Improved Characterization of high-k Degradation with Vacuum C-AFM

2008 ◽  
Vol 1074 ◽  
Author(s):  
Wouter Polspoel ◽  
Wilfried Vandervorst ◽  
Lidia Aguilera ◽  
Marc Porti ◽  
Montserrat Nafria ◽  
...  

ABSTRACTLocal phenomena like trap assisted tunneling and oxide breakdown (BD) in new high-k gate oxides in advanced MOS devices hinder the acquisition of device requirements stated in the International Technology Roadmap for Semiconductors (ITRS). Conductive Atomic Force Microscopy (C-AFM) visualizes these local phenomena by measuring the local tunneling through the dielectric. In the first part of this work we show that the physical composition of surface protrusions, that are produced at sites electrically stressed with C-AFM and that distort the electrical measurements, is oxidized Si. In the second part, we illustrate that C-AFM measurements become more reliable in high vacuum (1e−5torr) as surface (oxidized Si protrusions) and tip damage is reduced. Finally, we illustrate good agreement between conventional macroscopic electrical measurements and nanometer-scale C-AFM measurements on normal and gate – removed high-k capacitors, respectively. Moreover, to illustrate the strength of the local tunneling technique, we show the possibility of locating BD spots on a high-k capacitor.

2010 ◽  
Vol 645-648 ◽  
pp. 821-824 ◽  
Author(s):  
Kohei Kozono ◽  
Takuji Hosoi ◽  
Yusuke Kagei ◽  
Takashi Kirino ◽  
Shuhei Mitani ◽  
...  

The dielectric breakdown mechanism in 4H-SiC metal-oxide-semiconductor (MOS) devices was studied using conductive atomic force microscopy (C-AFM). We performed time-dependent dielectric breakdown (TDDB) measurements using a line scan mode of C-AFM, which can characterize nanoscale degradation of dielectrics. It was found that the Weibull slope () of time-to-breakdown (tBD) statistics in 7-nm-thick thermal oxides on SiC substrates was much larger for the C-AFM line scan than for the common constant voltage stress TDDB tests on MOS capacitors, suggesting the presence of some weak spots in the oxides. Superposition of simultaneously obtained C-AFM topographic and current map images of SiO2/SiC structure clearly demonstrated that most of breakdown spots were located at step bunching. These results indicate that preferential breakdown at step bunching due to local electric field concentration is the probable cause of poor gate oxide reliability of 4H-SiC MOS devices.


2013 ◽  
Vol 53 (12) ◽  
pp. 1857-1862 ◽  
Author(s):  
R. Foissac ◽  
S. Blonkowski ◽  
M. Kogelschatz ◽  
P. Delcroix ◽  
M. Gros-Jean ◽  
...  

2005 ◽  
Author(s):  
Shigeaki Zaima ◽  
Akiyoshi Seko ◽  
Yukihiko Watanabe ◽  
Toshifumi Sago ◽  
Mitsuo Sakashita ◽  
...  

2007 ◽  
Vol 84 (3) ◽  
pp. 441-445 ◽  
Author(s):  
Patrick Fiorenza ◽  
Raffaella Lo Nigro ◽  
Vito Raineri ◽  
Dario Salinas

2008 ◽  
Vol 1108 ◽  
Author(s):  
Hasan Javed Uppal ◽  
Vladimir Markevich ◽  
Stergios N Volkos ◽  
Athanasios Dimoulas ◽  
Bruce Hamilton ◽  
...  

AbstractConductive atomic force microscopy (C–AFM) in ultra high vacuum (UHV) has been used to characterize charge trapping in ultrathin as–deposited oxide films of 2–4 nm (HfO2)x(SiO2)1-x/SiO2 multilayer gate stacks. Pre– and post–stress/breakdown (BD) dielectric degradation is analyzed on a nanoscale. A systematic observation probes stress induced trap generation facilitating physical stack BD. Degradation is considered in terms of the pronounced localized leakage contribution through the high–κ and interlayer SiOx. Simultaneous nanoscale current–voltage (I-V) characteristics and C–AFM imaging illlutrates charge trapping/decay from the native or stress induced traps with intrinsic charge lateral propagation. A post–stress/BD constant voltage imaging shows effects of stress bias polarity on the BD induced topography and trap assisted nano–current variations. Physical attributes of deformed artifacts relate strongly to the polarity of electron injection (gate or substrate) so discriminating the trap generation in high–κ and interlayer SiOx revealing non–homogeneous (dynamic) nature of leakage.


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