Theoretical Prediction of the Thermal Conductivity of Frozen Foods

2004 ◽  
Author(s):  
Fabio Gori ◽  
S. Corasaniti ◽  
Vlodek R. Tarnawski
Keyword(s):  
Thermal Conductivity ◽  
Theoretical Prediction ◽  
Frozen Foods

Effect of Coating on the Thermal Conductivities of Diamond/Cu Composites Prepared by Spark Plasma Sintering (SPS)

2014 ◽  
Vol 722 ◽  
pp. 25-29 ◽  
Author(s):  
Q.L. Che ◽  
X.K. Chen ◽  
Y.Q. Ji ◽  
Y.W. Li ◽  
L.X. Wang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Theoretical Prediction ◽  
Volume Fraction ◽  
Interface Reaction ◽  
Copper Matrix ◽  
Bonding Force ◽  
Ti Alloys ◽  
Plasma Sintering ◽  
Spark Plasma

The carbide forming is proposed to improve interfacial bonding between diamond particles and copper-matrix for diamond/copper composites. The volume fraction of diamond and minor titanium are optimized. The microstructures, thermal properties, interface reaction production and its effect of minor titanium on the properties of the composites are investigated. The results show that the bonding force and thermal conductivity of the diamond/Cu-Ti alloys composites is much weaker and lower than that of the coated-diamond/Cu. the thermal conductivity of coated-60 vol. % diamond/Cu composites is 618 W/m K which is 80 % of the theoretical prediction value. The high thermal conductivity has been achieved by forming the titanium carbide at diamond/copper interface to gain a good interface.

Prediction of Thermal Conductivity in Frozen Foods

1975 ◽  
Vol 18 (4) ◽  
pp. 0740-0744 ◽  
Author(s):  
D. R. Heldman ◽  
D. P. Gorby
Keyword(s):  
Thermal Conductivity ◽  
Frozen Foods

Direct Study of the Thermal Conductivity in Aluminum Nanowires

2009 ◽  
Vol 1221 ◽  
Author(s):  
Nenad Stojanovic ◽  
D.H.S. Maithripala ◽  
Jordan M. Berg ◽  
Mark Holtz
Keyword(s):  
Thermal Conductivity ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Electrical Resistivity ◽  
Thermal Properties ◽  
Electron Transport ◽  
Theoretical Prediction ◽  
Room Temperature ◽  
Total Thermal Conductivity ◽  
Element Analysis

AbstractThermal conductivity and electrical resistivity of 1 μm long aluminum nanowires, 75, 100, and 150nm in width and 100nm thick, were measured at room temperature. The method consists of microfabricated electrothermal test devices and a model-based data processing approach using finite-element analysis (FEA). The electrical and thermal properties of the nanowires differ significantly from bulk values while electrical resistivity agrees well with theoretical prediction. Electron transport equation models, which adequately describe the resistivity data, consistently underestimate the thermal conductivity. Incorporating a phonon contribution of ˜ 21 W/m·K to the total thermal conductivity is found to accurately describe the measured values.

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