Searching for the Influence of the Sapphire Nitridation Conditions on GaN Films Grown by Cyclic PLD

2002 ◽  
Vol 743 ◽  
Author(s):  
P. Sanguino ◽  
M. Niehus ◽  
S. Koynov ◽  
L. Melo ◽  
R. Schwarz ◽  
...  

AbstractWe have deposited highly c-axis oriented GaN films on sapphire by the Cyclic Pulsed Laser Deposition Technique. Nitridation of the sapphire substrates for these samples was performed at 200 °C, 400 °C and 600 °C. For that purposed, we used a radio frequency nitrogen plasma during four hours. The films were compared in terms of crystal structure, surface morphology and optical quality. Although small, the biggest differences were detected in the surface morphology of the films. Additionally, a typical GaN sample nitridated at 200 °C was analysed by photoluminescence and showed the typical donor bound excitonic luminescence (D0X ) transition at 3.47 eV and a line near 3.42 eV. These lines show a FWHM of 20 meV and 30 meV at 13K, respectively.

2009 ◽  
Vol 6 (5) ◽  
pp. 985-988 ◽  
Author(s):  
V. L. Romanyuk ◽  
V. F. Gremenok ◽  
V. S. Merkulov ◽  
V. A. Emelyanov ◽  
V. S. Syakersky ◽  
...  

2003 ◽  
Vol 780 ◽  
Author(s):  
Dongfang Yang ◽  
Lijue Xue

AbstractUniform Samarium oxide (Sm203) films were grown on 75-mm diameter silicon wafers by the pulsed laser deposition (PLD) technique. The beam of a KrF excimer laser was used to ablate an Sm2O3 target in an oxygen pressure of 30 mTorr. The crystal structure, surface morphology and optical properties of Sm2O3 films deposited at a temperature range of 25∼680°C were determined by XRD, FE-SEM, and spectra reflectance respectively. Monoclinic structure was the predominant phase for Sm2O3 films deposited at temperatures of 680°C and 400°C. Amorphous or partially crystallized amorphous phase was observed at deposition temperatures of 25°C and 200°C. The Sm2O3 film deposited at 680°C is very dense, while films deposited at lower temperatures have higher porosity. The values of index of refraction, n, and extinction coefficient, k, at λ = 633 nm are 1.867 and 0.0660, respectively, for the 680°C film, and are in a range of 1.5∼1.6 and 0.01∼0.04 respectively for films deposited at lower temperatures.


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