scholarly journals Electrochemical behavior of Ni-Ti alloy electrode and its application to the amperometric detection of sugars.

1998 ◽  
Vol 47 (10) ◽  
pp. 665-672 ◽  
Author(s):  
Ji-Ye JIN ◽  
Tomoo MIWA
2017 ◽  
Vol 249 ◽  
pp. 135-144 ◽  
Author(s):  
Joanna Michalska ◽  
Maciej Sowa ◽  
Robert P. Socha ◽  
Wojciech Simka ◽  
Beata Cwalina

MEMBRANE ◽  
2002 ◽  
Vol 27 (3) ◽  
pp. 145-150 ◽  
Author(s):  
Osamu Igarashi ◽  
Masayuki Uto ◽  
Sadanobu Inoue ◽  
Suwaru Hoshi ◽  
Toshitsugu Sugawara ◽  
...  

Author(s):  
Chang-Mei Ye ◽  
◽  
Shi-Lin Jiang ◽  
Ya-Lan Liu ◽  
Kai Xu ◽  
...  

RSC Advances ◽  
2016 ◽  
Vol 6 (24) ◽  
pp. 20276-20285 ◽  
Author(s):  
Amany M. Fekry

A novel nano-composite film coat of organic/inorganic composition including chitosan (CS), TiO2 nanoparticles (TO) and hydroxyapatite (HA) nanoparticles, was synthesized on a Ti–6Al–4V alloy surface.


2006 ◽  
Vol 16 (5) ◽  
pp. 1092-1096 ◽  
Author(s):  
Jin-zhao HUANG ◽  
Zheng XU ◽  
Hai-ling LI ◽  
Guo-hu KANG ◽  
Wen-jing WANG

Author(s):  
Naresh N. Thadhani ◽  
Thad Vreeland ◽  
Thomas J. Ahrens

A spherically-shaped, microcrystalline Ni-Ti alloy powder having fairly nonhomogeneous particle size distribution and chemical composition was consolidated with shock input energy of 316 kJ/kg. In the process of consolidation, shock energy is preferentially input at particle surfaces, resulting in melting of near-surface material and interparticle welding. The Ni-Ti powder particles were 2-60 μm in diameter (Fig. 1). About 30-40% of the powder particles were Ni-65wt% and balance were Ni-45wt%Ti (estimated by EMPA).Upon shock compaction, the two phase Ni-Ti powder particles were bonded together by the interparticle melt which rapidly solidified, usually to amorphous material. Fig. 2 is an optical micrograph (in plane of shock) of the consolidated Ni-Ti alloy powder, showing the particles with different etching contrast.


Author(s):  
J. Liu ◽  
N. D. Theodore ◽  
D. Adams ◽  
S. Russell ◽  
T. L. Alford ◽  
...  

Copper-based metallization has recently attracted extensive research because of its potential application in ultra-large-scale integration (ULSI) of semiconductor devices. The feasibility of copper metallization is, however, limited due to its thermal stability issues. In order to utilize copper in metallization systems diffusion barriers such as titanium nitride and other refractory materials, have been employed to enhance the thermal stability of copper. Titanium nitride layers can be formed by annealing Cu(Ti) alloy film evaporated on thermally grown SiO2 substrates in an ammonia ambient. We report here the microstructural evolution of Cu(Ti)/SiO2 layers during annealing in NH3 flowing ambient.The Cu(Ti) films used in this experiment were prepared by electron beam evaporation onto thermally grown SiO2 substrates. The nominal composition of the Cu(Ti) alloy was Cu73Ti27. Thermal treatments were conducted in NH3 flowing ambient for 30 minutes at temperatures ranging from 450°C to 650°C. Cross-section TEM specimens were prepared by the standard procedure.


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