Effect of Coating on the Thermal Conductivities of Diamond/Cu Composites Prepared by Spark Plasma Sintering (SPS)

2014 ◽  
Vol 722 ◽  
pp. 25-29 ◽  
Author(s):  
Q.L. Che ◽  
X.K. Chen ◽  
Y.Q. Ji ◽  
Y.W. Li ◽  
L.X. Wang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Theoretical Prediction ◽  
Volume Fraction ◽  
Interface Reaction ◽  
Copper Matrix ◽  
Bonding Force ◽  
Ti Alloys ◽  
Plasma Sintering ◽  
Spark Plasma

The carbide forming is proposed to improve interfacial bonding between diamond particles and copper-matrix for diamond/copper composites. The volume fraction of diamond and minor titanium are optimized. The microstructures, thermal properties, interface reaction production and its effect of minor titanium on the properties of the composites are investigated. The results show that the bonding force and thermal conductivity of the diamond/Cu-Ti alloys composites is much weaker and lower than that of the coated-diamond/Cu. the thermal conductivity of coated-60 vol. % diamond/Cu composites is 618 W/m K which is 80 % of the theoretical prediction value. The high thermal conductivity has been achieved by forming the titanium carbide at diamond/copper interface to gain a good interface.

scholarly journals Compressive strength and thermal properties of spark plasma sintered Al-Al2O3 nanocomposite

2018 ◽  
Vol 50 (1) ◽  
pp. 1-14 ◽  
Author(s):  
Nouari Saheb ◽  
Muhammad Khan
Keyword(s):  
Thermal Conductivity ◽  
Compressive Strength ◽  
Thermal Properties ◽  
Yield Strength ◽  
Coefficient Of Thermal Expansion ◽  
Testing Machine ◽  
Thermal Constant ◽  
Compressive Properties ◽  
Plasma Sintering ◽  
Spark Plasma

In this work, compressive and thermal properties of aluminum, milled aluminum, and Al-10Al2O3 composite processed via ball milling (BM) and spark plasma sintering (SPS) were investigated. The microstructural features of powders and sintered samples were characterized using optical and scanning electron microscopy. A universal testing machine was used to determine the compressive properties of the consolidated samples. The thermal conductivity and coefficient of thermal expansion of the developed materials were characterized using a hot disc thermal constant analyzer and a dilatometer, respectively. The Al-10Al2O3 composite possessed hardness of 1309.7 MPa, yield strength of 311.4 MPa, and compressive strength of 432.87 MPa compared to hardness of 326.3 MPa, yield strength of 74.33 MPa, and compressive strength of 204.43 MPa for aluminum. The Al-10Al2O3 composite had thermal conductivity value 81.42 W/mK compared to value of 198.09 W/mK for aluminum. In the temperature range from 373 K to 723 K, the composite had lower CTEs ranging from 10 ? 10?6 to 22 ? 10?6/K compared to 20 ? 10?6 to 30 ? 10?6/K for aluminum.

Microstructure and Properties of Spark Plasma Sintering AlN/BN Ceramics

2006 ◽  
Vol 313 ◽  
pp. 105-108 ◽  
Author(s):  
Lian Meng Zhang ◽  
Mei Juan Li ◽  
Qiang Shen ◽  
T. Li ◽  
M.Q. Yu
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Mechanical Strength ◽  
Spark Plasma Sintering ◽  
Volume Fraction ◽  
Sintering Temperature ◽  
Composite Ceramics ◽  
Plasma Sintering ◽  
Spark Plasma ◽  
Full Densification

Aluminum nitride-boron nitride (AlN/BN) composite ceramics were prepared by spark plasma sintering (SPS). The sintering behaviors of AlN/BN composites with 5~15% volume fraction of BN were studied. The influences of BN content, as well as the sintering temperature on the density, microstructure, mechanical strength, thermal conductivity and machinability of the composites were also investigated. The results showed that the full densification of AlN/BN composite ceramics could be realized by SPS technique at the temperature no higher than 1800°C for 3 minutes. The thermal conductivity of AlN/BN composites is in the range of 66~79W/mK, and AlN/BN composites can be cut or drilled by carbides or even steel tools when BN content is 15% volume fraction. The mechanical strength of AlN/BN composites is about 330MPa and is not remarkably affected by the addition of BN. The improvement of mechanical properties of AlN/BN composite ceramics is due to the fine and homogenous microstructure developed in the SPS process.

