efficiency assessment of intermediate layers introduction by comparison of interlaminar mechanical stresses is carried out. It is shown that introduction of titanium interlayer in the coating with W Cu structure results in considerable (more than two times) decrease of internal thermomechanical stresses between layers that increases coating resistance to delamination. The optimum value of interlayer thickness at which the minimum thermomechanical stresses are provided is determined.

Mathematical Modeling of Thermomechanical Stresses of Multilayer Erosion-Resistant Electrode Coatings of Magnetically Controlled MEMS

2015 ◽  
Vol 1753 ◽  
Author(s):  
Sergey Karabanov ◽  
Dmitriy Suvorov ◽  
Gennady Gololobov ◽  
Evgeny Slivkin ◽  
Dmitry Tarabrin
Keyword(s):  
Mathematical Modeling ◽  
Numerical Modeling ◽  
Electric Current ◽  
Layer Thickness ◽  
Local Temperature ◽  
Mems Switches ◽  
Thermal Fields

ABSTRACTThe paper presents the results of numerical modeling of thermomechanical stresses and thermal fields for conditions of erosion-resistant electrode coatings of magnetically controlled MEMS switches with W-Ti-Cu structure at local temperature and electric current influence in axially symmetrical approximation. It is shown that the introduction of titan interlayer (30-100 nm) in the coating with W-Ti-Cu structure results in considerable (more than two times) decrease of internal thermomechanical stresses between layers that increases coating resistance to delamination. It is established that there is an optimum value of Ti layer thickness at which the minimum thermomechanical stresses are provided.

scholarly journals Quantitative Determination of Thermal Fields and Transformation Rates in Rapidly Solidifying Aluminum by Numerical Modeling and In-situ TEM

2015 ◽  
Vol 21 (S3) ◽  
pp. 811-812 ◽  
Author(s):  
Can Liu ◽  
Kai Zweiacker ◽  
Joseph T. McKeown ◽  
Thomas LaGrange ◽  
Bryan W. Reed ◽  
...  
Keyword(s):  
Numerical Modeling ◽  
Quantitative Determination ◽  
In Situ Tem ◽  
Thermal Fields ◽  
Transformation Rates

Numerical modeling for a better understanding of gas discharge plasmas

2005 ◽  
Vol 9 (3) ◽  
pp. 321-344
Author(s):  
Annemie Bogaerts ◽  
Kathleen De Bleecker ◽  
Violeta Georgieva ◽  
Dieter Herrebout ◽  
Ivan Kolev ◽  
...  
Keyword(s):  
Numerical Modeling ◽  
Gas Discharge ◽  
Discharge Plasmas

Microstructure of SiC/Cu Interface by Pulsed Electric-Current Bonding

2007 ◽  
Vol 539-543 ◽  
pp. 3883-3887 ◽  
Author(s):  
Akio Nishimoto ◽  
Katsuya Akamatsu ◽  
Kenji Ikeuchi
Keyword(s):  
Solid Solution ◽  
Bond Strength ◽  
Electric Current ◽  
Intermediate Layer ◽  
Bonded Joints ◽  
Bonding Pressure ◽  
Intermediate Layers ◽  
Pulsed Electric Current ◽  
Solution Layer ◽  
Sintered Silicon

Pulsed electric-current sintering (PECS) was applied to the bonding of SiC (pressureless-sintered silicon carbide) to Cu (oxygen-free copper) using a mixture of Cu and Ti powders as an intermediate layer. The influences of the intermediate powders on the bond strength of the joint were investigated by observation of the microstructure. The bonding was carried out at carbon-die temperatures from 973 to 1173 K at a bonding pressure of 10 MPa for 3.6 ks. The application of intermediate layers of 100% Ti, 95% Ti + 5% Cu, and 5% Ti + 95% Cu remarkably improved the bond strength as compared with direct bonding without an intermediate powder. SEM observations of the joint with the intermediate powders revealed that a Cu solid-solution layer, a TiC layer, and a Ti5Si3 layer had covered most of the interface, similar to those observed in the friction-bonded and pulsed-electric current bonded joints of SiC to Cu in which the application of a Ti foil as an intermediate layer remarkably improved the bond strength.

Nonlinear vibration behavior of a carry current ferromagnetic beam plate under magnetic fields and thermal loads

2020 ◽  
Vol 26 (15-16) ◽  
pp. 1276-1285
Author(s):  
Elham Tahmasebi ◽  
Nariman Ashrafi Khorasani ◽  
Ali Imam
Keyword(s):  
Magnetic Field ◽  
Electric Current ◽  
Eddy Currents ◽  
Nonlinear Differential Equations ◽  
Vibrational Behavior ◽  
Thermal Fields ◽  
Ferromagnetic Plate ◽  
Soft Ferromagnetic ◽  
The Galerkin Method ◽  
The Magnetic Field

In order to study the magnetoelastic instability and natural frequency of a ferromagnetic plate under a magnetic field, different magnetic force models are considered. In the present study, considering more realistic assumptions, new equations for the study of the vibrational behavior of ferromagnetic beam plates carrying the electric current in the magnetic field are presented by employing the theory of Eringen and Maxwell relations. Conclusively, the effects of magnetic traction and thermal fields created by electric current and eddy currents are taken into account. The coupled nonlinear differential equations of the system are separated by the Galerkin method and solved numerically. The numerical results are compared with the results in the literature, and the effect of different parameters on the vibration characteristics of the soft ferromagnetic beam plate is investigated. The results show that the components of the force that are created by magnetic tractions, as well as the assumption of thermal couplings, can significantly change the vibrational behavior of the plates. Also, by increasing the intensity of the electric current and the magnetic field, the amplitude of the oscillations of the plate is increased and instability occurs for certain values of these parameters in the system.

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