Transparent Transistor Development

2003 ◽  
Vol 796 ◽  
Author(s):  
D. Hong ◽  
N. L. Dehuff ◽  
R. E. Presley ◽  
C. L. Munsee ◽  
J. P. Bender ◽  
...  

ABSTRACTTransparent electronics is an embryonic technology whose objective is the realization of invisible electronic circuits. We have recently reported the fabrication of a novel n-channel transparent thin-film transistor (TTFT). [1] This ZnO-based TTFT is highly transparent and exhibits electrical characteristics that appear to be suitable for implementation as a transparent select-transistor in each pixel of an active-matrix liquid-crystal display. Moreover, the processing technology used to fabricate this device is relatively simple and appears to be compatible with inexpensive glass substrate technology. The objective of the work reported herein is to summarize some of our recent TTFT electrical performance results. Materials, processing, and device structure details related to these devices appear in future publications.

2006 ◽  
Vol 910 ◽  
Author(s):  
Ta-Chuan Liao ◽  
Chun-Yu Wu ◽  
Feng-Tso Chien ◽  
Chun-Chien Tsai ◽  
Hsiu-Hsin Chen ◽  
...  

AbstractA novel T-shaped-gated (T-Gate) polycrystalline silicon thin-film transistor (poly-Si TFT) with vacuum gaps has been proposed and fabricated only with a simple process. The T-Gate structure is formed only by a selective undercut-etching technology of the Mo/Al bi-layers. Then, vacuum gaps are in-situ embedded in this T-Gate structure subsequent to capping the SiH4-based passivation oxide under the vacuum process chamber. Experimental results reveal that the proposed T-Gate poly-Si TFTs have excellent electrical performance, which has higher maximum on-off current ratio of 4.6 e107, and the lower off-state leakage current at VGS = -10 V and VDS = 5V of about 100 times less than that of the conventional one. It is attributed to the additional undoped offset region and the vacuum gap to reduce the maximum electric field at drain junction while ascribed to the sub-gate to maintain the on-current. Therefore, such a T-Gate poly-Si TFT is very suitable for the applications and manufacturing in active matrix liquid crystal displays (AMLCDs) and active matrix organic light emitting diodes (AMOLEDs).


1995 ◽  
Vol 402 ◽  
Author(s):  
G. T. Sarcona ◽  
M. K. Hatalis

AbstractThin films of cobalt, nickel, and tungsten were sputtered on three types of silicon materials to explore their potential for use as silicides in thin film transistor technologies for active matrix liquid crystal displays. The metals were sputtered onto single-crystal, polycrystalline, and amorphous silicon. The metals were annealed in vacuum after deposition over temperatures ranging from 250°C to 750°C. The sheet resistance of the resulting silicide films was measured using a four point probe apparatus. Cobalt silicides with sheet resistance of less than 4 Ω/ were formed at 600°C. Nickel produced films with sheet resistance below 10 Ω/▪ at 350°C, though the surface was required to be vacuum-clean. In this study, tungsten did not produce silicides. Surface preparation has been found to be an important factor in tungsten and nickel silicidation.


2002 ◽  
Vol 33 (1) ◽  
pp. 798 ◽  
Author(s):  
T. Kretz ◽  
G. Gomez ◽  
H. Lebrun ◽  
D. Coates ◽  
S. Reaney

Author(s):  
David L. Post ◽  
William F. Reinhart

The demand for color head- and helmet-mounted displays (HMDs) is growing. Interest focuses on full-color systems, but a limited color repertoire is sufficient for some applications and can reduce cost and complexity significantly, especially when subtractive-color active-matrix liquid-crystal display (AMLCD) technology is used. We report a series of experiments that investigated important questions about the design and merits of two-primary color AMLCDs for HMD applications. Our main conclusion is that the image quality of a subtractive-color AMLCD with high (≥70%) aperture ratio is superior to a comparable, conventional color AMLCD. Evidence regarding requirements for resolution, aperture ratio, and gray scale is also provided.


Sign in / Sign up

Export Citation Format

Share Document