Transient Thermal Flow in a U-Bend and its Influence on Wall Thermal Stress

2021 ◽  
Author(s):  
Wendi Liu ◽  
Alex Skillen ◽  
Małgorzata Zimoń ◽  
Robert Sawko ◽  
Charles Moulinec ◽  
...  
Keyword(s):  
Thermal Stress ◽  
Thermal Flow ◽  
Transient Thermal

scholarly journals Comparison of Thermal Stress during Short-Circuit in Different Types of 1.2 kV SiC Transistors Based on Experiments and Simulations

2017 ◽  
Vol 897 ◽  
pp. 595-598
Author(s):  
Diane Perle Sadik ◽  
Jang Kwon Lim ◽  
Juan Colmenares ◽  
Mietek Bakowski ◽  
Hans Peter Nee
Keyword(s):  
Thermal Stress ◽  
Short Circuit ◽  
Thermal Simulation ◽  
Temperature Evolution ◽  
Power Devices ◽  
Different Types ◽  
Transient Thermal

The temperature evolution during a short-circuit in the die of three different Silicon Carbide1200-V power devices is presented. A transient thermal simulation was performed based on the reconstructedstructure of commercially available devices. The location of the hottest point in the device iscompared. Finally, the analysis supports the necessity to turn off short-circuit events rapidly in orderto protect the device after a fault.

SPH Analysis for Transient Thermal Stress of FGMs with Temperature-Dependent Properties

2015 ◽  
Vol 1096 ◽  
pp. 297-301
Author(s):  
Gui Ming Rong ◽  
Hiroyuki Kisu
Keyword(s):  
Thermal Stress ◽  
Thermal Conditions ◽  
Functionally Graded ◽  
Temperature Dependent ◽  
Graded Materials ◽  
Initial Stage ◽  
Particle Hydrodynamics ◽  
Smoothed Particle ◽  
Temperature Dependent Properties ◽  
Transient Thermal

A formulation using the deviatoric stress and the continuity equation is extended to the analysis of the dynamic response of functionally graded materials (FGMs) subjected to a thermal shock by smoothed particle hydrodynamics (SPH), in which temperature dependent properties of materials are considered. Several dynamic thermal stress problems are analyzed to investigate the fluctuation of thermal stress at the initial stage under three types of thermal conditions, with the addition of two kinds of mechanical boundary conditions.

scholarly journals OS0802 Analysis of a Smart Multilayer Composite Disk for Control of Transient Thermal Stress

2013 ◽  
Vol 2013 (0) ◽  
pp. _OS0802-1_-_OS0802-2_
Author(s):  
Fumihiro ASHIDA ◽  
Sei-ichiro SAKATA ◽  
Takuya MORIMOTO ◽  
Tsuyoshi YAMADA
Keyword(s):  
Thermal Stress ◽  
Multilayer Composite ◽  
Transient Thermal Stress ◽  
Transient Thermal ◽  
Composite Disk
Sign in / Sign up

Export Citation Format

Share Document