Development of a distributed system for transport control within the framework of the IEC 61499 standard

2021 ◽  
Author(s):  
D. M. Elkin ◽  
V.V. Vyatkin
2012 ◽  
Vol 220-223 ◽  
pp. 2672-2677
Author(s):  
Tomas Bezak ◽  
Maximilian Stremy

When creating distributed control systems, we can choose one of two possible approaches based on IEC 61131 and IEC 61499 standards. The first of them has been used for a long time in the PLC sphere, but it does not directly support the creation of extensive distributed systems. The second of the standards, IEC 61499, offers a direct solution for distributed system creation. The truth is that it is a new standard, which is why it is supported by only a few device manufacturers. This raises the question of which approach and which standard is more effective and suitable for individual system designing.


2021 ◽  
Vol 15 ◽  
pp. 123-129
Author(s):  
Federico Pérez ◽  
Isidro Calvo ◽  
Fabian López ◽  
Ismael Etxeberria‐Agiriano

Traditional approaches for developing automation systems consider system itself hardly can be changed. Current challenges in automation applications include the need of autoreconfiguration in response to process changes or event triggering. In order to face these requirements, new automation methodologies are necessary. Component-based technologies, initially defined for achieving efficient, structured and reusable designs can also be used to achieve adaptation. In this work, an IEC 61499-based framework that uses the concept to deal with reconfiguration issues is presented. The final output of the framework is a distributed system IEC61499 compliant. A new concept, the communication channel, is introduced providing a new abstraction layer to deal with communication between components. The joint use of automation components and communication channels allows defining complex automation systems in an easy way.


2011 ◽  
Vol 1 (10) ◽  
pp. 81-82
Author(s):  
Chhaya Nayak ◽  
◽  
Deepak Tomar

1996 ◽  
Vol 451 ◽  
Author(s):  
T. P. Moffat

ABSTRACTA variety of Cu/(Ni, Co) multilayers have been grown on Cu single crystals by pulse plating from an alloy electroplating bath. Copper is deposited under mass transport control while the iron group metal is deposited under interfacial charge transfer control. The structural evolution of these films is influenced by the morphological instability of the mass transport limited copper deposition reaction and the development of growth twins during iron-group metal deposition. Specular films have been obtained for growth on Cu(100) while rough, defective films were typically obtained for growth on Cu(111) and Cu(110).


2004 ◽  
Vol 36 (10) ◽  
pp. 51-55 ◽  
Author(s):  
Rasim Magamed ogly Alguliev ◽  
Ramiz Magamed ogly Aliguliev ◽  
Rashid Kurbanali ogly Alekperov

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