Pulsed Low-energy Ion-beam Induced Nucleation and Growth of Ge Nanocrystals on SiO2

2007 ◽  
Vol 1020 ◽  
Author(s):  
Anatoly Dvurechenskii ◽  
Nataly Stepina ◽  
Pavel Novikov ◽  
Vladislav Armbrister ◽  
Valery Kesler ◽  
...  

AbstractPulsed low-energy (200 eV) ion-beam-induced nucleation during Ge deposition on thin SiO2 film was used to form dense homogeneous arrays of Ge nanocrystals. The ion-beam action is shown to stimulate the nucleation of Ge nanocrystals when being applied after thin Ge layer deposition. Temperature and flux variation was used to optimize the nanocrystal size and array density required for memory device. Kinetic Monte Carlo simulation shows that ion impacts open an additional channel of atom displacement from a nanocrystal onto SiO2 surface. This results both in decrease of the average nanocrystal size and in increase of nanocrystal density.

2013 ◽  
Vol 543 ◽  
pp. 94-99 ◽  
Author(s):  
M. Carrada ◽  
B.S. Sahu ◽  
C. Bonafos ◽  
F. Gloux ◽  
J. Groenen ◽  
...  

2009 ◽  
Vol 86 (7-9) ◽  
pp. 1838-1841 ◽  
Author(s):  
P. Dimitrakis ◽  
A. Mouti ◽  
C. Bonafos ◽  
S. Schamm ◽  
G. Ben Assayag ◽  
...  

2008 ◽  
Vol 517 (1) ◽  
pp. 313-316 ◽  
Author(s):  
N.P. Stepina ◽  
A.V. Dvurechenskii ◽  
V.A. Armbrister ◽  
V.V. Kirienko ◽  
P.L. Novikov ◽  
...  

1991 ◽  
Vol 223 ◽  
Author(s):  
Richard B. Jackman ◽  
Glenn C. Tyrrell ◽  
Duncan Marshall ◽  
Catherine L. French ◽  
John S. Foord

ABSTRACTThis paper addresses the issue of chlorine adsorption on GaAs(100) with respect to the mechanisms of thermal and ion-enhanced etching. The use of halogenated precursors eg. dichloroethane is also discussed in regard to chemically assisted ion beam etching (CAIBE).


Author(s):  
Liew Kaeng Nan ◽  
Lee Meng Lung

Abstract Conventional FIB ex-situ lift-out is the most common technique for TEM sample preparation. However, the scaling of semiconductor device structures poses great challenge to the method since the critical dimension of device becomes smaller than normal TEM sample thickness. In this paper, a technique combining 30 keV FIB milling and 3 keV ion beam etching is introduced to prepare the TEM specimen. It can be used by existing FIBs that are not equipped with low-energy ion beam. By this method, the overlapping pattern can be eliminated while maintaining good image quality.


2021 ◽  
Vol 27 (S1) ◽  
pp. 20-22
Author(s):  
Chengge Jiao ◽  
Jeremy Graham ◽  
Xu Xu ◽  
Timothy Burnett ◽  
Brandon van Leer

2021 ◽  
Vol 44 (1) ◽  
Author(s):  
SUSHEEL KUMAR GUNDANNA ◽  
PUSPENDU GUHA ◽  
B SUNDARAVEL ◽  
UMANANDA M BHATTA
Keyword(s):  
Ion Beam ◽  

Author(s):  
Satyanarayan Dhal ◽  
Pritam Das ◽  
Arpita Patro ◽  
Madhuchhanda Swain ◽  
Sheela Rani Hota ◽  
...  

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