scholarly journals Kinetics of thermal decomposition of titanium hydride powder using in situ high-temperature X-ray diffraction (HTXRD)

2005 ◽  
Vol 8 (3) ◽  
pp. 293-297 ◽  
Author(s):  
Hugo Ricardo Zschommler Sandim ◽  
Bruno Vieira Morante ◽  
Paulo Atsushi Suzuki
1993 ◽  
Vol 03 (C9) ◽  
pp. C9-461-C9-467 ◽  
Author(s):  
M. Juez-Lorenzo ◽  
V. Kolarik ◽  
N. Eisenreich ◽  
W. Engel ◽  
A. J. Criado

1984 ◽  
Vol 40 ◽  
Author(s):  
Patrick W. Dehaven

AbstractWith proper sample preparation, high temperature x-ray diffraction can be used to study in-situ the reactions occurring at a solder/metal interface. We have applied this technique to an investigation of the reaction kinetics between copper and nickel metal and 60/40 Sn/Pb solder. The copper and nickel are shown to follow similar pathways, each having a complex reaction profile that involves an initial “hold” of little reactivity, followed by a two-step diffusion controlled reaction. Activation energies were obtained from Arrhenius-type plots, and result in values of 6.8 kcal/mole for the nickel/solder reaction, and 13 kcal/mole for the copper/solder reaction. These results are compared with those obtained by previous investigators, and discussed in terms of the growth of the different intermetallic phases.


2006 ◽  
Vol 70 (6) ◽  
pp. 467-472 ◽  
Author(s):  
Tomonori Nambu ◽  
Nobue Shimizu ◽  
Hisakazu Ezaki ◽  
Hiroshi Yukawa ◽  
Masahiko Morinaga ◽  
...  

2008 ◽  
Vol 452 (2) ◽  
pp. 446-450 ◽  
Author(s):  
Qiuguo Xiao ◽  
Ling Huang ◽  
Hui Ma ◽  
Xinhua Zhao

Sign in / Sign up

Export Citation Format

Share Document