EXPERIMENTAL INVESTIGATION OF PLANTED PIN FIN IN PLATE FIN HEAT SINK FOR ELECTRONICS COOLING

2016 ◽  
Vol 13 (2) ◽  
pp. 143-160
Author(s):  
M. Vijayakumar ◽  
P. Navaneethakrishnan ◽  
R. Mohan
2019 ◽  
Vol 155 ◽  
pp. 546-562 ◽  
Author(s):  
Vishwjeet Choudhary ◽  
Manoj Kumar ◽  
Anil Kumar Patil

2021 ◽  
pp. 299-299
Author(s):  
Rajasekaran Madhaiyan ◽  
Kannan Thannir Pandal Palayam Kandasamy ◽  
Kumaragurubaran Balasubramanian ◽  
Mohan Raman

The thermal performance of heat sinks with variable area straight fins with and without PCM is quantitatively explored in this article. The effects of diverse fin geometries (constant area straight fin, variable area straight fin, circular pin fin, hemispherical pin fin, and elliptical pin fin), varying Reynolds numbers, and fin densities on boosting electronics cooling performance were investigated. The goal of this research is to develop the best fin geometry for electronics cooling technologies. This research demonstrates that altering fin density can improve heat sink thermal performance while also reducing heat sink weight. The base temperature of the heat sink is found to be lower in variable area straight fins. In comparison to alternative configurations for heat transfer with PCM, the results show that variable area straight fin heat sinks are the most effective. The thermal resistance of the improved heat sink with variable fin density was reduced by 9%.


2017 ◽  
Vol 48 (4) ◽  
pp. 309-318
Author(s):  
J. Ganesh Murali ◽  
Subrahmanya S. Katte

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