Thermal Properties of Diamond-Particle-Dispersed Cu-Matrix-Composites Fabricated by Spark Plasma Sintering (SPS)

2010 ◽  
Vol 638-642 ◽  
pp. 2115-2120 ◽  
Author(s):  
Kiyoshi Mizuuchi ◽  
Kanryu Inoue ◽  
Yasuyuki Agari ◽  
Shinji Yamada ◽  
Motohiro Tanaka ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Spark Plasma Sintering ◽  
Packing Density ◽  
Coefficient Of Thermal Expansion ◽  
Diamond Particle ◽  
Holding Time ◽  
Matrix Composites ◽  
Plasma Sintering ◽  
Spark Plasma

Diamond-particle-dispersed copper (Cu) matrix composites were fabricated from Cu-coated diamond particles by spark plasma sintering (SPS) process, and the microstructure and thermal properties of the composites fabricated were examined. These composites can well be consolidated in a temperature range between 973K and 1173K and scanning electron microscopy detects no reaction at the interface between the diamond particle and the Cu matrix. The relative packing density of the diamond-Cu composite increases with increasing sintering temperature and holding time, reaching 99.2% when sintered at a temperature of 1173K for a holding time of 2.1ks. Thermal conductivity of the diamond-Cu composite containing 43.2 vol. % diamond increases with increasing relative packing density, reaching a maximum (654W/mK) at a relative packing density of 99.2%. This thermal conductivity is 83% the theoretical value estimated by Maxwell-Eucken equation. The coefficient of thermal expansion of the composites falls in the upper line of Kerner’s model, indicating strong bonding between the diamond particle and the Cu matrix in the composite.

Thermal Conductivity of Cubic Boron Nitride (cBN) Particle Dispersed Al Matrix Composites Fabricated by SPS

2016 ◽  
Vol 879 ◽  
pp. 2413-2418 ◽  
Author(s):  
Kiyoshi Mizuuchi ◽  
Kanryu Inoue ◽  
Yasuyuki Agari ◽  
Motohiro Tanaka ◽  
Takashi Takeuchi ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Volume Fraction ◽  
Cubic Boron Nitride ◽  
Matrix Composites ◽  
Plasma Sintering ◽  
Spark Plasma ◽  
Al Matrix Composites ◽  
Al Matrix Composite ◽  
Al Matrix

Cubic boron nitride (cBN) particle-dispersed-aluminum (Al) matrix composites were fabricated from the powder mixture composed of cBN, pure Al and Al-5mass% Si alloy in liquid and solid co-existent state by spark plasma sintering (SPS) process. Al/cBN composites were well consolidated by heating at a temperature range between 798 K and 876 K for 1.56 ks by SPS. Microstructures of the composites produced were examined by scanning electron microscopy and the reaction between the cBN particle and the Al matrix was not detected. The relative packing density of the Al/cBN composite was higher than 99 % in a volume fraction range of cBN up to 45 %. The thermal conductivity of the composite increased with increasing the cBN content in the composite in a volume fraction range of cBN between 35 and 45 vol. %. The highest thermal conductivity of 305 W/mK was obtained for Al matrix composite containing 45 vol.% cBN particles.

scholarly journals Development of Graphene Reinforced Metal Matrix Composite by Spark Plasma Sintering

2018 ◽  
Vol 7 (3.32) ◽  
pp. 76
Author(s):  
Fei Gao ◽  
Yongbum Choi ◽  
Yosuke Dobashi ◽  
Kazuhiro Matsugi
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Spark Plasma Sintering ◽  
High Performance ◽  
Volume Fraction ◽  
Applied Pressure ◽  
Ceramic Particle ◽  
Plasma Sintering ◽  
Spark Plasma ◽  
Dispersed Aluminum

In order to obtain the high performance materials with high thermal conductivity, high　electrical conductivity, low thermal expansion, good mechanical properties and low density, Graphene has higher thermal conductivity comparison with other ceramic particle. In this study, graphene dispersed aluminum (Al) composites was developed by spark plasma sintering. Volume fraction of graphene were 10, 20 and 30 vol.%. Fabrication conditions of graphene dispersed aluminum (Al) composites were temperature of 813K and applied pressure of 80 MPa. As composite properties are affected by the dispersibility and volume fraction of the graphene particles, the relationship among the dispersibility of dispersant and the thermal conductivity and mechanical properties was investigated.  

