Atomistic simulation of crack propagation in single crystal tungsten under cyclic loading

An in situ scanning electron microscope (SEM) tensile test for Ni-based single-crystal superalloy was carried out at 1000 °C. The stress displacement was obtained, and the yield strength and tensile strength of the superalloy were 699 MPa and 826 MPa, respectively. The crack propagation process, consisting of Model I crack and crystallographic shearing crack, was determined. More interestingly, the crack propagation path and rate affected by eutectics was directly observed and counted. Results show that the coalescence of the primary crack and second microcrack at the interface of a γ/γ′ matrix and eutectics would make the crack propagation rate increase from 0.3 μm/s to 0.4 μm/s. On the other hand, crack deflection decreased the rate to 0.05 μm/s. Moreover, movement of dislocations in front of the crack was also analyzed to explain the different crack propagation behavior in the superalloy.

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Atomistic simulation of crack propagation in CNT reinforced nanocrystalline aluminum under uniaxial tensile loading

The Philosophical Magazine A Journal of Theoretical Experimental and Applied Physics ◽

10.1080/14786435.2021.1948132 ◽

2021 ◽

pp. 1-23

Author(s):

Pokula Narendra Babu ◽

Saurabh Dixit ◽

Snehanshu Pal

Keyword(s):

Crack Propagation ◽

Atomistic Simulation ◽

Tensile Loading ◽

Uniaxial Tensile ◽

Nanocrystalline Aluminum ◽

Uniaxial Tensile Loading

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Atomistic Simulation of Environment-Assisted Crack Propagation Behavior of SiO_2(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A ◽

10.1299/kikaia.75.866 ◽

2009 ◽

Vol 75 (755) ◽

pp. 866-872

Author(s):

Akio YASUKAWA

Keyword(s):

Crack Propagation ◽

Atomistic Simulation ◽

Mechanical Engineering ◽

Electronic Device ◽

Mechanical Reliability ◽

Special Issue ◽

Propagation Behavior ◽

Crack Propagation Behavior

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Molecular Dynamics Simulation of Crack Propagation in Single-Crystal Aluminum Plate with Central Cracks

Journal of Nanomaterials ◽

10.1155/2017/5181206 ◽

2017 ◽

Vol 2017 ◽

pp. 1-12 ◽

Cited By ~ 6

Author(s):

Jun Ding ◽

Lu-sheng Wang ◽

Kun Song ◽

Bo Liu ◽

Xia Huang

Keyword(s):

Molecular Dynamics ◽

Plastic Deformation ◽

Crack Propagation ◽

Strain Rate ◽

Single Crystal ◽

Crack Length ◽

Crack Growth ◽

Plastic Yield ◽

Model Size ◽

Dislocation Multiplication

The crack propagation process in single-crystal aluminum plate (SCAP) with central cracks under tensile load was simulated by molecular dynamics method. Further, the effects of model size, crack length, temperature, and strain rate on strength of SCAP and crack growth were comprehensively investigated. The results showed that, with the increase of the model size, crack length, and strain rate, the plastic yield point of SCAP occurred in advance, the limit stress of plastic yield decreased, and the plastic deformability of material increased, but the temperature had less effect and sensitivity on the strength and crack propagation of SCAP. The model size affected the plastic deformation and crack growth of the material. Specifically, at small scale, the plastic deformation and crack propagation in SCAP are mainly affected through dislocation multiplication and slip. However, the plastic deformation and crack propagation are obviously affected by dislocation multiplication and twinning in larger scale.

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