scholarly journals Comparison of Thermal Stress during Short-Circuit in Different Types of 1.2 kV SiC Transistors Based on Experiments and Simulations

2017 ◽  
Vol 897 ◽  
pp. 595-598
Author(s):  
Diane Perle Sadik ◽  
Jang Kwon Lim ◽  
Juan Colmenares ◽  
Mietek Bakowski ◽  
Hans Peter Nee
Keyword(s):  
Thermal Stress ◽  
Short Circuit ◽  
Thermal Simulation ◽  
Temperature Evolution ◽  
Power Devices ◽  
Different Types ◽  
Transient Thermal

The temperature evolution during a short-circuit in the die of three different Silicon Carbide1200-V power devices is presented. A transient thermal simulation was performed based on the reconstructedstructure of commercially available devices. The location of the hottest point in the device iscompared. Finally, the analysis supports the necessity to turn off short-circuit events rapidly in orderto protect the device after a fault.

scholarly journals Comparison of Thermal Stress During Short-Circuit in Different Types of 1.2-kV SiC Transistors Based on Experiments and Simulations

2021 ◽  
Vol 68 (3) ◽  
pp. 2608-2616
Author(s):  
Diane-Perle Sadik ◽  
Juan Colmenares ◽  
Jang-Kwon Lim ◽  
Mietek Bakowski ◽  
Hans-Peter Nee
Keyword(s):  
Thermal Stress ◽  
Short Circuit ◽  
Different Types

scholarly journals Thermal Analysis of Heat Distribution in Busbars during Rated Current Flow in Low-Voltage Industrial Switchgear

Energies ◽  
2021 ◽  
Vol 14 (9) ◽  
pp. 2427
Author(s):  
Michał Szulborski ◽  
Sebastian Łapczyński ◽  
Łukasz Kolimas
Keyword(s):  
Structural Changes ◽  
Heat Dissipation ◽  
Current Flow ◽  
Low Voltage ◽  
Short Circuit ◽  
Short Circuit Current ◽  
Coupled Analysis ◽  
Precise Representation ◽  
Transient Thermal ◽  
Halogen Free

The manuscript presents advanced coupled analysis: Maxwell 3D, Transient Thermal and Fluent CFD, at the time of a rated current occurring on the main busbars in the low-voltage switchgear. The simulations were procured in order to aid the design process of such enclosures. The analysis presented the rated current flow in the switchgear busbars, which allowed determining their temperature values. The main assumption of the simulation was measurements of temperature rise during rated current conditions. Simulating such conditions is a valuable asset in order to design better solutions for energy distribution gear. The simulation model was a precise representation of the actual prototype of the switchgear. Simulations results were validated by experimental research. The heat dissipation in busbars and switchgear housing through air convection was presented. The temperature distribution for the insulators in the rail bridge made of fireproof material was considered: halogen-free polyester. The results obtained during the simulation allowed for a detailed analysis of switchgear design and proper conclusions in practical and theoretical aspects. That helped in introducing structural changes in the prepared prototype of the switchgear at the design and construction stages. Deep analysis of the simulation results allowed for the development concerning the final prototype of the switchgear, which could be subjected to the full type tests. Additionally, short-circuit current simulations were procured and presented.

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