High heat flux two-phase cooling of electronics with integrated diamond/porous copper heat sinks and microfluidic coolant supply

Author(s):  
James W. Palko ◽  
Hyoungsoon Lee ◽  
Damena D. Agonafer ◽  
Chi Zhang ◽  
Ki Wook Jung ◽  
...  
Author(s):  
Kevin P. Drummond ◽  
Doosan Back ◽  
Michael D. Sinanis ◽  
David B. Janes ◽  
Dimitrios Peroulis ◽  
...  

Author(s):  
Oyuna Angatkina ◽  
Andrew Alleyne

Two-phase cooling systems provide a viable technology for high–heat flux rejection in electronic systems. They provide high cooling capacity and uniform surface temperature. However, a major restriction of their application is the critical heat flux condition (CHF). This work presents model predictive control (MPC) design for CHF avoidance in two-phase pump driven cooling systems. The system under study includes multiple microchannel heat exchangers in series. The MPC controller performance is compared to the performance of a baseline PI controller. Simulation results show that while both controllers are able to maintain the two-phase cooling system below CHF, MPC has significant reduction in power consumption compared to the baseline controller.


2019 ◽  
Vol 163 ◽  
pp. 114338 ◽  
Author(s):  
Fengze Hou ◽  
Wenbo Wang ◽  
Hengyun Zhang ◽  
Cheng Chen ◽  
Chuan Chen ◽  
...  

2008 ◽  
Vol 31 (3) ◽  
pp. 691-701 ◽  
Author(s):  
B. Agostini ◽  
J.R. Thome ◽  
M. Fabbri ◽  
B. Michel

Author(s):  
Ehsan Yakhshi-Tafti ◽  
Howard Pearlman ◽  
Seung M. You

Forced two-phase cooling is investigated for handling high power electronics and laser applications having high heat flux and isothermality requirements. Experimental results are reported for minichannel heat sinks with and without enhanced boiling coatings showing increased heat transfer coefficients and higher critical heat flux for coated versus uncoated surfaces.


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