Measurement of the thermal conductivity of thin layers using a scanning thermal microscope

2001 ◽  
Vol 16 (9) ◽  
pp. 2530-2543 ◽  
Author(s):  
Erwin R. Meinders
Keyword(s):  
Thermal Conductivity ◽  
Heat Flow ◽  
Thermal Structure ◽  
Thin Layers ◽  
Heat Diffusion ◽  
Sputter Deposited ◽  
Relative Differences ◽  
Conductivity Of Thin Films ◽  
Change Material

A scanning thermal microscope (SThM) was used to measure the thermal conductivity of thin sputter-deposited films in the thickness range of 10 nm–10 μm. The SThM method is based on a heated tip that is scanned across the surface of a sample. The heat flowing into the sample is correlated to the local thermal conductivity of the sample. Issues like the contact force, the surface roughness of the sample, and tip degradation, which determine to a great extent the contact area between tip and surface, and thus the heat flow to the sample, are addressed in the paper. A calibration curve was measured from known reference materials to quantify the sample heat flow. This calibration was used to determine the effective thermal conductivity of samples. Further, the heat diffusion through a layered sample due to a surface heat source was analyzed with an analytical and numerical model. Measurements were performed with films of aluminum, ZnS–SiO2, and GeSbTe phase change material of variable thickness and sputter-deposited on substrates of glass, silicon, or polycarbonate. It is shown in the paper that the SThM is a suitable tool to visualize relative differences in thermal structure of nanometer resolution. Determination of the thermal conductivity of thin layers is possible for layers in the micrometer range. It is concluded that the SThM is not sensitive enough to measure accurately the thermal conductivity of thin films in the nanometer range. Suggestions for improvement of the SThM method are given.

scholarly journals Present-day geothermal regime of the Uliastai Depression, Erlian Basin, North China

2018 ◽  
Vol 37 (2) ◽  
pp. 770-786 ◽  
Author(s):  
Wei Xu ◽  
Shaopeng Huang ◽  
Jiong Zhang ◽  
Ruyang Yu ◽  
Yinhui Zuo ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Flow ◽  
Thermal Structure ◽  
Rheological Characteristic ◽  
Rheological Parameter ◽  
Lithospheric Thickness ◽  
Terrestrial Heat Flow ◽  
Geothermal Regime ◽  
Mantle Heat Flow ◽  
Erlian Basin

In this study, we calculated the present-day terrestrial heat flow of the Uliastai Depression in Erlian Basin by using systematical steady-state temperature data obtained from four deep boreholes and 89 thermal conductivity measurements from 22 boreholes. Then, we calculated the lithospheric thermal structure, thermal lithospheric thickness, and lithospheric thermo-rheological structure by combining crustal structure, thermal conductivity, heat production, and rheological parameter data. Research from the Depression shows that the present-day terrestrial heat flow ( qs) is 86.3 ± 2.3 mW/m2, higher than the average of 60.4 ± 12.3 mW/m2 of the continental area of China. Mantle heat flow ( qm) in the Depression ranges from 33.7 to 39.3 mW/m2, qm/ qs ranges from 40 to 44%, show that the crust plays the dominant position in the terrestrial heat flow. The thermal thickness of the lithosphere is about 74–88 km and characterized by a “strong crust–weak mantle” rheological characteristic. The total lithospheric strength is 1.5 × 1012 N/m under wet mantle conditions. Present-day geothermal regime indicates that the Uliastai Depression has a high thermal background, the activity of the deep-seated lithosphere is relatively intense. This result differs significantly from the earlier understanding that the area belongs to a cold basin. However, a hot basin should be better consistent with the evidences from lithochemistry and geophysical observations. The results also show the melts/fluids in the study area may be related to the subduction of the Paleo-Asian Ocean. The study of the geothermal regime in the Uliastai Depression provides new geothermal evidence for the volcanic activity in the eastern part of the Central Asian Orogenic Belt and has significant implications for the geodynamic characteristics.

Thermal Properties of Thin Metallic Layer Deposited on Insulators: Effect of the Interface on the Independent Determination of the Thermal Diffusivity and Conductivity of the Layer

2008 ◽  
Author(s):  
Danie`le Fournier ◽  
Jean Paul Roger ◽  
Christian Fretigny
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Thermal Diffusivity ◽  
Thermal Resistance ◽  
Thermal Contact ◽  
Heat Diffusion ◽  
Metallic Layer ◽  
Good Thermal Contact ◽  
Lateral Heat

