Structural Investigation of Photoluminescent Porous Si by Transmission Electron Microscopy

1992 ◽  
Vol 281 ◽  
Author(s):  
S. Shih ◽  
K. H. Jung ◽  
D. L. Kwong
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Sample Preparation ◽  
Structural Investigation ◽  
Amorphous Material ◽  
Porous Si ◽  
Plan View ◽  
Mesh Structure ◽  
Transmission Electron ◽  
Minimal Damage

ABSTRACTWe have developed a new, minimal damage approach for examination of luminescent porous Si layers (PSLs) by transmission electron microscopy (TEM). In this approach, chemically etched PSLs are fabricated after conventional plan-view TEM sample preparation. A diffraction pattern consisting of a diffuse center spot, characteristic of amorphous material, is primarily observed. However, crystalline, microcrystalline, and amorphous regions could all be observed in selected areas. A crystalline mesh structure could be observed in some of the thin areas near the pinhole. The microcrystallite sizes were 15–150 Å and decreased in size when located further from the pinhole.

scholarly journals Optimized Sample Preparation for the Imaging of Silicon Defects using Plan View Transmission Electron Microscopy

2009 ◽  
Vol 15 (S2) ◽  
pp. 360-361
Author(s):  
N Wang ◽  
A Myers ◽  
M Sidorov ◽  
H Koo ◽  
C Yuan ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Sample Preparation ◽  
Plan View ◽  
Transmission Electron ◽  
Silicon Defects

Extended abstract of a paper presented at Microscopy and Microanalysis 2009 in Richmond, Virginia, USA, July 26 – July 30, 2009

Two-View Small-Angle Wedge Sample Preparation By Hand Tools For Transmission Electron Microscopy Of Semiconductors And Related Materials

1997 ◽  
Vol 480 ◽  
Author(s):  
Suli Suder ◽  
C. A. Faunce ◽  
S. E. Donnelly
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Sample Preparation ◽  
Small Angle ◽  
Hand Tools ◽  
Cross Sectional ◽  
Plan View ◽  
Tin Films ◽  
Transmission Electron ◽  
Ion Implanted

AbstractVarious small-angle wedge two-view samples have been prepared by a small-angle cleavage technique using hand tools and examined by transmission electron microscopy. Cleaved wedges from the same material are mounted both as plan-view and cross-sectional samples on the same TEM specimen grid allowing convenient examination in both views. Samples of Si3N4, Zr, Co and TiN/CN/TiN films deposited on Si, and He ion implanted Si prepared by this technique are shown to be suitable for analysis in the TEM.

The Focused Ion Beam Fold-Out: Sample Preparation Method for Transmission Electron Microscopy

2009 ◽  
Vol 15 (6) ◽  
pp. 558-563 ◽  
Author(s):  
Herman Carlo Floresca ◽  
Jangbae Jeon ◽  
Jinguo G. Wang ◽  
Moon J. Kim
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Sample Preparation ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Ion Milling ◽  
Plan View ◽  
Site Specific ◽  
Area Of Interest ◽  
Transmission Electron

AbstractWe have developed the focused ion beam (FIB) fold-out technique, for transmission electron microscopy (TEM) sample preparation in which there is no fine polishing or dimpling, thus saving turnaround time. It does not require a nanomanipulator yet is still site specific. The sample wafer is cut to shape, polished down, and then placed in a FIB system. A tab containing the area of interest is created by ion milling and then “folded out” from the bulk sample. This method also allows a plan-view of the sample by removing material below the wafer's surface film or device near the polished edge. In the final step, the sample is thinned to electron transparency, ready to be analyzed in the TEM. With both a cross section and plan-view, our technique gives microscopists a powerful tool in analyzing multiple zone axes in one TEM session. The nature of the polished sample edge also includes the ability to sample many areas, allowing the user to examine a very large device or sample. More importantly, this technique could make multiple site-specific e-beam transparent specimens in one polished sample, which is difficult to do when prepared by other methods.

Structural Investigation of Iron Particles Used for Magnetic Recording Media

1980 ◽  
Vol 38 ◽  
pp. 406-407
Author(s):  
Alfred Baltz
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Electron Microscope ◽  
Structural Investigation ◽  
Magnetic Interaction ◽  
Recording Media ◽  
Magnetic Recording Media ◽  
Recording Medium ◽  
Iron Particles ◽  
Transmission Electron

As part of a program to develop iron particles for next generation recording disk medium, their structural properties were investigated using transmission electron microscopy and electron diffraction. Iron particles are a more desirable recording medium than iron oxide, the most widely used material in disk manufacturing, because they offer a higher magnetic output and a higher coercive force. The particles were prepared by a method described elsewhere. Because of their strong magnetic interaction, a method had to be developed to separate the particles on the electron microscope grids.

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