Microwave Treatment of Emissions From Waste Materials

1996 ◽  
Vol 430 ◽  
Author(s):  
R. L. Schulz ◽  
D. C. Folz ◽  
D. E. Clark ◽  
C. J. Schmidt ◽  
G. G. Wicks
Keyword(s):  
Gas Chromatography ◽  
Printed Circuit Boards ◽  
Microwave Treatment ◽  
Waste Materials ◽  
Control Parameters ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Gas System ◽  
Hazardous Compounds ◽  
Initial Results

AbstractA microwave off-gas system has been designed and fabricated to destroy or decompose emissions that arise from microwave treatment of printed circuit boards (PCBs). Preliminary gas chromatography data on emissions that resulted from combustion of PCBs showed significant decreases in the concentration and number of hazardous compounds detected in the off-gases after treatment. Investigations have continued in this area to demonstrate the reproducibility of the initial results and to determine critical control parameters for optimization of the system. The results of these studies are presented.

Preparation and Characterization of Composites Obtained of Polymeric Waste Coming from Boards Electronic Equipment

2016 ◽  
Vol 869 ◽  
pp. 338-341
Author(s):  
Roberto de Oliveira Magnago ◽  
Daniella Regina Mulinari ◽  
Monique Pacheco do Amaral ◽  
Luciano Monteiro Rodrigues ◽  
Claudinei dos Santos
Keyword(s):  
Printed Circuit Boards ◽  
Electronic Equipment ◽  
Waste Materials ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Impact Tests ◽  
Polypropylene Matrix ◽  
Polymeric Waste

The objective of this work is to recycle the printed circuit boards of electronic equipment discarded and mix them with polypropylene (PP) to produce a new composite. Six types of mix of discarded printed circuit boards were analyzed: new boards with and without copper, used boards without components and with and without copper, used boards without components and without copper, used boards with copper track, used boards with copper track and burned and used boards with components. Boards were disintegrated and employed as reinforcement with polypropylene matrix (5% m/m). Specimens were produced for flexural and impact tests. Results showed that specimen’s properties depend on the mix composition. In all of the cases, pure PP properties were enhanced when it was replaced by 5% of waste materials discard.

Slit Effect of Common Ground Patterns in Affecting Cross-Talk Noise between Two Parallel Signal Traces on Printed Circuit Boards

2008 ◽  
Vol 128 (11) ◽  
pp. 657-662 ◽  
Author(s):  
Tsuyoshi Maeno ◽  
Yukihiko Sakurai ◽  
Takanori Unou ◽  
Kouji Ichikawa ◽  
Osamu Fujiwara
Keyword(s):  
Cross Talk ◽  
Printed Circuit Boards ◽  
Common Ground ◽  
Circuit Boards ◽  
Printed Circuit

Influence of Component Mounting Density on Oscillating Characteristics of Multilayer Printed Circuit Boards

2018 ◽  
Vol 23 (2) ◽  
pp. 141-148
Author(s):  
S.Sh. Rekhviashvili ◽  
◽  
M.O. Mamchuev ◽  
V.V. Narozhnov ◽  
M.M. Oshkhunov ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Oscillating Characteristics

Noise properties of thin-film Ni-P resistors embedded in printed circuit boards

2013 ◽  
Vol 61 (3) ◽  
pp. 731-735
Author(s):  
A.W. Stadler ◽  
Z. Zawiślak ◽  
W. Stęplewski ◽  
A. Dziedzic
Keyword(s):  
Thin Film ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Noise Component ◽  
Printed Circuit ◽  
Resistance Bridge ◽  
Different Types ◽  
Signal Path ◽  
Resistance Fluctuations ◽  
Made In

Abstract. Noise studies of planar thin-film Ni-P resistors made in/on Printed Circuit Boards, both covered with two different types of cladding or uncladded have been described. The resistors have been made of the resistive-conductive-material (Ohmega-Ply©) of 100 Ώ/sq. Noise of the selected pairs of samples has been measured in the DC resistance bridge with a transformer as the first stage in a signal path. 1/f noise caused by resistance fluctuations has been found to be the main noise component. Parameters describing noise properties of the resistors have been calculated and then compared with the parameters of other previously studied thin- and thick-film resistive materials.

Sign in / Sign up

Export Citation Format

Share Document