Thermal conductivity and microstructure of Al/diamond composites with Ti-coated diamond particles consolidated by spark plasma sintering

2011 ◽  
Vol 46 (9) ◽  
pp. 1127-1136 ◽  
Author(s):  
Xuebing Liang ◽  
Chengchang Jia ◽  
Ke Chu ◽  
Hui Chen ◽  
Junhui Nie ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Spark Plasma Sintering ◽  
Volume Fraction ◽  
Theoretical Calculations ◽  
Interfacial Bonding ◽  
Titanium Coating ◽  
Diamond Particles ◽  
Plasma Sintering ◽  
The Matrix ◽  
Spark Plasma

Metal/diamond composites have been considered as the new generation of thermal management material. The critical challenge to obtain composites with high thermal conductivity (TC) is to improve the interfacial bonding between the matrix and diamond. In the present study, a titanium coating was plated on the surface of diamond particles via vacuum evaporation–deposition, and Al/diamond composites were consolidated by spark plasma sintering (SPS) technique. The TC and microstructure of composites, respectively, with coated and uncoated diamond particles are compared and discussed. The results show that the Ti coating can significantly increase the wetting property between Al and diamond, leading to a strong interfacial bonding. The diffusion of Ti into the matrix and the formation of TiC are detected at the Al–diamond interface. The properties of composites, respectively, with coated and uncoated diamond exhibit different trends with increasing sintering temperature or diamond volume fraction. Compared with composites with uncoated particles, the Al/Ti–diamond composites obtained the much higher relative density and TC as high as 491 W/mK. Based on the comparison between the experimental and theoretical values, it is found that the thermal conductivities of Al/Ti–diamond composites have reached or surpassed the theoretical calculations with the particle volume fraction not more than 50%.

Structural and Thermal Properties of Hot Pressed Cu/C Matrix Composites Materials Used for the Thermal Management of High Power Electronic Devices

2007 ◽  
Vol 534-536 ◽  
pp. 1505-1508 ◽  
Author(s):  
Pierre Marie Geffroy ◽  
Jean François Silvain
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Carbon Fibers ◽  
Volume Fraction ◽  
Coefficient Of Thermal Expansion ◽  
Copper Matrix ◽  
Matrix Composites ◽  
Porosity Level ◽  
Materials Used ◽  
Short Carbon

In order to obtain materials for electronic applications that exhibit both excellent thermal conductivity and low coefficient of thermal expansion (CTE), copper matrix composites have been reinforced by short high modulus graphite fibers. The lack of fiber/matrix interaction prevents any degradation of the carbon reinforcement during the elaboration steps and the normal use of these materials. Elaboration conditions, such as mixing conditions of the short carbon fibers and the copper powder, dimension and shape of the two powders, and finally densification atmosphere, temperature, pressure and time, have been optimized. Main parameters involved in the thermal properties of the Cu/C composite materials have been analyzed and adjusted. CTE is mainly related with the carbon volume fraction; CTE ranging from 9 to 13 10-6/°C can be reproductively obtained with carbon volume fraction ranging from 50% to 20%. Thermal conductivity properties are more complex and are linked mainly with 1) the porosity level inside the material, and 2) the orientation, properties and volume fraction of the carbon fibers. For short carbon fibers, in plane thermal conductivity ranging from 200 to 550 W/mK have been reproductively measured associated with thermal conductivity through-thickness ranging from 150 to 300 W/mK.

Preparation and Properties of ZrB2-Cu Composites by Spark Plasma Sintering

2012 ◽  
Vol 512-515 ◽  
pp. 739-743 ◽  
Author(s):  
S.Z. Zhu ◽  
D.L. Gong ◽  
Z. Fang ◽  
Q. Xu
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Relative Density ◽  
Spark Plasma Sintering ◽  
Volume Fraction ◽  
Sintering Temperature ◽  
High Electrical Conductivity ◽  
Particulate Reinforcement ◽  
Plasma Sintering ◽  
Spark Plasma

For high thermal conductivity and high electrical conductivity, copper is a good electrode material. The wearing resistance and spark resistance of Cu can be improved with the addition of ZrB2. ZrB2-Cu composites with high Cu volume fraction was successfully prepared by spark plasma sintering (SPS) process in this paper. The microstructure and properties of the sintered samples were characterized. The effect of the sintering temperature and the ZrB2 content in composites on the relative density and properties of the composites were investigated. The results show that the relative density and mechanical properties increase with the sintering temperature increasing. The optimum sintering temperature is 900 °C for 10wt.% ZrB2-Cu, 1000 °C for 20wt.% ZrB2-Cu and 1050 °C for 30wt.% ZrB2-Cu. With the ZrB2 content in composites increasing from 10wt.% to 30 wt.%, the electrical resistivity increases from 2.25×10-6 Ω.cm to 8.82×10-6 Ω.cm, the flexural strength decreases from to 539.1 MPa to 482.2 MPa and the fracture toughness decreases from to 15 MPa.m 1/2 to 9 MPa.m 1/2. The hardness (HV) of ZrB2-Cu composites is significantly enhanced by the ZrB2 particulate reinforcement, increasing from 1410 MPa for 10 wt.% ZrB2 to 2480 MPa for 30wt.% ZrB2.

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