Contact Area Evolution During an Indentation Process

1997 ◽  
Vol 12 (8) ◽  
pp. 2064-2071 ◽  
Author(s):  
Kangjie Li ◽  
T. W. Wu ◽  
J. C. M. Li
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Contact Area ◽  
Material Properties ◽  
Contact Stiffness ◽  
Element Analysis ◽  
Indentation Technique ◽  
Indentation Process

The evolution of the contact area during an indentation process has been xamined by an ac technique and also by finite element analysis on five mechanically different materials. Constant contact area regimes were observed during the initial unloading stage and the duration of that regime depends strongly on material properties. The consistency of the results obtained by the two approaches not only proves the validity and advantage of the ac indentation technique but also confirms the applicability of contact stiffness equation. The influence of a hardness impression on unloading characteristics has also been clearly demonstrated by numerically simulating a reloading process.

Evolution of the Contact Area During an Indentation Process

1996 ◽  
Vol 436 ◽  
Author(s):  
Kangjie Li ◽  
T. W. Wu ◽  
J. C. M. Li
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Contact Area ◽  
Elastic Contact ◽  
Bulk Materials ◽  
Element Analysis ◽  
Indentation Process

AbstractThe evolution of the contact area during an indentation process has been examined by an a.c. technique and also by finite element analysis on five different bulk materials. The consistency of the results obtained by the two approaches not only show the validity and advantage of the a.c. technique but also corroborate the applicability of the elastic contact equation.

scholarly journals On the Design of a Biodegradable POC-HA Polymeric Cardiovascular Stent

2012 ◽  
Author(s):  
Joonas Ponkala ◽  
Mohsin Rizwan ◽  
Panos S. Shiakolas
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Material Properties ◽  
Three Dimensional ◽  
Polymeric Composite ◽  
Coronary Stent ◽  
Element Analysis ◽  
Material Models ◽  
Solid Models ◽  
Biodegradable Stents

The current state of the art in coronary stent technology, tubular structures used to keep the lumen open, is mainly populated by metallic stents coated with certain drugs to increase biocompatibility, even though experimental biodegradable stents have appeared in the horizon. Biodegradable polymeric stent design necessitates accurate characterization of time dependent polymer material properties and mechanical behavior for analysis and optimization. This manuscript presents the process for evaluating material properties for biodegradable biocompatible polymeric composite poly(diol citrate) hydroxyapatite (POC-HA), approaches for identifying material models and three dimensional solid models for finite element analysis and fabrication of a stent. The developed material models were utilized in a nonlinear finite element analysis to evaluate the suitability of the POC-HA material for coronary stent application. In addition, the advantages of using femtosecond laser machining to fabricate the POC-HA stent are discussed showing a machined stent. The methodology presented with additional steps can be applied in the development of a biocompatible and biodegradable polymeric stents.

Warpage Simulation During Fan-Out Wafer-Level Packaging Process with Uncertainty of Material Properties

2021 ◽  
Vol 21 (5) ◽  
pp. 2987-2991
Author(s):  
Geumtaek Kim ◽  
Daeil Kwon
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Material Properties ◽  
Coefficient Of Thermal Expansion ◽  
Input Output ◽  
Wafer Level ◽  
High Input ◽  
Element Analysis ◽  
Packaging Process ◽  
Wafer Level Packaging

Along with the reduction in semiconductor chip size and enhanced performance of electronic devices, high input/output density is a desired factor in the electronics industry. To satisfy the high input/output density, fan-out wafer-level packaging has attracted significant attention. While fan-out wafer-level packaging has several advantages, such as lower thickness and better thermal resistance, warpage is one of the major challenges of the fan-out wafer-level packaging process to be minimized. There have been many studies investigating the effects of material properties and package design on warpage using finite element analysis. Current warpage simulations using finite element analysis have been routinely conducted with deterministic input parameters, although the parameter values are uncertain from the manufacturing point of view. This assumption may lead to a gap between the simulation and the field results. This paper presents an uncertainty analysis of wafer warpage in fan-out wafer-level packaging by using finite element analysis. Coefficient of thermal expansion of silicon is considered as a parameter with uncertainty. The warpage and the von Mises stress are calculated and compared with and without uncertainty.

Damage Length Predictor for High-Speed Craft

1999 ◽  
Vol 36 (04) ◽  
pp. 203-210
Author(s):  
Steven P. McGee ◽  
Armin Troesch ◽  
Nickolas Vlahopoulos
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Material Properties ◽  
High Speed ◽  
Historical Data ◽  
Element Analysis ◽  
Damage Prediction ◽  
Structural Layout ◽  
Vessel Speed ◽  
Indenter Geometry

In 1994 the International Maritime Organization adopted the Code of Safety for High-Speed Craft (HSC Code). After two years of use, several shortfalls were found, one being the damage length predictor, which is based on traditional steel, mono-hulled vessels. Other damage predictors were developed based on historical data, but they do not account for variables such as aluminum or fiberglass construction, transverse members, indenter geometry variation, or for the case where the vessel comes to rest on the grounding object. This paper proposes a damage prediction model based on material properties, structural layout, grounding object geometry, and vessel speed. The model incorporates four grounding mechanisms: plate cutting, plate tearing, crushing of plate behind transverse members, and transverse member failure. The method is used to determine the resistance energy, compared to the kinetic energy, of the vessel, to determine an effective damage length. Finite-element analysis was used to model the failure of both aluminum and steel transverse members with significant differences in the results. It was found that the transverse members provided the majority of the resistance energy in one grounding mechanism and negligible resistance energy in another.

Sign in / Sign up

Export Citation Format

Share Document