Lateral heat diffusion thermoreflectance is a very powerful tool for determining directly the thermal diffusivity of layered structures. To do that, experimental data are fitted with the help of a heat diffusion model in which the ratio between the thermal conductivity k and the thermal diffusivity D of each layer is fixed, and the thermal properties of the substrate are known. We have shown in a previous work that it is possible to determine independently the thermal diffusivity and the thermal conductivity of a metallic layer deposited on an insulator, by taking into consideration all the data obtained at different modulation frequencies. Moreover, it is well known that to prevent a lack of adhesion of a gold film deposited on substrates like silica, an intermediate very thin (Cr or Ti) layer is deposited to assure a good thermal contact. We extend our previous work: the asymptotic behaviour determination of the surface temperature wave at large distances from the modulated point heat source for one layer deposited on the substrate to the two layers model. In this case (very thin adhesion coating whose thermal properties and thickness are known), it can be establish that the thermal diffusivity and the thermal conductivity of the top layer can still be determined independently. It is interesting to underline that the calculus can also be extended to the case of a thermal contact resistance which has often to be taken into account between two solids. We call thermal resistance a very thin layer exhibiting a very low thermal conductivity. In this case, the three parameters we have to determine are the thermal conductivity and the thermal diffusivity of the layer and the thermal resistance. We will show that, in this case, the thermal conductivity of the layer is always obtained independently of a bound of the couple thermal resistance – thermal diffusivity, the thermal diffusivity being under bounded and the thermal resistance lower bounded. Experimental results on thin gold layers deposited on silica with and without adhesion layers are presented to illustrate the method. Discussions on the accuracy will also be presented.

Independent Determination of the Thermal Diffusivity and Conductivity of a Thin Metallic Layer Deposited on Silica

2008 ◽  
Author(s):  
Christian Fretigny ◽  
Jean Paul Roger ◽  
Li Liu ◽  
Danie`le Fournier
Keyword(s):  
Thermal Diffusivity ◽  
Careful Analysis ◽  
Thin Layers ◽  
Heat Diffusion ◽  
Bulk Materials ◽  
Thermal Insulator ◽  
Independent Determination ◽  
Lateral Temperature ◽  
Lateral Heat

It is well known that the thermal parameters of materials confined in thin layers may significantly differ from their bulk value. Lateral heat diffusion thermoreflectance experiment is a very powerful tool for determining directly the thermal diffusivity of bulk materials and of layered structure. Nevertheless, in the latter case, experimental data are fitted with the help of a heat diffusion model in which the layer thermal conductivity and thermal diffusivity are taken together into consideration. In this paper, we show that both parameters can be determined independently, in the case of a thermal conductive layer deposited on a thermal insulator, with a careful analysis of the amplitude and the phase of the lateral temperature field associated to a point source.

Flame-Contact Studies

1964 ◽  
Vol 86 (3) ◽  
pp. 449-456 ◽  
Author(s):  
A. M. Stoll ◽  
M. A. Chianta ◽  
L. R. Munroe
Keyword(s):  
Heat Transfer ◽  
Thermal Properties ◽  
Heat Flow ◽  
Mathematical Analysis ◽  
Experimental Validation ◽  
Thin Layers ◽  
Thermal Properties Of Materials ◽  
Properties Of Materials

This paper is composed of three parts: 1 Apparatus and method for determination of heat transfer through fabric during flame contact; 2 experimental validation of mathematical analysis and heat flow; 3 application to determination of thermal properties of materials in thin layers.

The Thermal Transport Properties of Polymers

1977 ◽  
Vol 50 (3) ◽  
pp. 480-522 ◽  
Author(s):  
D. Hands
Keyword(s):  
Thermal Conductivity ◽  
Thermal Diffusivity ◽  
Heat Flow ◽  
Natural Rubber ◽  
Material Selection ◽  
Reliable Data ◽  
Large Scatter ◽  
Structure Property ◽  
Structure Property Relationships

Abstract Values of thermal diffusivity and thermal conductivity are needed for heat-flow calculations, for the determination of structure-property relationships, and for material selection and comparison. However, all aspects are hampered by a dearth of reliable data and anything more than a superficial glance at the literature is apt to be discouraging for the uninitiated. Hardly any thermal diffusivity data exist, and the reported values of thermal conductivity show very large scatter. The present state of confusion can be seen, for example, in Figures 1 and 2, which show the reported thermal conductivity values for polystyrene and gum natural rubber. Not only do the values differ at some temperatures by more than 100%, and in the case of rubber by almost 300%, but different trends are indicated throughout the temperature range. Discrepancies of this size cannot be due to sample variations, and they give some indication of the experimental difficulties associated with thermal property measurements.

Bulk-Micromachined Test Structure for Fast and Reliable Determination of the Lateral Thermal Conductivity of Thin Films

2007 ◽  
Vol 16 (3) ◽  
pp. 675-683 ◽  
Author(s):  
Luigi La Spina ◽  
Alexander W. van Herwaarden ◽  
Hugo Schellevis ◽  
Wim H. A. Wien ◽  
Neboja Nenadovic ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Conductivity ◽  
Test Structure ◽  
Reliable Determination ◽  
Conductivity Of Thin Films
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